A. Shah

405 total citations
17 papers, 324 citations indexed

About

A. Shah is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, A. Shah has authored 17 papers receiving a total of 324 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. Recurrent topics in A. Shah's work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (13 papers) and Advanced Welding Techniques Analysis (11 papers). A. Shah is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (13 papers) and Advanced Welding Techniques Analysis (11 papers). A. Shah collaborates with scholars based in Canada, Germany and India. A. Shah's co-authors include M. Mayer, Y. Zhou, J.T. Moon, Javed Ahmad, Kumar Avinash Bharati, Madhu Sharma, H. Reichl, Ali Reza Rezvani, Martin Schneider‐Ramelow and Ivy Qin and has published in prestigious journals such as Journal of Applied Physics, Journal of Ethnopharmacology and Journal of Physics D Applied Physics.

In The Last Decade

A. Shah

17 papers receiving 309 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
A. Shah Canada	10	222	116	52	49	31	17	324
Jiaxu Yao China	15	342 1.5×	164 1.4×	10 0.2×	14 0.3×	37 1.2×	40	640
Ashish Kumar India	9	144 0.6×	46 0.4×	17 0.3×	43 0.9×	29 0.9×	42	293
Hailian Wei China	11	28 0.1×	282 2.4×	269 5.2×	77 1.6×	38 1.2×	23	455
Xiao Cao China	13	257 1.2×	94 0.8×	17 0.3×	133 2.7×	6 0.2×	19	511
Seung‐Chan Park South Korea	11	256 1.2×	44 0.4×	5 0.1×	18 0.4×	6 0.2×	49	396
In-Bae Kim South Korea	9	40 0.2×	217 1.9×	36 0.7×	4 0.1×	10 0.3×	49	410
Fan‐Fan Wang China	13	36 0.2×	103 0.9×	77 1.5×	33 0.7×	9 0.3×	40	359
Samia Cunningham United Kingdom	8	50 0.2×	67 0.6×	63 1.2×	51 1.0×	189 6.1×	14	377
Ruoyu Shi China	11	44 0.2×	27 0.2×	39 0.8×	12 0.2×	36 1.2×	22	351

Countries citing papers authored by A. Shah

Since Specialization

Citations

This map shows the geographic impact of A. Shah's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Shah with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Shah more than expected).

Fields of papers citing papers by A. Shah

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. Shah. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Shah. The network helps show where A. Shah may publish in the future.

Co-authorship network of co-authors of A. Shah

This figure shows the co-authorship network connecting the top 25 collaborators of A. Shah. A scholar is included among the top collaborators of A. Shah based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. Shah. A. Shah is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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17 of 17 papers shown

Shah, A., Kumar Avinash Bharati, Javed Ahmad, & Madhu Sharma. (2015). New ethnomedicinal claims from Gujjar and Bakerwals tribes of Rajouri and Poonch districts of Jammu and Kashmir, India. Journal of Ethnopharmacology. 166. 119–128. 70 indexed citations

Shah, A., et al.. (2015). Medicinal shrubs used by Gujjar-Bakerwal tribes against various non-communicable diseases in Rajouri district, (J&K), India. 5 indexed citations

Rezvani, Ali Reza, A. Shah, M. Mayer, Y. Zhou, & J.T. Moon. (2013). Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectronics Reliability. 53(7). 1002–1008. 12 indexed citations

Rezvani, Ali Reza, et al.. (2011). Free-air ball formation and deformability with Pd coated Cu wire. 1516–1522. 15 indexed citations

Huang, Yan, A. Shah, M. Mayer, Y. Zhou, & John Persic. (2010). Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding. IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control. 57(1). 241–252. 3 indexed citations

Shah, A., Ali Reza Rezvani, M. Mayer, et al.. (2010). Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectronics Reliability. 51(1). 67–74. 25 indexed citations

Shah, A., et al.. (2010). Ultrasonic friction power during thermosonic Au and Cu ball bonding. Journal of Physics D Applied Physics. 43(32). 325301–325301. 9 indexed citations

Qin, Ivy, et al.. (2010). Role of process parameters on bondability and pad damage indicators in copper ball bonding. Microelectronics Reliability. 51(1). 60–66. 18 indexed citations

Qin, Ivy, et al.. (2010). Thermosonic Au ball bonding process investigated using microsensor and laser vibrometer. 1776–1782. 3 indexed citations

10.

Shah, A., et al.. (2009). Low-Stress Thermosonic Copper Ball Bonding. IEEE Transactions on Electronics Packaging Manufacturing. 32(3). 176–184. 35 indexed citations

11.

Shah, A., et al.. (2009). Ultrasonic friction power during Al wire wedge-wedge bonding. J. Appl. Phys. 106, 013503 1-013503 8. 4 indexed citations

12.

Shah, A., et al.. (2009). The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor. Microelectronic Engineering. 87(4). 537–542. 18 indexed citations

13.

Qin, Ivy, et al.. (2009). Effect of process parameters on pad damage during Au and Cu ball bonding processes. 26. 573–578. 7 indexed citations

14.

Shah, A., et al.. (2009). Ultrasonic friction power during Al wire wedge-wedge bonding. Journal of Applied Physics. 106(1). 29 indexed citations

15.

Shah, A., M. Mayer, Y. Zhou, John Persic, & J.T. Moon. (2009). Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding. 22. 10–15. 8 indexed citations

16.

Shah, A., et al.. (2008). Reduction of underpad stress in thermosonic copper ball bonding. 2123–2130. 14 indexed citations

17.

Shah, A., et al.. (2008). In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding. Microelectronic Engineering. 85(9). 1851–1857. 49 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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