Noriko Kagami

434 total citations
5 papers, 352 citations indexed

About

Noriko Kagami is a scholar working on Electrical and Electronic Engineering, Civil and Structural Engineering and Mechanical Engineering. According to data from OpenAlex, Noriko Kagami has authored 5 papers receiving a total of 352 indexed citations (citations by other indexed papers that have themselves been cited), including 4 papers in Electrical and Electronic Engineering, 2 papers in Civil and Structural Engineering and 2 papers in Mechanical Engineering. Recurrent topics in Noriko Kagami's work include Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Thermal Radiation and Cooling Technologies (2 papers). Noriko Kagami is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Thermal Radiation and Cooling Technologies (2 papers). Noriko Kagami collaborates with scholars based in Japan and Denmark. Noriko Kagami's co-authors include Katsuaki Suganuma, S. Sakamoto, Masaya Nogi, Daisuke Wakuda, Tohru Sugahara, Hao Zhang, Shijo Nagao, Jinting Jiu, Keiichi Ohata and Le Thanh Hung and has published in prestigious journals such as Journal of Materials Science, Materials Letters and Advanced Materials Technologies.

In The Last Decade

Noriko Kagami

5 papers receiving 345 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Noriko Kagami Japan	4	298	192	58	39	38	5	352
Hiroaki Tatsumi Japan	12	387 1.3×	294 1.5×	56 1.0×	19 0.5×	42 1.1×	52	452
Nicolas Heuck Germany	12	325 1.1×	166 0.9×	38 0.7×	22 0.6×	22 0.6×	17	350
Wangyun Li China	8	250 0.8×	190 1.0×	67 1.2×	8 0.2×	19 0.5×	59	292
Keith Sweatman Australia	10	279 0.9×	230 1.2×	67 1.2×	39 1.0×	19 0.5×	26	362
Xin Zhai China	9	117 0.4×	200 1.0×	193 3.3×	24 0.6×	22 0.6×	14	381
Chanyang Choe Japan	15	428 1.4×	294 1.5×	38 0.7×	12 0.3×	49 1.3×	22	488
Thomas G. Lei United States	8	493 1.7×	232 1.2×	52 0.9×	37 0.9×	52 1.4×	10	530
Hyun-Suk Chun South Korea	12	293 1.0×	223 1.2×	35 0.6×	19 0.5×	38 1.0×	20	352
Aiji Suetake Japan	10	253 0.8×	162 0.8×	49 0.8×	11 0.3×	28 0.7×	32	294
S. Sakamoto Japan	6	360 1.2×	236 1.2×	27 0.5×	25 0.6×	38 1.0×	10	388

Countries citing papers authored by Noriko Kagami

Since Specialization

Citations

This map shows the geographic impact of Noriko Kagami's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Noriko Kagami with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Noriko Kagami more than expected).

Fields of papers citing papers by Noriko Kagami

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Noriko Kagami. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Noriko Kagami. The network helps show where Noriko Kagami may publish in the future.

Co-authorship network of co-authors of Noriko Kagami

This figure shows the co-authorship network connecting the top 25 collaborators of Noriko Kagami. A scholar is included among the top collaborators of Noriko Kagami based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Noriko Kagami. Noriko Kagami is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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5 of 5 papers shown

1.

Sugahara, Tohru, et al.. (2020). Fabrication and Characterization of Ultra‐Lightweight, Compact, and Flexible Thermoelectric Device Based on Highly Refined Chip Mounting. Advanced Materials Technologies. 5(5). 16 indexed citations

2.

Sugahara, Tohru, Ngo Van Nong, Noriko Kagami, et al.. (2018). Fabrication with Semiconductor Packaging Technologies and Characterization of a Large‐Scale Flexible Thermoelectric Module. Advanced Materials Technologies. 4(2). 35 indexed citations

3.

Jiu, Jinting, Hao Zhang, Shijo Nagao, et al.. (2015). Die-attaching silver paste based on a novel solvent for high-power semiconductor devices. Journal of Materials Science. 51(7). 3422–3430. 68 indexed citations

4.

Sugahara, Tohru, et al.. (2015). Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding. Materials Letters. 151. 68–71. 2 indexed citations

5.

Suganuma, Katsuaki, et al.. (2011). Low-temperature low-pressure die attach with hybrid silver particle paste. Microelectronics Reliability. 52(2). 375–380. 231 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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