Choong-Un Kim

571 total citations
29 papers, 460 citations indexed

About

Choong-Un Kim is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Choong-Un Kim has authored 29 papers receiving a total of 460 indexed citations (citations by other indexed papers that have themselves been cited), including 27 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 9 papers in Materials Chemistry. Recurrent topics in Choong-Un Kim's work include Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (8 papers) and Semiconductor materials and devices (7 papers). Choong-Un Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (8 papers) and Semiconductor materials and devices (7 papers). Choong-Un Kim collaborates with scholars based in United States, Indonesia and Finland. Choong-Un Kim's co-authors include Tae-Kyu Lee, Thomas R. Bieler, Ramkumar Subramanian, Seong Jin Koh, Vishva Ray, Hongtao Ma, Man‐Jong Lee, Puligandla Viswanadham, Jae-Yong Park and R. Augur and has published in prestigious journals such as Nano Letters, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Choong-Un Kim

28 papers receiving 444 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Choong-Un Kim United States 12 382 135 111 108 85 29 460
James G. Ryan United States 10 224 0.6× 39 0.3× 117 1.1× 142 1.3× 66 0.8× 25 352
Doo‐Jin Choi South Korea 11 347 0.9× 66 0.5× 291 2.6× 88 0.8× 27 0.3× 42 533
Michael Balinskiy United States 8 142 0.4× 34 0.3× 134 1.2× 152 1.4× 152 1.8× 19 386
Ippei Suzuki Japan 16 135 0.4× 86 0.6× 166 1.5× 311 2.9× 389 4.6× 45 602
V. N. Lepalovskij Russia 12 86 0.2× 159 1.2× 68 0.6× 228 2.1× 258 3.0× 70 389
Rafi Ud Din Pakistan 11 133 0.3× 115 0.9× 128 1.2× 57 0.5× 128 1.5× 45 346
Shenghao Yang Taiwan 10 519 1.4× 396 2.9× 87 0.8× 52 0.5× 22 0.3× 21 605
D. Z. Singapore 15 564 1.5× 27 0.2× 446 4.0× 83 0.8× 277 3.3× 44 791
B. Ebersberger Germany 11 436 1.1× 48 0.4× 118 1.1× 56 0.5× 256 3.0× 26 540

Countries citing papers authored by Choong-Un Kim

Since Specialization
Citations

This map shows the geographic impact of Choong-Un Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Choong-Un Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Choong-Un Kim more than expected).

Fields of papers citing papers by Choong-Un Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Choong-Un Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Choong-Un Kim. The network helps show where Choong-Un Kim may publish in the future.

Co-authorship network of co-authors of Choong-Un Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Choong-Un Kim. A scholar is included among the top collaborators of Choong-Un Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Choong-Un Kim. Choong-Un Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Choong-Un, et al.. (2016). Temperature-dependence of Threshold Current Density-Length Product in Metallization Lines: A Revisit. Journal of Physics Conference Series. 710. 12044–12044. 1 indexed citations
2.
Jung, Kyungeun, Jeong‐Won Lee, Young‐Min Kim, et al.. (2016). Influence of defects and nanoscale strain on the photovoltaic properties of CdS/CdSe nanocomposite co-sensitized ZnO nanowire solar cells. Electrochimica Acta. 220. 500–510. 18 indexed citations
3.
Lee, Tae-Kyu, Thomas R. Bieler, & Choong-Un Kim. (2015). Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects. Journal of Electronic Materials. 45(1). 172–181. 5 indexed citations
4.
Kim, Choong-Un, et al.. (2014). A Model-inspired Phenomenology Constitutive Equation for the Temperature-dependence of Flow Stress at Confined Dimension II. IOP Conference Series Materials Science and Engineering. 58. 12021–12021. 1 indexed citations
5.
Lee, Tae-Kyu, Thomas R. Bieler, Choong-Un Kim, & Hongtao Ma. (2014). Fundamentals of Lead-Free Solder Interconnect Technology. CERN Document Server (European Organization for Nuclear Research). 76 indexed citations
6.
7.
Kim, Choong-Un, et al.. (2013). Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing. JOM. 65(10). 1362–1373. 23 indexed citations
8.
Ryan, E. Todd, et al.. (2013). Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications. Applied Physics Letters. 102(22). 5 indexed citations
9.
Kim, Choong-Un, et al.. (2012). Misfit management for reduced dislocation formation in epitaxial quantum-dot-based devices. Journal of Crystal Growth. 364. 169–177. 2 indexed citations
10.
Kim, Choong-Un, et al.. (2009). Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size. Journal of Electronic Materials. 38(9). 1896–1905. 13 indexed citations
11.
Ray, Vishva, et al.. (2008). CMOS-compatible fabrication of room-temperature single-electron devices. Nature Nanotechnology. 3(10). 603–608. 68 indexed citations
12.
Kim, Choong-Un, et al.. (2007). Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell. Journal of Electronic Materials. 37(4). 429–438. 3 indexed citations
13.
Subramanian, Ramkumar, et al.. (2007). Electrostatic Funneling for Precise Nanoparticle Placement:  A Route to Wafer-Scale Integration. Nano Letters. 7(2). 439–445. 76 indexed citations
14.
Kim, Choong-Un, et al.. (2006). Study of pore structure and stability in porous low-k interconnects using electrolyte voltammetry. Applied Physics Letters. 88(26). 6 indexed citations
15.
16.
Park, Jae-Yong, et al.. (2003). Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy. Journal of Electronic Materials. 32(12). 1474–1482. 20 indexed citations
17.
Lee, Man‐Jong & Choong-Un Kim. (2001). Investigation on self-aligned HgTe nano-crystals induced by controlled precipitation in PbTe–HgTe quasi-binary compound semiconductor alloys. Physica B Condensed Matter. 304(1-4). 267–275. 7 indexed citations
18.
Kim, Choong-Un, et al.. (2001). Efficient electromigration testing with a single current source. Review of Scientific Instruments. 72(10). 3962–3967. 3 indexed citations
19.
Lee, Man‐Jong & Choong-Un Kim. (2001). Characterizations of HgTe nanocrystals induced by controlled precipitation in PbTe-4HgTe semiconductor alloys. MRS Proceedings. 676. 1 indexed citations
20.
Kim, Choong-Un, et al.. (2001). Electromigration in Cu thin films with Sn and Al cross strips. Journal of Applied Physics. 90(9). 4370–4376. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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