Myung Jin Yim

1.1k total citations
43 papers, 827 citations indexed

About

Myung Jin Yim is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Myung Jin Yim has authored 43 papers receiving a total of 827 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 6 papers in Mechanics of Materials. Recurrent topics in Myung Jin Yim's work include Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (31 papers) and Molecular Junctions and Nanostructures (7 papers). Myung Jin Yim is often cited by papers focused on Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (31 papers) and Molecular Junctions and Nanostructures (7 papers). Myung Jin Yim collaborates with scholars based in United States and South Korea. Myung Jin Yim's co-authors include Kyung W. Paik, C.P. Wong, Yi Li, Kyoung‐sik Moon, Jin-Sang Hwang, Kyung‐Wook Paik, Da‐Yuan Shih, Wooseok Choi, S. K. Kang and Kyoung‐Sik Moon and has published in prestigious journals such as Applied Physics Letters, Materials Science and Engineering B and International Journal of Adhesion and Adhesives.

In The Last Decade

Myung Jin Yim

40 papers receiving 783 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Myung Jin Yim United States 15 673 234 180 123 118 43 827
Kyung-Wook Paik South Korea 13 507 0.8× 168 0.7× 173 1.0× 68 0.6× 139 1.2× 37 721
Juil Yoon South Korea 13 171 0.3× 195 0.8× 156 0.9× 72 0.6× 103 0.9× 21 475
Guoyuan Li China 15 370 0.5× 139 0.6× 132 0.7× 47 0.4× 69 0.6× 51 548
Kunmo Chu South Korea 13 360 0.5× 333 1.4× 183 1.0× 183 1.5× 36 0.3× 34 770
Chang‐Su Woo South Korea 9 236 0.4× 210 0.9× 128 0.7× 214 1.7× 93 0.8× 40 539
Seung‐Yeol Jeon South Korea 14 253 0.4× 204 0.9× 162 0.9× 165 1.3× 73 0.6× 38 694
Raghuram V. Pucha United States 13 206 0.3× 146 0.6× 159 0.9× 140 1.1× 153 1.3× 47 560
Giulia Lanzara Italy 14 148 0.2× 289 1.2× 138 0.8× 141 1.1× 164 1.4× 44 623
Matthieu Mulle Saudi Arabia 14 238 0.4× 265 1.1× 223 1.2× 237 1.9× 225 1.9× 21 673
Kyung Su Kim South Korea 14 384 0.6× 136 0.6× 52 0.3× 66 0.5× 83 0.7× 47 615

Countries citing papers authored by Myung Jin Yim

Since Specialization
Citations

This map shows the geographic impact of Myung Jin Yim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Myung Jin Yim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Myung Jin Yim more than expected).

Fields of papers citing papers by Myung Jin Yim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Myung Jin Yim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Myung Jin Yim. The network helps show where Myung Jin Yim may publish in the future.

Co-authorship network of co-authors of Myung Jin Yim

This figure shows the co-authorship network connecting the top 25 collaborators of Myung Jin Yim. A scholar is included among the top collaborators of Myung Jin Yim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Myung Jin Yim. Myung Jin Yim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Joo, Kisu, et al.. (2017). Package-Level EMI Shielding Technology with Silver Paste for Various Applications. 1736–1741. 17 indexed citations
2.
Yim, Myung Jin, et al.. (2012). Effect of Nano-Particles on Heterogeneous Void Nucleation in No-Flow Underfill Materials. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(7). 1059–1063. 4 indexed citations
3.
Yim, Myung Jin, et al.. (2010). Effects of material properties on PoP top package warpage behaviors. 12 indexed citations
4.
Lee, Sangil, Myung Jin Yim, & Daniel F. Baldwin. (2009). Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill. Journal of Electronic Packaging. 131(3). 11 indexed citations
5.
Lee, Sangil, Myung Jin Yim, R.N. Master, C.P. Wong, & D.F. Baldwin. (2009). Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill. IEEE Transactions on Electronics Packaging Manufacturing. 32(2). 106–114. 6 indexed citations
6.
Zhang, Rongwei, Yi Li, Myung Jin Yim, et al.. (2009). Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $\pi$-Conjugated Self-Assembled Molecular Wire Junctions. IEEE Transactions on Components and Packaging Technologies. 32(3). 677–683. 9 indexed citations
7.
Yim, Myung Jin, et al.. (2009). Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage. 75–81. 3 indexed citations
8.
Raj, P. Markondeya, et al.. (2008). Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill. IEEE Transactions on Electronics Packaging Manufacturing. 31(4). 341–354. 6 indexed citations
9.
Yim, Myung Jin, Yi Li, Kyoung‐sik Moon, Kyung W. Paik, & C.P. Wong. (2008). Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging. Journal of Adhesion Science and Technology. 22(14). 1593–1630. 141 indexed citations
10.
11.
Lee, Sang-Il, Myung Jin Yim, R.N. Master, C.P. Wong, & Daniel F. Baldwin. (2008). Void Formation Study of Flip Chip in Package Using No-Flow Underfill. IEEE Transactions on Electronics Packaging Manufacturing. 31(4). 297–305. 19 indexed citations
12.
Li, Yi, Myung Jin Yim, & C.P. Wong. (2007). High Performance Nonconductive Film with π-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications. Journal of Electronic Materials. 36(5). 549–554. 7 indexed citations
13.
14.
Yim, Myung Jin & Kyung W. Paik. (2006). Review of Electrically Conductive Adhesive Technologies for Electronic Packaging. Electronic Materials Letters. 2(3). 183–194. 21 indexed citations
15.
16.
Yim, Myung Jin, Jin-Sang Hwang, & Kyung W. Paik. (2006). Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications. International Journal of Adhesion and Adhesives. 27(1). 77–84. 65 indexed citations
17.
Hwang, Jung-Hoon, Myung Jin Yim, & Kyung W. Paik. (2006). Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates. Journal of Electronic Materials. 35(9). 1722–1727. 14 indexed citations
18.
Yim, Myung Jin, et al.. (2005). Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications. IEEE Transactions on Components and Packaging Technologies. 28(4). 789–796. 26 indexed citations
19.
Kwon, Woocheol, et al.. (2004). Effects of Silica Filler and Diluent on Material Properties and Reliability of Nonconductive Pastes (NCPs) for Flip-Chip Applications. IEEE Transactions on Components and Packaging Technologies. 27(3). 608–615. 21 indexed citations
20.
Yim, Myung Jin, et al.. (2004). Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film. Journal of Electronic Materials. 33(1). 76–82. 24 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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