Luke Wentlent
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Aerospace Engineering top 10%
- Mechanics of Materials top 10%
- Materials Chemistry
- Co-authors
- Peter BørgesenLiang YinBabak ArfaeiSa’d HamashaAwni QasaimehDébora P. SchmitzChristopher GreenePatrick Thompson
- Topics
- Electronic Packaging and Soldering Technologies (25 papers)3D IC and TSV technologies (9 papers)Aluminum Alloy Microstructure Properties (8 papers)
- Partner nations
- United StatesJordanCanada
In The Last Decade
Luke Wentlent
26 papers receiving 416 citations
Peers
Comparison fields: 5 of 22
- Electrical and Electronic Engineering 414
- Mechanical Engineering 263
- Aerospace Engineering 125
- Mechanics of Materials 111
- Materials Chemistry 36
Countries citing papers authored by Luke Wentlent
This map shows the geographic impact of Luke Wentlent's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Luke Wentlent with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Luke Wentlent more than expected).
Fields of papers citing papers by Luke Wentlent
This network shows the impact of papers produced by Luke Wentlent. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Luke Wentlent. The network helps show where Luke Wentlent may publish in the future.
Co-authorship network of co-authors of Luke Wentlent
This figure shows the co-authorship network connecting the top 25 collaborators of Luke Wentlent. A scholar is included among the top collaborators of Luke Wentlent based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Luke Wentlent. Luke Wentlent is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 7 | |
| 3 | 9 | |
| 4 | 13 | |
| 5 | 16 | |
| 6 | 1 | |
| 7 | 2 | |
| 8 | 42 | |
| 9 | 16 | |
| 10 | 13 | |
| 11 | Evolution of the Deformation Behavior of Sn-Rich Solders during Cyclic Fatigue | 1 |
| 12 | 27 | |
| 13 | 27 | |
| 14 | 31 | |
| 15 | 12 | |
| 16 | 8 | |
| 17 | 21 | |
| 18 | 0 | |
| 19 | 96 | |
| 20 | 12 |
About Luke Wentlent
Luke Wentlent is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering, having authored 27 papers that have together received 430 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (414 citations), Mechanical Engineering (263 citations) and Aerospace Engineering (125 citations). Luke Wentlent has collaborated with scholars based in United States, Jordan and Canada. Frequent co-authors include Peter Børgesen, Liang Yin, Babak Arfaei, Sa’d Hamasha, Awni Qasaimeh, Débora P. Schmitz, Christopher Greene, Patrick Thompson, E. J. Cotts and Alfred A. Zinn. Their work appears in journals such as Journal of Electronic Materials, Microelectronics Reliability and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.