Tong Hong Wang
- Mechanics of Materials top 10%
- Metal and Thin Film Mechanics 6
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- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 22
- Electromagnetic Compatibility and Noise Suppression 9
- Silicon Carbide Semiconductor Technologies 9
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- Probabilistic and Robust Engineering Design 5
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- Diamond and Carbon-based Materials Research 5
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- Advanced Surface Polishing Techniques 6
Tong Hong Wang
44 papers receiving 515 citations
Peers
Comparison fields: 5 of 65
- Mechanics of Materials 156
- Electrical and Electronic Engineering 289
- Mechanical Engineering 142
- Statistics, Probability and Uncertainty 21
- Materials Chemistry 119
Countries citing papers authored by Tong Hong Wang
This map shows the geographic impact of Tong Hong Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tong Hong Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tong Hong Wang more than expected).
Fields of papers citing papers by Tong Hong Wang
This network shows the impact of papers produced by Tong Hong Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tong Hong Wang. The network helps show where Tong Hong Wang may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Tong Hong Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 2 | |
| 2 | 2012 | 13 | |
| 3 | 2011 | 26 | |
| 4 | 2010 | 4 | |
| 5 | 2009 | 8 | |
| 6 | 2008 | 4 | |
| 7 | 2008 | 5 | |
| 8 | 2008 | 11 | |
| 9 | 2008 | 1 | |
| 10 | 2007 | 14 | |
| 11 | 2007 | 3 | |
| 12 | 2007 | 13 | |
| 13 | 2006 | 9 | |
| 14 | 2006 | 23 | |
| 15 | 2005 | 7 | |
| 16 | 2005 | 10 | |
| 17 | 2005 | 7 | |
| 18 | 2004 | 5 | |
| 19 | 2004 | 12 | |
| 20 | 2004 | 17 |
About Tong Hong Wang
Tong Hong Wang is a scholar working on Statistics, Probability and Uncertainty, Electrical and Electronic Engineering and Mechanics of Materials, having authored 47 papers that have together received 535 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers), Electromagnetic Compatibility and Noise Suppression (9 papers), Silicon Carbide Semiconductor Technologies (9 papers), Metal and Thin Film Mechanics (6 papers), Advanced Surface Polishing Techniques (6 papers), Diamond and Carbon-based Materials Research (5 papers) and Probabilistic and Robust Engineering Design (5 papers). The work is most often cited by research in Mechanics of Materials (156 citations), Electrical and Electronic Engineering (289 citations) and Mechanical Engineering (142 citations). Tong Hong Wang has collaborated with scholars based in Taiwan, United States and Greece. Frequent co-authors include Yi‐Shao Lai, Te‐Hua Fang, Chang-Chi Lee, Yi-Shao Lai, Ming‐Hwa R. Jen, Yu‐Jen Hsiao, Cheng‐Chia Yu, Pei‐Ling Hsieh, Shao-Hui Kang and Ming‐Yi Lu. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Science and Nanotechnology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.