Kuo-Chuan Liu
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Aerospace Engineering
- Materials Chemistry
- Mechanics of Materials
- Topics
- Electronic Packaging and Soldering Technologies (22 papers)3D IC and TSV technologies (14 papers)Advanced Welding Techniques Analysis (8 papers)
- Journals
- Materials LettersJournal of Electronic MaterialsJournal of Statistical Planning and Inference
- Partner nations
- United StatesChinaTaiwan
In The Last Decade
Kuo-Chuan Liu
24 papers receiving 340 citations
Peers
Comparison fields: 5 of 29
- Electrical and Electronic Engineering 333
- Mechanical Engineering 214
- Aerospace Engineering 52
- Materials Chemistry 22
- Mechanics of Materials 19
Countries citing papers authored by Kuo-Chuan Liu
This map shows the geographic impact of Kuo-Chuan Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kuo-Chuan Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kuo-Chuan Liu more than expected).
Fields of papers citing papers by Kuo-Chuan Liu
This network shows the impact of papers produced by Kuo-Chuan Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kuo-Chuan Liu. The network helps show where Kuo-Chuan Liu may publish in the future.
Co-authorship network of co-authors of Kuo-Chuan Liu
This figure shows the co-authorship network connecting the top 25 collaborators of Kuo-Chuan Liu. A scholar is included among the top collaborators of Kuo-Chuan Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kuo-Chuan Liu. Kuo-Chuan Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 24 | |
| 2 | 13 | |
| 3 | 13 | |
| 4 | 51 | |
| 5 | 3 | |
| 6 | 7 | |
| 7 | 11 | |
| 8 | 1 | |
| 9 | 3 | |
| 10 | 66 | |
| 11 | 1 | |
| 12 | 7 | |
| 13 | 5 | |
| 14 | 21 | |
| 15 | 9 | |
| 16 | 12 | |
| 17 | 1 | |
| 18 | 29 | |
| 19 | 1 | |
| 20 | 6 |
About Kuo-Chuan Liu
Kuo-Chuan Liu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science, having authored 24 papers that have together received 352 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (14 papers) and Advanced Welding Techniques Analysis (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (333 citations), Mechanical Engineering (214 citations) and General Materials Science (11 citations). Kuo-Chuan Liu has collaborated with scholars based in United States, China and Taiwan. Frequent co-authors include Tae-Kyu Lee, Jie Xue, Hongtao Ma, Jenq‐Gong Duh, Chi-Yang Yu, J. W. Morris, Bo Liu, Weidong Xie, Bite Zhou and Thomas R. Bieler. Their work appears in journals such as Materials Letters, Journal of Electronic Materials and Journal of Statistical Planning and Inference.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.