Guoyuan Li
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Biomedical Engineering
- Mechanical Engineering
- Mechanics of Materials
- Topics
- Electronic Packaging and Soldering Technologies (23 papers)3D IC and TSV technologies (11 papers)Thin-Film Transistor Technologies (8 papers)
In The Last Decade
Guoyuan Li
44 papers receiving 534 citations
Peers
Comparison fields: 5 of 63
- Electrical and Electronic Engineering 370
- Materials Chemistry 154
- Biomedical Engineering 139
- Mechanical Engineering 132
- Mechanics of Materials 69
Countries citing papers authored by Guoyuan Li
This map shows the geographic impact of Guoyuan Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guoyuan Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guoyuan Li more than expected).
Fields of papers citing papers by Guoyuan Li
This network shows the impact of papers produced by Guoyuan Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guoyuan Li. The network helps show where Guoyuan Li may publish in the future.
Co-authorship network of co-authors of Guoyuan Li
This figure shows the co-authorship network connecting the top 25 collaborators of Guoyuan Li. A scholar is included among the top collaborators of Guoyuan Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guoyuan Li. Guoyuan Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 23 | |
| 3 | 9 | |
| 4 | 3 | |
| 5 | 5 | |
| 6 | 2 | |
| 7 | 14 | |
| 8 | 2 | |
| 9 | 33 | |
| 10 | 12 | |
| 11 | 14 | |
| 12 | 21 | |
| 13 | 3 | |
| 14 | 1 | |
| 15 | 4 | |
| 16 | 2 | |
| 17 | 1 | |
| 18 | 1 | |
| 19 | 9 | |
| 20 | 18 |
About Guoyuan Li
Guoyuan Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science, having authored 51 papers that have together received 548 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (11 papers) and Thin-Film Transistor Technologies (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (370 citations), General Materials Science (15 citations) and Mechanical Engineering (132 citations). Guoyuan Li has collaborated with scholars based in China, Hong Kong and Singapore. Frequent co-authors include Rongsheng Chen, Bin Li, Wei Zhong, Linfeng Lan, Li Ren, Jinyan Liu, Sunbin Deng, Hoi Sing Kwok, Qunfeng Liu and Heng Gu. Their work appears in journals such as Scientific Reports, Chemical Engineering Journal and Acta Biomaterialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.