B.E. Stine

833 total citations
23 papers, 567 citations indexed

About

B.E. Stine is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Biomedical Engineering. According to data from OpenAlex, B.E. Stine has authored 23 papers receiving a total of 567 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 7 papers in Hardware and Architecture and 7 papers in Biomedical Engineering. Recurrent topics in B.E. Stine's work include Integrated Circuits and Semiconductor Failure Analysis (11 papers), Advancements in Photolithography Techniques (9 papers) and Advanced Surface Polishing Techniques (7 papers). B.E. Stine is often cited by papers focused on Integrated Circuits and Semiconductor Failure Analysis (11 papers), Advancements in Photolithography Techniques (9 papers) and Advanced Surface Polishing Techniques (7 papers). B.E. Stine collaborates with scholars based in United States and Japan. B.E. Stine's co-authors include Duane S. Boning, J.E. Chung, Soo‐Young Oh, Dennis O. Ouma, O.S. Nakagawa, Dale L. Hetherington, Christopher P. Hess, M. Muthukrishnan, L.E. Camilletti and Michael R. Berman and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Transactions on Electron Devices and Microelectronic Engineering.

In The Last Decade

B.E. Stine

23 papers receiving 531 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
B.E. Stine United States 12 474 208 161 68 54 23 567
Jason P. Cain United States 10 432 0.9× 160 0.8× 64 0.4× 27 0.4× 59 1.1× 36 492
F.G. Kuper Netherlands 16 782 1.6× 72 0.3× 14 0.1× 29 0.4× 37 0.7× 79 840
S. Bracho Spain 11 332 0.7× 62 0.3× 58 0.4× 100 1.5× 13 0.2× 44 367
Debendra Mallik United States 7 339 0.7× 75 0.4× 57 0.4× 45 0.7× 10 0.2× 11 392
Jeong-Taek Kong South Korea 12 375 0.8× 177 0.9× 81 0.5× 21 0.3× 29 0.5× 62 473
Masafumi Asano Japan 11 226 0.5× 14 0.1× 78 0.5× 37 0.5× 17 0.3× 54 366
Cyrus Tabery United States 11 668 1.4× 32 0.2× 119 0.7× 33 0.5× 52 1.0× 50 704
R.P. Kraft United States 10 202 0.4× 50 0.2× 64 0.4× 27 0.4× 45 0.8× 42 292
Jongwook Kye United States 11 368 0.8× 59 0.3× 130 0.8× 27 0.4× 24 0.4× 56 395
A. Kornfeld Israel 9 551 1.2× 85 0.4× 109 0.7× 15 0.2× 5 0.1× 12 612

Countries citing papers authored by B.E. Stine

Since Specialization
Citations

This map shows the geographic impact of B.E. Stine's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B.E. Stine with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B.E. Stine more than expected).

Fields of papers citing papers by B.E. Stine

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B.E. Stine. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B.E. Stine. The network helps show where B.E. Stine may publish in the future.

Co-authorship network of co-authors of B.E. Stine

This figure shows the co-authorship network connecting the top 25 collaborators of B.E. Stine. A scholar is included among the top collaborators of B.E. Stine based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with B.E. Stine. B.E. Stine is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Inani, A., et al.. (2006). Yield Improvement Using Fail Signature Detection Algorithm (FSDA). 225–227. 1 indexed citations
2.
3.
Hess, Christopher P., et al.. (2003). Passive multiplexer test structure for fast and accurate contact and via fail-rate evaluation. IEEE Transactions on Semiconductor Manufacturing. 16(2). 259–265. 13 indexed citations
4.
5.
6.
Stine, B.E., et al.. (2002). <title>IC yield prediction and analysis using semi-empirical yield models and test data</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4692. 345–351. 2 indexed citations
7.
Stine, B.E., et al.. (2002). On the impact of dishing in metal CMP processes on circuit performance. 64–67. 3 indexed citations
8.
Hess, Christopher P., et al.. (2001). Fast extraction of defect size distribution using a single layer short flow NEST structure. IEEE Transactions on Semiconductor Manufacturing. 14(4). 330–337. 14 indexed citations
9.
Stine, B.E., Dennis O. Ouma, Duane S. Boning, et al.. (1999). Assessing and characterizing inter-and intra-die variation using a statistical metrology framework: A CMP case study. Computer Standards & Interfaces. 21(2). 189–189. 2 indexed citations
10.
Stine, B.E., Duane S. Boning, J.E. Chung, et al.. (1998). The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes. IEEE Transactions on Electron Devices. 45(3). 665–679. 112 indexed citations
11.
Stine, B.E., Dennis O. Ouma, Duane S. Boning, et al.. (1998). A Novel Statistical Metrology Framework for Identifying Sources of Variation in Oxide Chemical‐Mechanical Polishing. Journal of The Electrochemical Society. 145(3). 1052–1059. 3 indexed citations
12.
Stine, B.E., Dennis O. Ouma, Duane S. Boning, et al.. (1998). Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing. IEEE Transactions on Semiconductor Manufacturing. 11(1). 129–140. 90 indexed citations
13.
Stine, B.E., et al.. (1998). Simulating the impact of pattern-dependent poly-CD variation on circuit performance. IEEE Transactions on Semiconductor Manufacturing. 11(4). 552–556. 17 indexed citations
14.
Stine, B.E., Duane S. Boning, & J.E. Chung. (1997). Analysis and decomposition of spatial variation in integrated circuit processes and devices. IEEE Transactions on Semiconductor Manufacturing. 10(1). 24–41. 172 indexed citations
15.
Stine, B.E., et al.. (1997). Statistical metrology for characterizing CMP processes. Microelectronic Engineering. 33(1-4). 231–240. 11 indexed citations
16.
Ouma, Dennis O., et al.. (1997). Wafer-scale modeling of pattern effect in oxide chemical mechanical polishing. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3212. 236–236. 5 indexed citations
17.
Stine, B.E., et al.. (1997). EFFECT OF FINE-LINE DENSITY AND PITCH ON INTERCONNECT ILD THICKNESS VARIATION IN OXIDE CMP PROCESSES. 18 indexed citations
18.
Stine, B.E., et al.. (1997). Evaluation of pad life in chemical mechanical polishing process using statistical metrology. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3216. 70–70. 1 indexed citations
19.
Stine, B.E., Dennis O. Ouma, Duane S. Boning, et al.. (1996). Comparison of Oxide Planarization Pattern Dependencies between Two Different CMP Tools Using Statistical Metrology. 6 indexed citations
20.
Stine, B.E., et al.. (1996). <title>Inter- and intra-die polysilicon critical dimension variation</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2874. 27–35. 19 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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