Michael Pecht
- Automotive Engineering top 0.01%
- Advanced Battery Technologies Research 195
- Safety, Risk, Reliability and Quality top 0.01%
- Reliability and Maintenance Optimization 136
- Control and Systems Engineering top 0.02%
- Fault Detection and Control Systems 98
- Machine Fault Diagnosis Techniques 86
- Electrical and Electronic Engineering top 0.05%
- Electronic Packaging and Soldering Technologies 244
- Advancements in Battery Materials 126
- 3D IC and TSV technologies 99
- Integrated Circuits and Semiconductor Failure Analysis 95
- Medical Laboratory Technology top 0.1%
- Co-authors
- Yinjiao XingMichael OstermanNicholas WilliardMichael H. AzarianKwok‐Leung TsuiRui XiongXiao HuYongzhi Zhang
- Journals
- Microelectronics Reliability (71 papers)IEEE Transactions on Components and Packaging Technologies (52 papers)IEEE Access (48 papers)
- Partner nations
- United StatesChinaHong Kong
In The Last Decade
Michael Pecht
1.0k papers receiving 37.8k citations
Hit Papers
Peers
Comparison fields: 5 of 194
- Automotive Engineering 15.7k
- Safety, Risk, Reliability and Quality 7.2k
- Control and Systems Engineering 10.6k
- Electrical and Electronic Engineering 21.6k
- Medical Laboratory Technology 436
Countries citing papers authored by Michael Pecht
This map shows the geographic impact of Michael Pecht's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Pecht with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Pecht more than expected).
Fields of papers citing papers by Michael Pecht
This network shows the impact of papers produced by Michael Pecht. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Pecht. The network helps show where Michael Pecht may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Michael Pecht, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 3 | |
| 2 | 2025 | 0 | |
| 3 | 2025 | 2 | |
| 4 | 2024 | 49 | |
| 5 | 2024 | 63 | |
| 6 | 2024 | 3 | |
| 7 | 2024 | 17 | |
| 8 | 2024 | 3 | |
| 9 | 2024 | 15 | |
| 10 | 2023 | 3 | |
| 11 | 2023 | 43 | |
| 12 | 2023 | 8 | |
| 13 | 2023 | 76 | |
| 14 | Advanced battery management strategies for a sustainable energy future: Multilayer design concepts and research trendsbreakdown → | 2020 | 307 |
| 15 | 2020 | 12 | |
| 16 | 2020 | 32 | |
| 17 | 2014 | 101 | |
| 18 | 2013 | 6 | |
| 19 | 2012 | 41 | |
| 20 | Role of Prognostics in Support of Integrated Risk-based Engineering - A Review in Respect of Nuclear Power Plant Safety | 2012 | 1 |
About Michael Pecht
Michael Pecht is a scholar working on Safety, Risk, Reliability and Quality, Automotive Engineering and Statistics, Probability and Uncertainty, having authored 1.0k papers that have together received 39.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (244 papers), Advanced Battery Technologies Research (195 papers), Reliability and Maintenance Optimization (136 papers), Advancements in Battery Materials (126 papers), 3D IC and TSV technologies (99 papers), Fault Detection and Control Systems (98 papers), Integrated Circuits and Semiconductor Failure Analysis (95 papers) and Machine Fault Diagnosis Techniques (86 papers). The work is most often cited by research in Automotive Engineering (15.7k citations), Safety, Risk, Reliability and Quality (7.2k citations) and Control and Systems Engineering (10.6k citations). Michael Pecht has collaborated with scholars based in United States, China and Hong Kong. Frequent co-authors include Yinjiao Xing, Michael Osterman, Nicholas Williard, Michael H. Azarian, Kwok‐Leung Tsui, Rui Xiong, Xiao Hu, Yongzhi Zhang, Hongwen He and Diganta Das. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies, IEEE Access, IEEE Transactions on Device and Materials Reliability and IEEE Transactions on Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.