Eiichi Ide

1.2k citations
24 papers · 1.1k · h-index 13

Impact in

    • Electronic Packaging and Soldering Technologies
    • 3D IC and TSV technologies
    • Nanomaterials and Printing Technologies
    • Aluminum Alloys Composites Properties
    • Intermetallics and Advanced Alloy Properties
    • Injection Molding Process and Properties
    • Advanced Welding Techniques Analysis

Papers in

    • Electronic Packaging and Soldering Technologies 21
    • 3D IC and TSV technologies 11
    • Nanomaterials and Printing Technologies 6
    • Injection Molding Process and Properties 4
    • Intermetallics and Advanced Alloy Properties 4
    • Advanced Welding Techniques Analysis 2

Eiichi Ide

23 papers receiving 1.0k citations

Peers

Eiichi Ide
Comparison fields: 5 of 35
  • Electrical and Electronic Engineering 970
  • Mechanical Engineering 602
  • Atmospheric Science 137
  • Electronic, Optical and Magnetic Materials 80
  • Ceramics and Composites 21
Replace Daisuke Wakuda with:
Daisuke Wakuda Japan
Sezen Aksöz Türkiye
Dong-Hee Yeon South Korea
Vemal Raja Manikam Malaysia
L.A. Bendersky United States
D. Jaramillo-Vigueras Mexico
Feng Xiao China
Igal G. Rasin Israel
Natraj Yedla India
M. Kokonou Greece
Eiichi Ide relative to Daisuke Wakuda Japan Daisuke Wakuda's profile →
Citations per field
00.5×3.2×
Daisuke Wakuda · 1×
Citations per year

Countries citing papers authored by Eiichi Ide

Since Specialization
Citations

This map shows the geographic impact of Eiichi Ide's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eiichi Ide with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eiichi Ide more than expected).

Fields of papers citing papers by Eiichi Ide

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Eiichi Ide. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eiichi Ide. The network helps show where Eiichi Ide may publish in the future.

Co-authors

The 15 scholars most cited alongside Eiichi Ide, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Eiichi Ide Line = papers co-authored together Eiichi Ide links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown

Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.

#Work
1 2005415
2 2008125
3 2008100
4 200881
5 200656
6 200449
7 200943
8 200836
9 200928
10 201226
11 200919
12 200618
13 201017
14
200911
15 20129
16 20245
17
20065
18
20045
19 20054
20 20133

About Eiichi Ide

Eiichi Ide is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Atmospheric Science, Polymers and Plastics and Materials Chemistry, having authored 24 papers that have together received 1.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers), Nanomaterials and Printing Technologies (6 papers), nanoparticles nucleation surface interactions (6 papers), Injection Molding Process and Properties (4 papers), Intermetallics and Advanced Alloy Properties (4 papers), Advanced Welding Techniques Analysis (2 papers) and Synthesis and properties of polymers (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (970 citations), Mechanical Engineering (602 citations), Atmospheric Science (137 citations), Electronic, Optical and Magnetic Materials (80 citations) and Ceramics and Composites (21 citations). Eiichi Ide has collaborated with scholars based in Japan, United States and United Kingdom. Frequent co-authors include Akio Hirose, K. F. Kobayashi, Toshiaki Morita, Y. Yasuda, Kojiro F. Kobayashi, Hiroaki Tatsumi, Takuto Yamaguchi, Tomo Ogura, N. Takeda and Jiro Ushio. Their work appears in journals such as MATERIALS TRANSACTIONS, Science and Technology of Advanced Materials, Japanese Journal of Applied Physics, Journal of Nanoparticle Research and Acta Materialia.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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