H. Berg

683 total citations
28 papers, 500 citations indexed

About

H. Berg is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, H. Berg has authored 28 papers receiving a total of 500 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 6 papers in Mechanical Engineering. Recurrent topics in H. Berg's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers) and Electrostatic Discharge in Electronics (4 papers). H. Berg is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers) and Electrostatic Discharge in Electronics (4 papers). H. Berg collaborates with scholars based in United States. H. Berg's co-authors include J. B. Cohen, Gary L. Lewis, W. M. Paulson, C. A. Mitchell, G. Ganesan, M. Mahalingam, Tien T. Tsong, David L. Shealy, Jay Liu and Thomas A. Anderson and has published in prestigious journals such as IEEE Transactions on Electron Devices, Materials Chemistry and Physics and Journal of Electronic Materials.

In The Last Decade

H. Berg

27 papers receiving 454 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
H. Berg United States	12	381	140	114	79	60	28	500
G. Matijasevic United States	10	465 1.2×	198 1.4×	77 0.7×	51 0.6×	73 1.2×	27	539
Y.T. Yeow Australia	17	456 1.2×	112 0.8×	160 1.4×	125 1.6×	103 1.7×	60	666
Harumichi Sato Japan	13	300 0.8×	97 0.7×	125 1.1×	96 1.2×	99 1.6×	53	517
L. Boyer France	12	245 0.6×	168 1.2×	188 1.6×	124 1.6×	220 3.7×	33	532
Bruce Geil United States	15	360 0.9×	97 0.7×	42 0.4×	63 0.8×	54 0.9×	41	492
Ender Savrun United States	11	237 0.6×	123 0.9×	106 0.9×	182 2.3×	49 0.8×	40	467
P. Louis France	11	124 0.3×	78 0.6×	97 0.9×	116 1.5×	92 1.5×	24	342
I. Turlik United States	15	381 1.0×	142 1.0×	48 0.4×	52 0.7×	30 0.5×	35	464
P. A. Totta United States	11	660 1.7×	319 2.3×	78 0.7×	74 0.9×	117 1.9×	22	761
Aicha Elshabini United States	11	342 0.9×	78 0.6×	55 0.5×	144 1.8×	31 0.5×	39	476

Countries citing papers authored by H. Berg

Since Specialization

Citations

This map shows the geographic impact of H. Berg's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Berg with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Berg more than expected).

Fields of papers citing papers by H. Berg

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Berg. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Berg. The network helps show where H. Berg may publish in the future.

Co-authorship network of co-authors of H. Berg

This figure shows the co-authorship network connecting the top 25 collaborators of H. Berg. A scholar is included among the top collaborators of H. Berg based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Berg. H. Berg is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Lewis, Gary L., et al.. (2002). Role of materials evolution in VLSI plastic packages in improving reflow soldering performance. 21. 177–185. 10 indexed citations

Mahalingam, M., et al.. (2002). Thermal performance limits of the QFP family. 166–175. 11 indexed citations

Berg, H., et al.. (2002). Thermal sensitivity analysis for the 119 PBGA-a framework for rapid prototyping. 12. 28–37. 8 indexed citations

Lewis, Gary L., et al.. (2002). Organic contamination in IC package assembly and it's impact on interfacial integrity. 68–70. 7 indexed citations

Berg, H., et al.. (2002). Model and analyses for solder reflow cracking phenomenon in SMT plastic packages. 653–660. 11 indexed citations

Lewis, Gary L., et al.. (1996). Level 1 crackfree plastic packaging technology. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 19(3). 581–584. 9 indexed citations

Mahalingam, M., et al.. (1994). Thermal performance limits of the QFP family. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 17(4). 573–582. 19 indexed citations

Berg, H., et al.. (1987). Micro-Corrosion of Al-Cu Bonding Pads. IEEE Transactions on Components Hybrids and Manufacturing Technology. 10(2). 252–257. 26 indexed citations

Shealy, David L. & H. Berg. (1983). Simulation of optical coupling from surface emitting LEDs. Applied Optics. 22(11). 1722–1722. 8 indexed citations

10.

Escher, J. S., et al.. (1982). Junction-current-confinement planar light-emitting diodes and optical coupling into large-core diameter fibers using lenses. IEEE Transactions on Electron Devices. 29(9). 1463–1469. 7 indexed citations

11.

Berg, H., Gary L. Lewis, & C. A. Mitchell. (1981). A High Performance Connectorized LED Package for Fiber Optics. IEEE Transactions on Components Hybrids and Manufacturing Technology. 4(4). 337–344. 6 indexed citations

12.

Berg, H. & W. M. Paulson. (1980). Chip corrosion in plastic packages. Microelectronics Reliability. 20(3). 247–263. 19 indexed citations

13.

Mitchell, C. A. & H. Berg. (1979). Thermal Studies of a Plastic Dual-in-Line Package. IEEE Transactions on Components Hybrids and Manufacturing Technology. 2(4). 500–511. 11 indexed citations

14.

Berg, H., et al.. (1978). Enhancing Ultrasonic Bond Development. IEEE Transactions on Components Hybrids and Manufacturing Technology. 1(3). 211–219. 53 indexed citations

15.

Berg, H., et al.. (1976). Investigation of GaAs]-x_x P crystals using the pseudo-kossel X-ray and photoluminescence techniques. Journal of Electronic Materials. 5(1). 37–56. 4 indexed citations

16.

Berg, H., et al.. (1975). Effects of Intermetallics on the Reliability of Tin Coated Cu, Ag, and Ni Parts. Reliability physics. 80–86. 22 indexed citations

17.

Berg, H., et al.. (1974). The Pseudo-Kossel Technique in Back Reflection as a Tool for Measuring Strains. Advances in X-ray Analysis. 18. 454–465. 4 indexed citations

18.

Berg, H., et al.. (1973). Dissolution Rates and Reliability Effects of Au, Ag, Ni and Cu in Lead Base Solders. Reliability physics. 10–20. 10 indexed citations

19.

Berg, H., Tien T. Tsong, & J. B. Cohen. (1973). Local atomic arrangements in partially ordered CoPt3—II. field-ion microscopy. Acta Metallurgica. 21(12). 1589–1599. 13 indexed citations

20.

Berg, H. & J. B. Cohen. (1972). Long-range order and ordering kinetics in CoPt3. Metallurgical Transactions. 3(7). 1797–1805. 58 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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