Tetsuo KUMAZAWA
- Electrical and Electronic Engineering
- Materials Chemistry
- Mechanical Engineering
- Mechanics of Materials top 10%
- Biomedical Engineering
- Co-authors
- Masaharu KitanoEsteban P. BussoHideo MiuraMakoto KitanoKeiko KushidaYukihiro KumagaiA. NishimuraRichard E. Wagner
- Topics
- Electronic Packaging and Soldering Technologies (10 papers)3D IC and TSV technologies (5 papers)Metallurgy and Material Forming (4 papers)
- Journals
- Applied Physics LettersMacromoleculesInternational Journal for Numerical Methods in Engineering
- Partner nations
- JapanUnited StatesUnited Kingdom
In The Last Decade
Tetsuo KUMAZAWA
29 papers receiving 322 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 207
- Materials Chemistry 139
- Mechanical Engineering 118
- Mechanics of Materials 114
- Biomedical Engineering 76
Countries citing papers authored by Tetsuo KUMAZAWA
This map shows the geographic impact of Tetsuo KUMAZAWA's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tetsuo KUMAZAWA with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tetsuo KUMAZAWA more than expected).
Fields of papers citing papers by Tetsuo KUMAZAWA
This network shows the impact of papers produced by Tetsuo KUMAZAWA. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tetsuo KUMAZAWA. The network helps show where Tetsuo KUMAZAWA may publish in the future.
Co-authorship network of co-authors of Tetsuo KUMAZAWA
This figure shows the co-authorship network connecting the top 25 collaborators of Tetsuo KUMAZAWA. A scholar is included among the top collaborators of Tetsuo KUMAZAWA based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tetsuo KUMAZAWA. Tetsuo KUMAZAWA is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | The effects on psychological healing of transitional lighting in illuminated environments | 0 |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 8 | |
| 7 | 3 | |
| 8 | 108 | |
| 9 | 4 | |
| 10 | 1 | |
| 11 | 3 | |
| 12 | 3 | |
| 13 | 0 | |
| 14 | 27 | |
| 15 | 2 | |
| 16 | 11 | |
| 17 | 1 | |
| 18 | Profile Measurement of a Concave Surface Using the Interference Fringe of Reflected Light | 0 |
| 19 | 1 | |
| 20 | 0 |
About Tetsuo KUMAZAWA
Tetsuo KUMAZAWA is a scholar working on Discrete Mathematics and Combinatorics, Mechanics of Materials and Metals and Alloys, having authored 37 papers that have together received 345 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (5 papers) and Metallurgy and Material Forming (4 papers). The work is most often cited by research in Mechanics of Materials (114 citations), Electrical and Electronic Engineering (207 citations) and Mechanical Engineering (118 citations). Tetsuo KUMAZAWA has collaborated with scholars based in Japan, United States and United Kingdom. Frequent co-authors include Masaharu Kitano, Esteban P. Busso, Hideo Miura, Makoto Kitano, Keiko Kushida, Yukihiro Kumagai, A. Nishimura, Richard E. Wagner, John R. Barry and Mikio Maeda. Their work appears in journals such as Applied Physics Letters, Macromolecules and International Journal for Numerical Methods in Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.