Fubin Song

405 total citations
31 papers, 315 citations indexed

About

Fubin Song is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Fubin Song has authored 31 papers receiving a total of 315 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. Recurrent topics in Fubin Song's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). Fubin Song is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). Fubin Song collaborates with scholars based in Hong Kong, United States and Greece. Fubin Song's co-authors include S. W. Ricky Lee, Stephen Clark, Chaoran Yang, Jeffery C. C. Lo, Mian Tao, Tong Jiang, Michael Osterman, Hailong Wu, Lei Nie and Michael Pecht and has published in prestigious journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Packaging.

In The Last Decade

Fubin Song

31 papers receiving 302 citations

Peers

Countries citing papers authored by Fubin Song

Since Specialization

Citations

This map shows the geographic impact of Fubin Song's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fubin Song with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fubin Song more than expected).

Fields of papers citing papers by Fubin Song

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fubin Song. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fubin Song. The network helps show where Fubin Song may publish in the future.

Co-authorship network of co-authors of Fubin Song

This figure shows the co-authorship network connecting the top 25 collaborators of Fubin Song. A scholar is included among the top collaborators of Fubin Song based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fubin Song. Fubin Song is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes 2013 ·Journal of Electronic Packaging ·Chaoran Yang, Fubin Song, S. W. Ricky Lee	2
2	Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints 2013 ·Microelectronics Reliability ·Chaoran Yang, Fubin Song, S. W. Ricky Lee	33
3	Development of innovative cold pin pull test method for solder pad crater evaluation 2012 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·(unknown), Chaoran Yang, Mian Tao, Fubin Song, S. W. Ricky Lee	7
4	Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests 2011 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Tong Jiang, (unknown), S. W. Ricky Lee, Fubin Song, Jeffery C. C. Lo, Chaoran Yang	3
5	Effect of interfacial strength between Cu<inf>6</inf>Sn<inf>5</inf> and Cu<inf>3</inf>Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish 2011 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Chaoran Yang, Fubin Song, S. W. Ricky Lee	7
6	Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling 2011 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·(unknown), Fubin Song, S. W. Ricky Lee	3
7	Comparative study of PWB pad cratering subject to reflow soldering and thermal impact 2010 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Chaoran Yang, Fubin Song, S. W. Ricky Lee, (unknown)	7
8	Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging 2010 ·IMAPSource Proceedings ·Tong Jiang, Fubin Song, Chaoran Yang, S. W. Ricky Lee	1
9	Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability 2009 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Hailong Wu, Fubin Song, Jeffery C. C. Lo, Tong Jiang, (unknown), S. W. Ricky Lee	8
10	Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages 2009 ·IEEE Transactions on Components and Packaging Technologies ·Lei Nie, Michael Osterman, Fubin Song, Jeffery C. C. Lo, S. W. Ricky Lee, Michael Pecht	13
11	Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis 2009 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, (unknown), Chaoran Yang, S. W. Ricky Lee	8
12	A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders 2008 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, Jeffery C. C. Lo, Jimmy K. S. Lam, Tong Jiang, S. W. Ricky Lee	5
13	Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests 2007 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, S. W. Ricky Lee, Stephen Clark, (unknown), (unknown)	8
14	Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests 2007 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, S. W. Ricky Lee, (unknown), (unknown), Stephen Clark	60
15	Comparison of Joint Strength and Fracture Energy of Lead-free Solder Balls in High Speed Ball Shear/Pull Tests and their Correlation with Board Level Drop Test 2007 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, S. W. Ricky Lee, (unknown), Stephen Clark, (unknown)	17
16	High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed 2007 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, S. W. Ricky Lee, (unknown), (unknown), Stephen Clark	60
17	Effect of Thermal Aging on High Speed Ball Shear and Pull Tests of SnAgCu Lead-free Solder Balls 2007 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, S. W. Ricky Lee, (unknown), (unknown), Stephen Clark, (unknown)	22
18	Isothermal Fatigue Tests Of Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints At 60oC 2006 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·John H. Lau, S. W. Ricky Lee, Fubin Song, David T. W. Lau, Dongkai Shangguan	2
19	Impact of IMC Thickness on Lead-free Solder Joint Reliability under Thermal Aging: Ball Shear Tests vs. Cold Bump Pull Tests 2006 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·S. W. Ricky Lee, Fubin Song	3
20	Experimental Investigation of the Effect of Reflow Cooling Rate on the IMC Growth of SAC Lead-Free Solder Alloy 2005 ·Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Fubin Song, S. W. Ricky Lee	3

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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