G. G. Harman
- Electrical and Electronic Engineering
- Mechanical Engineering
- Mechanics of Materials
- Biomedical Engineering
- Materials Chemistry
- Co-authors
- John AlbersMichael GaitanYogendra JoshiRobert B. MooreXiaoming WangLina QuanYanfa YanNikolas J. Podraza
- Topics
- Electronic Packaging and Soldering Technologies (8 papers)Integrated Circuits and Semiconductor Failure Analysis (4 papers)3D IC and TSV technologies (3 papers)
- Partner nations
- United States
In The Last Decade
G. G. Harman
11 papers receiving 279 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 226
- Mechanical Engineering 137
- Mechanics of Materials 76
- Biomedical Engineering 42
- Materials Chemistry 36
Countries citing papers authored by G. G. Harman
This map shows the geographic impact of G. G. Harman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. G. Harman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. G. Harman more than expected).
Fields of papers citing papers by G. G. Harman
This network shows the impact of papers produced by G. G. Harman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. G. Harman. The network helps show where G. G. Harman may publish in the future.
Co-authorship network of co-authors of G. G. Harman
This figure shows the co-authorship network connecting the top 25 collaborators of G. G. Harman. A scholar is included among the top collaborators of G. G. Harman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. G. Harman. G. G. Harman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 9 | |
| 2 | 24 | |
| 3 | 1 | |
| 4 | 47 | |
| 5 | 11 | |
| 6 | 0 | |
| 7 | 9 | |
| 8 | 35 | |
| 9 | 1 | |
| 10 | 146 | |
| 11 | Semiconductor measurement technology: Microelectronic ultrasonic bonding | 1 |
| 12 | 4 | |
| 13 | 12 |
About G. G. Harman
G. G. Harman is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Surfaces, Coatings and Films, having authored 13 papers that have together received 300 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and 3D IC and TSV technologies (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (226 citations), Mechanical Engineering (137 citations) and Mechanics of Materials (76 citations). G. G. Harman has collaborated with scholars based in United States. Frequent co-authors include John Albers, Michael Gaitan, Yogendra Joshi, Robert B. Moore, Xiaoming Wang, Lina Quan, Yanfa Yan, Nikolas J. Podraza, Jianbo Jin and Liyan Zhu. Their work appears in journals such as Journal of the American Chemical Society, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.