S. Sakamoto

464 total citations
10 papers, 388 citations indexed

About

S. Sakamoto is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, S. Sakamoto has authored 10 papers receiving a total of 388 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 1 paper in Mechanics of Materials. Recurrent topics in S. Sakamoto's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Aluminum Alloys Composites Properties (5 papers). S. Sakamoto is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Aluminum Alloys Composites Properties (5 papers). S. Sakamoto collaborates with scholars based in Japan. S. Sakamoto's co-authors include Katsuaki Suganuma, Daisuke Wakuda, Masaya Nogi, Noriko Kagami, Shijo Nagao, Tohru Sugahara, Koichi Maruyama, F. Takasaki, J. Haba and T. Sumiyoshi and has published in prestigious journals such as Materials Letters, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment and Microelectronics Reliability.

In The Last Decade

S. Sakamoto

10 papers receiving 382 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
S. Sakamoto Japan	6	360	236	38	27	27	10	388
Noriko Kagami Japan	4	298 0.8×	192 0.8×	38 1.0×	15 0.6×	58 2.1×	5	352
Hiroaki Tatsumi Japan	12	387 1.1×	294 1.2×	42 1.1×	10 0.4×	56 2.1×	52	452
B. Kempf Germany	9	167 0.5×	303 1.3×	11 0.3×	26 1.0×	84 3.1×	20	355
C. Y. Liu United States	7	355 1.0×	151 0.6×	178 4.7×	10 0.4×	27 1.0×	10	398
Wangyun Li China	8	250 0.7×	190 0.8×	19 0.5×	16 0.6×	67 2.5×	59	292
Zhong Sheng China	11	534 1.5×	476 2.0×	11 0.3×	11 0.4×	28 1.0×	15	575
O.V. Kozlova Russia	6	85 0.2×	189 0.8×	11 0.3×	113 4.2×	81 3.0×	19	298
Polina Snugovsky Canada	12	344 1.0×	212 0.9×	21 0.6×	4 0.1×	33 1.2×	30	372
J. K. Lin United States	6	606 1.7×	428 1.8×	54 1.4×	5 0.2×	30 1.1×	8	616
Flora Somidin Malaysia	10	316 0.9×	255 1.1×	14 0.4×	19 0.7×	54 2.0×	33	354

Countries citing papers authored by S. Sakamoto

Since Specialization

Citations

This map shows the geographic impact of S. Sakamoto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Sakamoto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Sakamoto more than expected).

Fields of papers citing papers by S. Sakamoto

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Sakamoto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Sakamoto. The network helps show where S. Sakamoto may publish in the future.

Co-authorship network of co-authors of S. Sakamoto

This figure shows the co-authorship network connecting the top 25 collaborators of S. Sakamoto. A scholar is included among the top collaborators of S. Sakamoto based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Sakamoto. S. Sakamoto is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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10 of 10 papers shown

1.

Sugahara, Tohru, et al.. (2015). Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding. Materials Letters. 151. 68–71. 2 indexed citations

2.

Nagao, Shijo, et al.. (2014). Pressure-less plasma sintering of Cu paste for SiC die-attach of high-temperature power device manufacturing. 1077–1079. 3 indexed citations

3.

Sakamoto, S., Shijo Nagao, & Katsuaki Suganuma. (2013). Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices. Journal of Materials Science Materials in Electronics. 24(7). 2593–2601. 62 indexed citations

4.

Sakamoto, S., Shijo Nagao, & Katsuaki Suganuma. (2013). Thermomechanical reliability of Ag flake paste for die-attached power devices in thermal cycling. 30. 1740–1745. 3 indexed citations

5.

Sakamoto, S., et al.. (2012). Thermo mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes. 1–2. 4 indexed citations

6.

Sakamoto, S., Tohru Sugahara, & Katsuaki Suganuma. (2012). Microstructural stability of Ag sinter joining in thermal cycling. Journal of Materials Science Materials in Electronics. 24(4). 1332–1340. 65 indexed citations

7.

Sakamoto, S. & Katsuaki Suganuma. (2011). Low temperature die-bonding with Ag flakes. European Microelectronics and Packaging Conference. 1–5. 8 indexed citations

8.

Suganuma, Katsuaki, et al.. (2011). Low-temperature low-pressure die attach with hybrid silver particle paste. Microelectronics Reliability. 52(2). 375–380. 231 indexed citations

9.

Sakamoto, S., et al.. (1996). Corrosion Property of API and Modified 13CR Steels in Oil and Gas Environment. 1–13. 5 indexed citations

10.

Haba, J., Nobuyuki Kanematsu, Y. Nagashima, et al.. (1988). A study of nonflammable gas mixtures for limited streamer tubes in the VENUS detector at TRISTAN. Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment. 265(3). 457–460. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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