J. Leib

565 total citations
25 papers, 121 citations indexed

About

J. Leib is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Spectroscopy. According to data from OpenAlex, J. Leib has authored 25 papers receiving a total of 121 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 8 papers in Atomic and Molecular Physics, and Optics and 4 papers in Spectroscopy. Recurrent topics in J. Leib's work include 3D IC and TSV technologies (6 papers), Atomic and Subatomic Physics Research (5 papers) and Quantum, superfluid, helium dynamics (4 papers). J. Leib is often cited by papers focused on 3D IC and TSV technologies (6 papers), Atomic and Subatomic Physics Research (5 papers) and Quantum, superfluid, helium dynamics (4 papers). J. Leib collaborates with scholars based in Germany, France and Slovakia. J. Leib's co-authors include Michael J. Topper, G. Eska, Ha-Duong Ngo, К. Flachbart, C. J. Adkins, V. Seidemann, Jon Reast, V. Pavlı́k, M. Huebner and Martín Lange and has published in prestigious journals such as physica status solidi (b), Microelectronics Reliability and Journal of Low Temperature Physics.

In The Last Decade

J. Leib

20 papers receiving 114 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J. Leib Germany	8	94	27	20	13	9	25	121
S. Hegde United States	6	139 1.5×	22 0.8×	27 1.4×	42 3.2×	14 1.6×	17	182
Zijian Wang China	6	63 0.7×	33 1.2×	8 0.4×	17 1.3×	13 1.4×	23	99
Buddhi Tilakaratne United States	7	40 0.4×	83 3.1×	24 1.2×	12 0.9×	11 1.2×	9	123
L. Pinzelli France	5	102 1.1×	39 1.4×	17 0.8×	9 0.7×	26 2.9×	12	109
C. Wu Taiwan	4	47 0.5×	29 1.1×	23 1.1×	9 0.7×	11 1.2×	5	75
A. Upham United States	5	89 0.9×	21 0.8×	16 0.8×	9 0.7×	35 3.9×	6	106
D. Blachier France	7	145 1.5×	23 0.9×	33 1.6×	18 1.4×	12 1.3×	23	156
H.-B. Schilling Germany	4	46 0.5×	33 1.2×	9 0.5×	20 1.5×	13 1.4×	8	80
Sydney Young United States	2	23 0.2×	55 2.0×	13 0.7×	13 1.0×	12 1.3×	4	79
P. Mortini France	10	335 3.6×	50 1.9×	12 0.6×	12 0.9×	21 2.3×	33	343

Countries citing papers authored by J. Leib

Since Specialization

Citations

This map shows the geographic impact of J. Leib's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Leib with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Leib more than expected).

Fields of papers citing papers by J. Leib

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Leib. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Leib. The network helps show where J. Leib may publish in the future.

Co-authorship network of co-authors of J. Leib

This figure shows the co-authorship network connecting the top 25 collaborators of J. Leib. A scholar is included among the top collaborators of J. Leib based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Leib. J. Leib is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Zhao, Dawei, et al.. (2025). On the validity of rainflow counting-based lifetime assessment for power electronics assembly. Microelectronics Reliability. 168. 115651–115651.

Guiot, Eric, et al.. (2024). SiC engineered substrate: increasing SiC MOSFETs current density from device to module level. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 210–214.

Guiot, Eric, F. Allibert, J. Leib, et al.. (2023). Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device through the Use of SmartSiC<sup>TM</sup> Substrate. Materials science forum. 1092. 201–207. 3 indexed citations

Guiot, Eric, et al.. (2023). Improved Power Cycling Reliability through the use of SmartSiC ™ Engineered Substrate for Power Devices. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1 indexed citations

Zhao, Dawei, et al.. (2023). Influence of SiC chip thickness on the power cycling capability of power electronics assemblies – A comprehensive numerical study. Microelectronics Reliability. 150. 115091–115091. 4 indexed citations

Ngo, Ha-Duong & J. Leib. (2009). Wafer Level Packaging Technology for Optical Imaging Sensors. Procedia Chemistry. 1(1). 17–20. 7 indexed citations

Leib, J., et al.. (2009). Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation. Procedia Chemistry. 1(1). 76–79. 8 indexed citations

Seidemann, V., et al.. (2007). Wafer-Level Glass Capping as Drop-in for Miniaturized, Advanced Optical COB Packaging. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 2316. 600–604. 1 indexed citations

Leib, J., et al.. (2007). Via Interconnections for Wafer Level Packaging: Impact of Tapered Via Shape and Via Geometry on Product Yield and Reliability. 858–863. 4 indexed citations

10.

Ngo, Ha-Duong, V. Seidemann, Martín Lange, et al.. (2006). Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications. Journal of Physics Conference Series. 34. 271–276. 20 indexed citations

11.

Leib, J., et al.. (2005). Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature Passivation. 562–565. 9 indexed citations

12.

Lo, C. C. H., et al.. (2002). Evaluation of the effects of pulsed magnetic field treatment on magnetic materials. ORCA Online Research @Cardiff.

13.

Hutchison, W. D., et al.. (1998). NMRON studies of MnBr2$$\cdot $$4H2O in applied magnetic fields. Hyperfine Interactions. 116(1-4). 83–89. 1 indexed citations

14.

Flachbart, К., et al.. (1998). Conduction Mechanism in RuO2-Based Thick Films. physica status solidi (b). 205(1). 399–404. 16 indexed citations

15.

Huebner, M., et al.. (1996). Specific heat experiments on Ga single crystals at millikelvin temperatures. Czechoslovak Journal of Physics. 46(S4). 2197–2198. 1 indexed citations

16.

Leib, J., et al.. (1996). Non-linear ultrasonic absorption in normal and superfluid3He. Czechoslovak Journal of Physics. 46(S1). 55–56.

17.

Bäuerle, Christopher, Yu. M. Bunkov, S. N. Fisher, et al.. (1995). Field dependence of the magnetization of adsorbed3He films at ultra low temperatures. Journal of Low Temperature Physics. 101(3-4). 457–462. 4 indexed citations

18.

Huebner, M., et al.. (1995). Field and excitation dependent ultrasonic attenuation in3He-B. Journal of Low Temperature Physics. 101(3-4). 767–773. 2 indexed citations

19.

Leib, J., et al.. (1995). NMR-investigations on thallium-samples of high spin-polarization. Journal of Low Temperature Physics. 101(1-2). 253–258. 4 indexed citations

20.

Leib, J., et al.. (1980). Die Abwanderung spanischer Arbeitnehmer in die Bundesrepublik Deutschland. Umfang, Ursachen, Herkunfts- und Zielgebiete. Erdkunde. 34(3). 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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