D. Temple
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Thin-Film Transistor Technologies
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- Copper Interconnects and Reliability
Papers in ⓘ
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- 3D IC and TSV technologies 47
- Electronic Packaging and Soldering Technologies 32
- Semiconductor materials and devices 31
- Thin-Film Transistor Technologies 14
- Advanced Semiconductor Detectors and Materials 10
- Integrated Circuits and Semiconductor Failure Analysis 9
- Co-authors
- Jay Lewis (16 shared papers)Erik Vick (19 shared papers)Arnold Reisman (17 shared papers)Sonia Grego (8 shared papers)Matthew Lueck (33 shared papers)Babu Chalamala (5 shared papers)Alan Huffman (21 shared papers)Chris Gregory (17 shared papers)
- Journals
- Journal of The Electrochemical Society (16 papers)Journal of Applied Physics (4 papers)Applied Physics Letters (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Sensors (2 papers)
- Partner nations
- United StatesGermanyIndia
In The Last Decade
D. Temple
130 papers receiving 1.9k citations
Peers
Comparison fields: 5 of 115
- Electrical and Electronic Engineering 1.4k
- Electronic, Optical and Magnetic Materials 238
- Materials Chemistry 588
- Structural Biology 16
- Biomedical Engineering 464
Countries citing papers authored by D. Temple
This map shows the geographic impact of D. Temple's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Temple with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Temple more than expected).
Fields of papers citing papers by D. Temple
This network shows the impact of papers produced by D. Temple. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Temple. The network helps show where D. Temple may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Temple, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 138 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 223 | |
| 2 | 1999 | 170 | |
| 3 | 1989 | 107 | |
| 4 | 2020 | 76 | |
| 5 | 2005 | 62 | |
| 6 | 1998 | 56 | |
| 7 | 2006 | 52 | |
| 8 | 2016 | 50 | |
| 9 | 1995 | 45 | |
| 10 | 2015 | 44 | |
| 11 | 2020 | 44 | |
| 12 | 1995 | 38 | |
| 13 | 2009 | 36 | |
| 14 | 2006 | 36 | |
| 15 | Soluble immune mediators in POEMS syndrome with pulmonary hypertension: case report and review of the literature. | 1999 | 30 |
| 16 | 2011 | 29 | |
| 17 | 2010 | 29 | |
| 18 | 2004 | 29 | |
| 19 | 2011 | 29 | |
| 20 | 2012 | 28 |
About D. Temple
D. Temple is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials, having authored 138 papers that have together received 1.9k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (47 papers), Electronic Packaging and Soldering Technologies (32 papers), Semiconductor materials and devices (31 papers), Thin-Film Transistor Technologies (14 papers), Advanced Semiconductor Detectors and Materials (10 papers), Silicon Nanostructures and Photoluminescence (10 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers) and Additive Manufacturing and 3D Printing Technologies (9 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Electronic, Optical and Magnetic Materials (238 citations), Materials Chemistry (588 citations), Structural Biology (16 citations) and Biomedical Engineering (464 citations). D. Temple has collaborated with scholars based in United States, Germany and India. Frequent co-authors include Jay Lewis, Erik Vick, Arnold Reisman, Sonia Grego, Matthew Lueck, Babu Chalamala, Alan Huffman, Chris Gregory, Dean Malta and Christopher W. Gregory. Their work appears in journals such as Journal of The Electrochemical Society, Journal of Applied Physics, Applied Physics Letters, IEEE Transactions on Components Packaging and Manufacturing Technology and Sensors.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.