Kuo-Chuan Liu

424 total citations
24 papers, 352 citations indexed

About

Kuo-Chuan Liu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Kuo-Chuan Liu has authored 24 papers receiving a total of 352 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 6 papers in Aerospace Engineering. Recurrent topics in Kuo-Chuan Liu's work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (14 papers) and Advanced Welding Techniques Analysis (8 papers). Kuo-Chuan Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (14 papers) and Advanced Welding Techniques Analysis (8 papers). Kuo-Chuan Liu collaborates with scholars based in United States, Taiwan and China. Kuo-Chuan Liu's co-authors include Tae-Kyu Lee, Jie Xue, Hongtao Ma, Jenq‐Gong Duh, Chi-Yang Yu, J. W. Morris, Weidong Xie, Bo Liu, Thomas R. Bieler and Bite Zhou and has published in prestigious journals such as Materials Letters, Journal of Electronic Materials and Journal of Statistical Planning and Inference.

In The Last Decade

Kuo-Chuan Liu

24 papers receiving 340 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kuo-Chuan Liu United States 11 333 214 52 22 19 24 352
Jie Xue United States 9 284 0.9× 84 0.4× 42 0.8× 24 1.1× 20 1.1× 37 308
A.C.K. So Hong Kong 7 331 1.0× 249 1.2× 50 1.0× 8 0.4× 21 1.1× 8 349
Jong‐Kai Lin United States 12 381 1.1× 187 0.9× 33 0.6× 16 0.7× 36 1.9× 33 394
Tama Fouzder Bangladesh 9 403 1.2× 347 1.6× 54 1.0× 21 1.0× 18 0.9× 18 423
P.L. Tu Hong Kong 10 510 1.5× 358 1.7× 66 1.3× 19 0.9× 47 2.5× 18 537
Young-Doo Jeon South Korea 11 345 1.0× 180 0.8× 10 0.2× 10 0.5× 26 1.4× 18 359
Ranjit Pandher United States 8 291 0.9× 130 0.6× 54 1.0× 33 1.5× 31 1.6× 25 324
Sang-Won Kim South Korea 7 510 1.5× 430 2.0× 44 0.8× 9 0.4× 18 0.9× 11 517
Fubin Song Hong Kong 9 299 0.9× 150 0.7× 18 0.3× 22 1.0× 64 3.4× 31 315

Countries citing papers authored by Kuo-Chuan Liu

Since Specialization
Citations

This map shows the geographic impact of Kuo-Chuan Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kuo-Chuan Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kuo-Chuan Liu more than expected).

Fields of papers citing papers by Kuo-Chuan Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kuo-Chuan Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kuo-Chuan Liu. The network helps show where Kuo-Chuan Liu may publish in the future.

Co-authorship network of co-authors of Kuo-Chuan Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Kuo-Chuan Liu. A scholar is included among the top collaborators of Kuo-Chuan Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kuo-Chuan Liu. Kuo-Chuan Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ma, Hongtao, et al.. (2011). Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(12). 1965–1974. 13 indexed citations
2.
Lee, Tae-Kyu, Weidong Xie, Bite Zhou, Thomas R. Bieler, & Kuo-Chuan Liu. (2011). Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects. Journal of Electronic Materials. 40(9). 1967–1976. 13 indexed citations
3.
Bieler, Thomas R., Bite Zhou, A. Zamiri, et al.. (2011). The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints. 5F.1.1–5F.1.9. 7 indexed citations
4.
Lee, Tae-Kyu, et al.. (2011). Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish. Materials Letters. 65(21-22). 3216–3218. 51 indexed citations
5.
Ma, Hongtao, et al.. (2011). Effects of multiple rework on the reliability of lead-free Ball Grid Array assemblies. 64. 979–983. 3 indexed citations
6.
Liu, Bo, Tae-Kyu Lee, & Kuo-Chuan Liu. (2011). Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects. Journal of Electronic Materials. 40(10). 2111–2118. 27 indexed citations
7.
Xie, Weidong, Tae-Kyu Lee, Kuo-Chuan Liu, & Jie Xue. (2010). Pb-free solder joint reliability of fine pitch chip-scale packages. 1587–1590. 11 indexed citations
8.
Ma, Hongtao, Kuo-Chuan Liu, Tae-Kyu Lee, & Dong Hyun Kim. (2010). Effects of PCB design variations on bend and ATC performance of lead-free solder joints. 2. 1512–1517. 3 indexed citations
9.
10.
Ma, Hongtao, et al.. (2010). Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions. 1816–1822. 7 indexed citations
11.
Lee, Tae-Kyu, Hongtao Ma, Kuo-Chuan Liu, & Jie Xue. (2010). Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects. Journal of Electronic Materials. 39(12). 2564–2573. 66 indexed citations
12.
13.
Lee, Tae-Kyu, et al.. (2009). Rate dependence of bending fatigue failure characteristics of lead-free solder joint. 76. 2070–2074. 5 indexed citations
14.
Lee, Tae-Kyu, et al.. (2009). The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects. Journal of Electronic Materials. 38(12). 2585–2591. 21 indexed citations
15.
Ma, Hongtao, et al.. (2009). Isothermal aging effects on the dynamic performance of lead-free solder joints. 25. 390–397. 9 indexed citations
16.
17.
Liu, Kuo-Chuan, et al.. (2008). Manufacturability and reliability of a high-speed CSP SRAM on an interposer package. 374–381. 1 indexed citations
18.
Morris, J. W., et al.. (2008). The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder. Journal of Electronic Materials. 38(2). 221–226. 29 indexed citations
19.
Glebov, Alexei L., et al.. (2004). Hybrid integration of optical modules for planar deflector switches. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5358. 43–43. 1 indexed citations
20.
Huang, Deng-Yuan & Kuo-Chuan Liu. (1994). Some variable selection procedures in multivariate linear regression models. Journal of Statistical Planning and Inference. 41(2). 205–214. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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