Armen Kteyan
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Semiconductor Devices and Circuit Design
Papers in
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- Electronic Packaging and Soldering Technologies 19
- 3D IC and TSV technologies 15
- Semiconductor materials and devices 15
- Integrated Circuits and Semiconductor Failure Analysis 3
- Advancements in Photolithography Techniques 3
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- Copper Interconnects and Reliability 17
- Co-authors
- Valeriy Sukharev (30 shared papers)Xin Huang (2 shared papers)Ehrenfried Zschech (9 shared papers)Sheldon X.-D. Tan (1 shared paper)William D. Nix (2 shared papers)Farid N. Najm (5 shared papers)Sandeep Chatterjee (2 shared papers)R. Huebner (2 shared papers)
- Journals
- IEEE Transactions on Device and Materials Reliability (5 papers)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2 papers)Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena (2 papers)Thin Solid Films (1 paper)Microelectronic Engineering (1 paper)
- Partner nations
- United StatesGermanyFrance
In The Last Decade
Armen Kteyan
29 papers receiving 297 citations
Peers
Comparison fields: 5 of 18
- Electronic, Optical and Magnetic Materials 204
- Electrical and Electronic Engineering 286
- Hardware and Architecture 11
- Mechanics of Materials 32
- Atomic and Molecular Physics, and Optics 22
Countries citing papers authored by Armen Kteyan
This map shows the geographic impact of Armen Kteyan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Armen Kteyan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Armen Kteyan more than expected).
Fields of papers citing papers by Armen Kteyan
This network shows the impact of papers produced by Armen Kteyan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Armen Kteyan. The network helps show where Armen Kteyan may publish in the future.
Co-authors
The 25 scholars most cited alongside Armen Kteyan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 69 | |
| 2 | 2015 | 50 | |
| 3 | 2009 | 41 | |
| 4 | 2021 | 20 | |
| 5 | 2012 | 16 | |
| 6 | 2011 | 11 | |
| 7 | 2020 | 8 | |
| 8 | 2010 | 8 | |
| 9 | 2021 | 8 | |
| 10 | 2016 | 7 | |
| 11 | 2014 | 7 | |
| 12 | 2017 | 6 | |
| 13 | 2017 | 5 | |
| 14 | 2017 | 5 | |
| 15 | 2017 | 5 | |
| 16 | 2022 | 4 | |
| 17 | 2007 | 4 | |
| 18 | 2019 | 4 | |
| 19 | 2012 | 3 | |
| 20 | 2020 | 3 |
About Armen Kteyan
Armen Kteyan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Materials Chemistry and Mechanics of Materials, having authored 32 papers that have together received 298 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), Copper Interconnects and Reliability (17 papers), 3D IC and TSV technologies (15 papers), Semiconductor materials and devices (15 papers), Advanced Surface Polishing Techniques (5 papers), Metal and Thin Film Mechanics (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Advancements in Photolithography Techniques (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (204 citations), Electrical and Electronic Engineering (286 citations), Hardware and Architecture (11 citations), Mechanics of Materials (32 citations) and Atomic and Molecular Physics, and Optics (22 citations). Armen Kteyan has collaborated with scholars based in United States, Germany and France. Frequent co-authors include Valeriy Sukharev, Xin Huang, Ehrenfried Zschech, Sheldon X.-D. Tan, William D. Nix, Farid N. Najm, Sandeep Chatterjee, R. Huebner, S. Moreau and Riko Radojcic. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena, Thin Solid Films and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.