Nicolas Heuck

425 total citations
17 papers, 350 citations indexed

About

Nicolas Heuck is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Nicolas Heuck has authored 17 papers receiving a total of 350 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 2 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Nicolas Heuck's work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (7 papers) and Silicon Carbide Semiconductor Technologies (6 papers). Nicolas Heuck is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (7 papers) and Silicon Carbide Semiconductor Technologies (6 papers). Nicolas Heuck collaborates with scholars based in Germany, Austria and Canada. Nicolas Heuck's co-authors include A. Waag, Andrej Stranz, Erwin Peiner, J. Kähler, Karsten Guth, Alexander Wagner, A. Bakin, N. Oeschler, R. Sittig and M. Thoben and has published in prestigious journals such as Microelectronics Reliability, Microsystem Technologies and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Nicolas Heuck

16 papers receiving 323 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Nicolas Heuck Germany	12	325	166	38	23	22	17	350
Michele Calabretta Italy	10	257 0.8×	106 0.6×	31 0.8×	28 1.2×	22 1.0×	65	326
S. Sakamoto Japan	6	360 1.1×	236 1.4×	27 0.7×	11 0.5×	38 1.7×	10	388
Wangyun Li China	8	250 0.8×	190 1.1×	67 1.8×	23 1.0×	19 0.9×	59	292
Aiji Suetake Japan	10	253 0.8×	162 1.0×	49 1.3×	32 1.4×	28 1.3×	32	294
Noriko Kagami Japan	4	298 0.9×	192 1.2×	58 1.5×	9 0.4×	38 1.7×	5	352
Serge Bontemps France	9	301 0.9×	131 0.8×	33 0.9×	35 1.5×	25 1.1×	21	355
Hiroaki Tatsumi Japan	12	387 1.2×	294 1.8×	56 1.5×	16 0.7×	42 1.9×	52	452
Chunjin Hang China	9	265 0.8×	207 1.2×	51 1.3×	27 1.2×	25 1.1×	22	317
Andreas Schletz Germany	12	515 1.6×	188 1.1×	141 3.7×	30 1.3×	40 1.8×	46	573
Alessandro Sitta Italy	9	185 0.6×	69 0.4×	24 0.6×	23 1.0×	16 0.7×	43	219

Countries citing papers authored by Nicolas Heuck

Since Specialization

Citations

This map shows the geographic impact of Nicolas Heuck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nicolas Heuck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nicolas Heuck more than expected).

Fields of papers citing papers by Nicolas Heuck

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Nicolas Heuck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nicolas Heuck. The network helps show where Nicolas Heuck may publish in the future.

Co-authorship network of co-authors of Nicolas Heuck

This figure shows the co-authorship network connecting the top 25 collaborators of Nicolas Heuck. A scholar is included among the top collaborators of Nicolas Heuck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nicolas Heuck. Nicolas Heuck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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17 of 17 papers shown

Thomas, Christian, et al.. (2024). Reliability and Failure Mechanisms of Direct Bonded Power Semiconductor Devices in Power Cycling Test. 506–509.

Heuck, Nicolas, et al.. (2023). Effect of Chip Metallization and Process Parameters on the Die Attach Properties of Direct Bonded Power Devices. 1682–1688. 1 indexed citations

Schulze, H., et al.. (2016). Reliability aspects of copper metallization and interconnect technology for power devices. Microelectronics Reliability. 64. 393–402. 15 indexed citations

Dohnke, Karl Otto, Karsten Guth, & Nicolas Heuck. (2016). History and Recent Developments of Packaging Technology for SiC Power Devices. Materials science forum. 858. 1043–1048. 6 indexed citations

Guth, Karsten, et al.. (2015). End-of-life investigation on the .XT interconnect technology. 1–8. 12 indexed citations

Heuck, Nicolas, et al.. (2015). Lifetime analysis of power modules with new packaging technologies. 321–324. 16 indexed citations

Heuck, Nicolas, et al.. (2014). Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling. 1–6. 27 indexed citations

Guth, Karsten, et al.. (2012). New assembly and interconnect technologies for power modules. 1–5. 46 indexed citations

Kähler, J., Nicolas Heuck, Alexander Wagner, et al.. (2012). Sintering of Copper Particles for Die Attach. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(10). 1587–1591. 69 indexed citations

10.

Kähler, J., et al.. (2011). Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach. European Microelectronics and Packaging Conference. 1–7. 26 indexed citations

11.

Kähler, J., Nicolas Heuck, Andrej Stranz, A. Waag, & Erwin Peiner. (2011). Pick-and-Place Silver Sintering Die Attach of Small-Area Chips. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(2). 199–207. 42 indexed citations

12.

Kähler, J., Andrej Stranz, Lutz Doering, et al.. (2011). Fabrication, packaging, and characterization of p-SOI Wheatstone bridges for harsh environments. Microsystem Technologies. 18(7-8). 869–878. 11 indexed citations

13.

Heuck, Nicolas, et al.. (2011). Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(11). 1846–1855. 36 indexed citations

14.

Heuck, Nicolas, et al.. (2010). SiC-Die-Attachment for High Temperature Applications. Materials science forum. 645-648. 741–744. 15 indexed citations

15.

Kähler, J., et al.. (2010). Die-attach for high-temperature applications using fineplacer-pressure-sintering (FPS). 1–5. 14 indexed citations

16.

Heuck, Nicolas, et al.. (2010). Development of a Wire-Bond Technology for SiC High Temperature Applications. Materials science forum. 645-648. 749–752. 2 indexed citations

17.

Heuck, Nicolas, et al.. (2010). Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(HITEC). 18–25. 12 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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