Dennis O. Ouma
- Biomedical Engineering
- Electrical and Electronic Engineering
- Mechanical Engineering
- Mechanics of Materials
- Materials Chemistry
- Co-authors
- Duane S. BoningJ.E. ChungB.E. StineSoo‐Young OhO.S. NakagawaDale L. HetheringtonJung YoonByungKun Lee
- Topics
- Advanced Surface Polishing Techniques (10 papers)Copper Interconnects and Reliability (5 papers)Advanced machining processes and optimization (5 papers)
- Journals
- Journal of The Electrochemical SocietyIEEE Transactions on Semiconductor ManufacturingComputer Standards & Interfaces
- Partner nations
- United States
In The Last Decade
Dennis O. Ouma
11 papers receiving 265 citations
Peers
Comparison fields: 5 of 21
- Biomedical Engineering 223
- Electrical and Electronic Engineering 165
- Mechanical Engineering 115
- Mechanics of Materials 57
- Materials Chemistry 41
Countries citing papers authored by Dennis O. Ouma
This map shows the geographic impact of Dennis O. Ouma's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dennis O. Ouma with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dennis O. Ouma more than expected).
Fields of papers citing papers by Dennis O. Ouma
This network shows the impact of papers produced by Dennis O. Ouma. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dennis O. Ouma. The network helps show where Dennis O. Ouma may publish in the future.
Co-authorship network of co-authors of Dennis O. Ouma
This figure shows the co-authorship network connecting the top 25 collaborators of Dennis O. Ouma. A scholar is included among the top collaborators of Dennis O. Ouma based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dennis O. Ouma. Dennis O. Ouma is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 102 | |
| 2 | 30 | |
| 3 | 10 | |
| 4 | 2 | |
| 5 | 21 | |
| 6 | 3 | |
| 7 | 90 | |
| 8 | PLANARIZATION AND INTEGRATION OF SHALLOW TRENCH ISOLATION | 7 |
| 9 | 5 | |
| 10 | EFFECT OF FINE-LINE DENSITY AND PITCH ON INTERCONNECT ILD THICKNESS VARIATION IN OXIDE CMP PROCESSES | 18 |
| 11 | Comparison of Oxide Planarization Pattern Dependencies between Two Different CMP Tools Using Statistical Metrology | 6 |
About Dennis O. Ouma
Dennis O. Ouma is a scholar working on Electronic, Optical and Magnetic Materials, Biomedical Engineering and Mechanical Engineering, having authored 11 papers that have together received 294 indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (10 papers), Copper Interconnects and Reliability (5 papers) and Advanced machining processes and optimization (5 papers). The work is most often cited by research in Biomedical Engineering (223 citations), Mechanical Engineering (115 citations) and Electrical and Electronic Engineering (165 citations). Dennis O. Ouma has collaborated with scholars based in United States. Frequent co-authors include Duane S. Boning, J.E. Chung, B.E. Stine, Soo‐Young Oh, O.S. Nakagawa, Dale L. Hetherington, Jung Yoon, ByungKun Lee, T. Smith and Brian Lee. Their work appears in journals such as Journal of The Electrochemical Society, IEEE Transactions on Semiconductor Manufacturing and Computer Standards & Interfaces.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.