John Persic

569 total citations
33 papers, 460 citations indexed

About

John Persic is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, John Persic has authored 33 papers receiving a total of 460 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 8 papers in Mechanical Engineering. Recurrent topics in John Persic's work include Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (12 papers) and Electrostatic Discharge in Electronics (5 papers). John Persic is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (12 papers) and Electrostatic Discharge in Electronics (5 papers). John Persic collaborates with scholars based in Canada, China and Vietnam. John Persic's co-authors include Y. Zhou, Anming Hu, M. Mayer, John Z. Wen, J.T. Moon, Robert Liang, Jeff Wang, Sophie Ringuette, C.J. Hang and A. Shah and has published in prestigious journals such as Chemical Physics Letters, Review of Scientific Instruments and Journal of Physics and Chemistry of Solids.

In The Last Decade

John Persic

31 papers receiving 441 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
John Persic Canada	13	277	150	134	121	53	33	460
Dario Grochla Germany	11	132 0.5×	231 1.5×	71 0.5×	134 1.1×	24 0.5×	19	360
Shubhra Bansal United States	12	466 1.7×	345 2.3×	123 0.9×	37 0.3×	40 0.8×	40	604
Kun‐Dar Li Taiwan	7	137 0.5×	176 1.2×	48 0.4×	53 0.4×	25 0.5×	24	344
Qiuyuan Feng China	6	271 1.0×	254 1.7×	81 0.6×	93 0.8×	51 1.0×	16	397
Dong-Hee Yeon South Korea	15	368 1.3×	290 1.9×	136 1.0×	36 0.3×	30 0.6×	22	613
Ruxia Song China	15	308 1.1×	246 1.6×	167 1.2×	156 1.3×	54 1.0×	23	461
N. Rajasekaran India	13	220 0.8×	258 1.7×	87 0.6×	49 0.4×	41 0.8×	35	447
S. Kailasa Ganapathi India	10	334 1.2×	341 2.3×	121 0.9×	103 0.9×	11 0.2×	24	544
Qiyue Yin United States	11	196 0.7×	191 1.3×	123 0.9×	13 0.1×	54 1.0×	21	401
I. Shao United States	10	287 1.0×	245 1.6×	65 0.5×	62 0.5×	78 1.5×	17	400

Countries citing papers authored by John Persic

Since Specialization

Citations

This map shows the geographic impact of John Persic's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Persic with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Persic more than expected).

Fields of papers citing papers by John Persic

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John Persic. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Persic. The network helps show where John Persic may publish in the future.

Co-authorship network of co-authors of John Persic

This figure shows the co-authorship network connecting the top 25 collaborators of John Persic. A scholar is included among the top collaborators of John Persic based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John Persic. John Persic is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Cao, Jun, et al.. (2025). Simulation of intergranular crack extension at Cu/Al wire bonding interface. Microelectronics Reliability. 166. 115595–115595.

An, Bin, et al.. (2024). Simulation study on the effect of palladium layer thickness and temperature on the bonding properties of palladium coated copper wire. Microelectronics Reliability. 162. 115515–115515. 4 indexed citations

Cao, Jun, et al.. (2024). Experimental study on spheroidal morphology of palladium coated copper wire with different palladium layer thickness. APL Materials. 12(10).

An, Bin, et al.. (2023). A Review of Silver Wire Bonding Techniques. Micromachines. 14(11). 2129–2129. 4 indexed citations

Cao, Jun, Junchao Zhang, John Persic, & Kexing Song. (2020). Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire. Micromachines. 11(8). 777–777. 9 indexed citations

Xu, Di, et al.. (2015). Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization. IMAPSource Proceedings. 2015(1). 298–304. 2 indexed citations

Wen, John Z., Sophie Ringuette, Anming Hu, et al.. (2013). Characterization of thermochemical properties of Al nanoparticle and NiO nanowire composites. Nanoscale Research Letters. 8(1). 184–184. 35 indexed citations

Mayer, M., et al.. (2013). Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application. Journal of Electronic Packaging. 135(2). 2 indexed citations

Liang, Robert, Anming Hu, John Persic, & Y. Zhou. (2013). Palladium Nanoparticles Loaded on Carbon Modified TiO2 Nanobelts for Enhanced Methanol Electrooxidation. Nano-Micro Letters. 5(3). 6 indexed citations

10.

Wen, John Z., et al.. (2013). Thermo-chemical characterization of a Al nanoparticle and NiO nanowire composite modified by Cu powder. Thermochimica Acta. 572. 51–58. 21 indexed citations

11.

Mayer, M., et al.. (2013). Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(12). 2029–2036. 12 indexed citations

12.

Persic, John, et al.. (2012). Low cost Pd coated Ag bonding wire for high quality FAB in air. 1103–1109. 21 indexed citations

13.

Wang, Jeff, Anming Hu, John Persic, John Z. Wen, & Y. Zhou. (2011). Thermal stability and reaction properties of passivated Al/CuO nano-thermite. Journal of Physics and Chemistry of Solids. 72(6). 620–625. 47 indexed citations

14.

Huang, Yan, A. Shah, M. Mayer, Y. Zhou, & John Persic. (2010). Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding. IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control. 57(1). 241–252. 3 indexed citations

15.

Hu, Anming, et al.. (2010). Molecular dynamics simulation of energetic aluminum/palladium core–shell nanoparticles. Chemical Physics Letters. 503(1-3). 112–117. 26 indexed citations

16.

Mayer, M., et al.. (2010). Symmetric miniaturized heating system for active microelectronic devices. Review of Scientific Instruments. 81(7). 75112–75112. 5 indexed citations

17.

Shah, A., Ali Reza Rezvani, M. Mayer, et al.. (2010). Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectronics Reliability. 51(1). 67–74. 25 indexed citations

18.

Mayer, M., et al.. (2010). Influence of gold pick up on the hardness of copper free air ball. Microelectronics Reliability. 51(1). 30–37. 4 indexed citations

19.

Mayer, M., J.T. Moon, & John Persic. (2009). Measuring stress next to Au ball bond during high temperature aging. Microelectronics Reliability. 49(7). 771–781. 14 indexed citations

20.

Lee, Jaesik, M. Mayer, Y. Zhou, & John Persic. (2008). Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding. MATERIALS TRANSACTIONS. 49(10). 2347–2353. 12 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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