Eiichi Ide

1.2k total citations
24 papers, 1.0k citations indexed

About

Eiichi Ide is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atmospheric Science. According to data from OpenAlex, Eiichi Ide has authored 24 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 6 papers in Atmospheric Science. Recurrent topics in Eiichi Ide's work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Nanomaterials and Printing Technologies (6 papers). Eiichi Ide is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Nanomaterials and Printing Technologies (6 papers). Eiichi Ide collaborates with scholars based in Japan, United Kingdom and United States. Eiichi Ide's co-authors include Akio Hirose, K. F. Kobayashi, Toshiaki Morita, Y. Yasuda, Kojiro F. Kobayashi, Hiroaki Tatsumi, Takuto Yamaguchi, Tomo Ogura, N. Takeda and Jiro Ushio and has published in prestigious journals such as Acta Materialia, Japanese Journal of Applied Physics and Journal of Nanoparticle Research.

In The Last Decade

Eiichi Ide

23 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Eiichi Ide Japan 13 964 598 134 125 94 24 1.0k
Daisuke Wakuda Japan 9 473 0.5× 189 0.3× 49 0.4× 72 0.6× 148 1.6× 13 558
Sezen Aksöz Türkiye 16 203 0.2× 359 0.6× 40 0.3× 278 2.2× 22 0.2× 52 529
Dong-Hee Yeon South Korea 15 368 0.4× 136 0.2× 24 0.2× 290 2.3× 89 0.9× 22 613
L.A. Bendersky United States 6 272 0.3× 194 0.3× 16 0.1× 110 0.9× 36 0.4× 6 418
Vemal Raja Manikam Malaysia 7 433 0.4× 225 0.4× 6 0.0× 82 0.7× 41 0.4× 12 508
Feng Xiao China 11 108 0.1× 142 0.2× 32 0.2× 109 0.9× 81 0.9× 42 353
Igal G. Rasin Israel 13 523 0.5× 88 0.1× 21 0.2× 155 1.2× 197 2.1× 22 706
M. Kokonou Greece 10 133 0.1× 85 0.1× 38 0.3× 208 1.7× 90 1.0× 20 353
D. Jaramillo-Vigueras Mexico 11 106 0.1× 115 0.2× 26 0.2× 216 1.7× 68 0.7× 34 370

Countries citing papers authored by Eiichi Ide

Since Specialization
Citations

This map shows the geographic impact of Eiichi Ide's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eiichi Ide with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eiichi Ide more than expected).

Fields of papers citing papers by Eiichi Ide

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Eiichi Ide. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eiichi Ide. The network helps show where Eiichi Ide may publish in the future.

Co-authorship network of co-authors of Eiichi Ide

This figure shows the co-authorship network connecting the top 25 collaborators of Eiichi Ide. A scholar is included among the top collaborators of Eiichi Ide based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Eiichi Ide. Eiichi Ide is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hibi, Yusuke, et al.. (2024). Decoding thermal properties in polymer-inorganic heat dissipators: a data-driven approach using pyrolysis mass spectrometry. Science and Technology of Advanced Materials. 25(1). 2362125–2362125. 4 indexed citations
2.
Yasuda, Y., et al.. (2013). Development of Bonding Technique Using Silver Oxide Particles for High Temperature Environment. Journal of The Japan Institute of Electronics Packaging. 16(6). 457–462. 1 indexed citations
3.
Yasuda, Y., Eiichi Ide, & Toshiaki Morita. (2013). Low-Temperature Bonding of Silver Derived from Silver–Oxide Particles to Nickel. MATERIALS TRANSACTIONS. 54(6). 1063–1065. 3 indexed citations
4.
Ogura, Tomo, et al.. (2012). Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using Ag2O Paste. Journal of Electronic Materials. 42(3). 507–515. 26 indexed citations
5.
Hirose, Akio, N. Takeda, Hiroaki Tatsumi, et al.. (2012). Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag<sub>2</sub>O for Packaging of High-Temperature Electronics. Materials science forum. 706-709. 2962–2967. 9 indexed citations
6.
Yasuda, Y., Eiichi Ide, & Toshiaki Morita. (2010). Evaluation of Copper Oxide-Based Interconnecting Materials. 3(1). 123–130. 17 indexed citations
7.
Morita, Toshiaki, Y. Yasuda, Eiichi Ide, & Akio Hirose. (2009). . Journal of The Japan Institute of Electronics Packaging. 12(2). 110–113. 11 indexed citations
8.
Hirose, Akio, Hiroaki Tatsumi, N. Takeda, et al.. (2009). A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag2O microparticles. Journal of Physics Conference Series. 165. 12074–12074. 43 indexed citations
9.
Yasuda, Y., Eiichi Ide, & Toshiaki Morita. (2009). Low-Temperature Bonding Using Silver Nanoparticles Stabilized by Short-Chain Alkylamines. Japanese Journal of Applied Physics. 48(12). 125004–125004. 27 indexed citations
10.
Tatsumi, Hiroaki, et al.. (2008). Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior. MATERIALS TRANSACTIONS. 49(7). 1537–1545. 122 indexed citations
11.
Morita, Toshiaki, et al.. (2008). Bonding Technique Using Micro-Scaled Silver-Oxide Particles for <I>In-Situ</I> Formation of Silver Nanoparticles. MATERIALS TRANSACTIONS. 49(12). 2875–2880. 81 indexed citations
12.
Morita, Toshiaki, Y. Yasuda, Eiichi Ide, & Akio Hirose. (2008). Direct Bonding to Aluminum with Silver-Oxide Microparticles. MATERIALS TRANSACTIONS. 50(1). 226–228. 36 indexed citations
13.
Morita, Toshiaki, Eiichi Ide, Y. Yasuda, Akio Hirose, & Kojiro F. Kobayashi. (2008). Study of Bonding Technology Using Silver Nanoparticles. Japanese Journal of Applied Physics. 47(8R). 6615–6615. 100 indexed citations
14.
Ide, Eiichi, Akio Hirose, & Kojiro F. Kobayashi. (2006). Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging. MATERIALS TRANSACTIONS. 47(1). 211–217. 56 indexed citations
15.
Ide, Eiichi, et al.. (2006). Bonding of Various Metals Using Ag Metallo-Organic Nanoparticles-A Novel Bonding Process Using Ag Metallo-Organic Nanoparticles-. Materials science forum. 512. 383–388. 18 indexed citations
16.
Ide, Eiichi, Akio Hirose, & Kojiro F. Kobayashi. (2005). Lead-Free Bonding Proess Using Ag Nanoparticles for High Temperature Packaging. Journal of the Society of Materials Science Japan. 54(10). 999–1004. 4 indexed citations
17.
18.
Hirose, Akio, Eiichi Ide, & Kojiro F. Kobayashi. (2004). . Journal of The Japan Institute of Electronics Packaging. 7(6). 511–515. 5 indexed citations
19.
Hirose, Akio, et al.. (2004). Joint strength and interfacial microstructure between Sn–Ag–Cu and Sn–Zn–Bi solders and Cu substrate. Science and Technology of Advanced Materials. 5(1-2). 267–276. 49 indexed citations
20.
Imamura, Takeshi, et al.. (2004). Investigation of the Interfacial Reaction between Sn-Zn-Bi Lead-Free Solder and Cu Electrode. Journal of The Japan Institute of Electronics Packaging. 7(1). 47–53. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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