Nicolas Heuck
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
- Nanomaterials and Printing Technologies
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
Papers in
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- Electronic Packaging and Soldering Technologies 13
- 3D IC and TSV technologies 7
- Silicon Carbide Semiconductor Technologies 6
- Silicon and Solar Cell Technologies 2
-
- Aluminum Alloys Composites Properties 3
- Electrical Contact Performance and Analysis 2
- Injection Molding Process and Properties 2
- Co-authors
- A. Waag (9 shared papers)Andrej Stranz (7 shared papers)Erwin Peiner (5 shared papers)J. Kähler (5 shared papers)Karsten Guth (6 shared papers)Alexander Wagner (1 shared paper)A. Bakin (4 shared papers)N. Oeschler (3 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Microelectronics Reliability (1 paper)Microsystem Technologies (1 paper)Materials science forum (3 papers)European Microelectronics and Packaging Conference (1 paper)
In The Last Decade
Nicolas Heuck
16 papers receiving 328 citations
Peers
Comparison fields: 5 of 25
- Electrical and Electronic Engineering 327
- Mechanical Engineering 168
- Ceramics and Composites 21
- Electronic, Optical and Magnetic Materials 22
- Automotive Engineering 12
Countries citing papers authored by Nicolas Heuck
This map shows the geographic impact of Nicolas Heuck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nicolas Heuck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nicolas Heuck more than expected).
Fields of papers citing papers by Nicolas Heuck
This network shows the impact of papers produced by Nicolas Heuck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nicolas Heuck. The network helps show where Nicolas Heuck may publish in the future.
Co-authors
The 20 scholars most cited alongside Nicolas Heuck, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 73 | |
| 2 | New assembly and interconnect technologies for power modules | 2012 | 46 |
| 3 | 2011 | 42 | |
| 4 | 2011 | 36 | |
| 5 | Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling | 2014 | 27 |
| 6 | Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach | 2011 | 26 |
| 7 | 2016 | 16 | |
| 8 | 2015 | 16 | |
| 9 | 2010 | 15 | |
| 10 | 2010 | 14 | |
| 11 | 2010 | 12 | |
| 12 | End-of-life investigation on the .XT interconnect technology | 2015 | 12 |
| 13 | 2011 | 11 | |
| 14 | 2016 | 6 | |
| 15 | 2010 | 2 | |
| 16 | 2023 | 1 | |
| 17 | 2024 | 0 |
About Nicolas Heuck
Nicolas Heuck is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 17 papers that have together received 355 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (7 papers), Silicon Carbide Semiconductor Technologies (6 papers), Aluminum Alloys Composites Properties (3 papers), Electrical Contact Performance and Analysis (2 papers), Silicon and Solar Cell Technologies (2 papers), Semiconductor materials and interfaces (2 papers) and Injection Molding Process and Properties (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (327 citations), Mechanical Engineering (168 citations), Ceramics and Composites (21 citations), Electronic, Optical and Magnetic Materials (22 citations) and Automotive Engineering (12 citations). Nicolas Heuck has collaborated with scholars based in Germany, Austria and Canada. Frequent co-authors include A. Waag, Andrej Stranz, Erwin Peiner, J. Kähler, Karsten Guth, Alexander Wagner, A. Bakin, N. Oeschler, R. Sittig and M. Thoben. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Microsystem Technologies, Materials science forum and European Microelectronics and Packaging Conference.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.