Deepak Sekar

787 total citations
24 papers, 603 citations indexed

About

Deepak Sekar is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Computer Networks and Communications. According to data from OpenAlex, Deepak Sekar has authored 24 papers receiving a total of 603 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 2 papers in Computer Networks and Communications. Recurrent topics in Deepak Sekar's work include Semiconductor materials and devices (12 papers), 3D IC and TSV technologies (10 papers) and Ferroelectric and Negative Capacitance Devices (7 papers). Deepak Sekar is often cited by papers focused on Semiconductor materials and devices (12 papers), 3D IC and TSV technologies (10 papers) and Ferroelectric and Negative Capacitance Devices (7 papers). Deepak Sekar collaborates with scholars based in United States, China and Switzerland. Deepak Sekar's co-authors include J.D. Meindl, Calvin King, Muhannad S. Bakir, Bing Dang, Azad Naeemi, Hiren Thacker, He Qian, Huaqiang Wu, Gang Huang and P. J. Amal Joseph and has published in prestigious journals such as Nanotechnology, IEEE Electron Device Letters and Applied Physics Express.

In The Last Decade

Deepak Sekar

24 papers receiving 583 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Deepak Sekar United States	13	531	152	69	64	55	24	603
Scott Pozder United States	14	580 1.1×	54 0.4×	52 0.8×	51 0.8×	36 0.7×	25	607
Calvin King United States	7	328 0.6×	176 1.2×	41 0.6×	75 1.2×	26 0.5×	13	404
Adeel Bajwa United States	13	366 0.7×	98 0.6×	21 0.3×	68 1.1×	35 0.6×	26	415
Zhijie Chen China	8	213 0.4×	33 0.2×	74 1.1×	70 1.1×	13 0.2×	56	315
Guruprasad Katti Belgium	13	1.0k 1.9×	39 0.3×	34 0.5×	140 2.2×	80 1.5×	27	1.1k
Chin‐Li Kao Taiwan	12	435 0.8×	81 0.5×	21 0.3×	61 1.0×	40 0.7×	40	496
K. Kimura Japan	16	445 0.8×	497 3.3×	236 3.4×	72 1.1×	34 0.6×	45	948
W.C. Chiou Taiwan	11	467 0.9×	30 0.2×	17 0.2×	75 1.2×	60 1.1×	22	517
Jagdish Pandey United States	10	514 1.0×	129 0.8×	40 0.6×	340 5.3×	15 0.3×	18	657

Countries citing papers authored by Deepak Sekar

Since Specialization

Citations

This map shows the geographic impact of Deepak Sekar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Deepak Sekar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Deepak Sekar more than expected).

Fields of papers citing papers by Deepak Sekar

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Deepak Sekar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Deepak Sekar. The network helps show where Deepak Sekar may publish in the future.

Co-authorship network of co-authors of Deepak Sekar

This figure shows the co-authorship network connecting the top 25 collaborators of Deepak Sekar. A scholar is included among the top collaborators of Deepak Sekar based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Deepak Sekar. Deepak Sekar is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Huang, Xueyao, Huaqiang Wu, Bin Gao, et al.. (2016). HfO₂/Al₂O₃multilayer for RRAM arrays: a technique to improve tail-bit retention. Nanotechnology. 27(39). 395201–395201. 47 indexed citations

Wang, Chen, Huaqiang Wu, Bin Gao, et al.. (2016). Suppression of relaxation effect in HfO₂ resistive random access memory array by improved program operations. Applied Physics Express. 9(5). 51501–51501. 1 indexed citations

Wang, Chen, Huaqiang Wu, Bin Gao, et al.. (2016). The Statistical Evaluation of Correlations between LRS and HRS Relaxations in RRAM Array. 1–4. 6 indexed citations

Wang, Chen, Huaqiang Wu, Bin Gao, et al.. (2015). Relaxation Effect in RRAM Arrays: Demonstration and Characteristics. IEEE Electron Device Letters. 37(2). 182–185. 38 indexed citations

Huang, Xueyao, et al.. (2015). Optimization of TiN/TaOx/HfO2/TiN RRAM Arrays for Improved Switching and Data Retention. 1–4. 21 indexed citations

Sekar, Deepak, et al.. (2012). Monolithic 3D-ICs with single crystal silicon layers. 1–2. 12 indexed citations

Wei, Hai, et al.. (2012). Cooling three-dimensional integrated circuits using power delivery networks. 14.2.1–14.2.4. 33 indexed citations

Kim, Wanki, Sung Il Park, Zhiping Zhang, et al.. (2011). Forming-free nitrogen-doped AlO X RRAM with sub-μA programming current. Symposium on VLSI Technology. 22–23. 14 indexed citations

Dang, Bing, Muhannad S. Bakir, Deepak Sekar, Calvin King, & J.D. Meindl. (2010). Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips. IEEE Transactions on Advanced Packaging. 33(1). 79–87. 101 indexed citations

10.

Huang, Gang, et al.. (2009). 3D Integrated Circuits: Liquid Cooling and Power Delivery. IETE Technical Review. 26(6). 407–407. 3 indexed citations

11.

Bakir, Muhannad S., Calvin King, Deepak Sekar, et al.. (2008). 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. 663–670. 78 indexed citations

12.

Sekar, Deepak, Calvin King, Bing Dang, et al.. (2008). A 3D-IC Technology with Integrated Microchannel Cooling. 13–15. 95 indexed citations

13.

Sekar, Deepak, Azad Naeemi, Reza Sarvari, Jeffrey A. Davis, & J.D. Meindl. (2007). IntSim: A CAD tool for optimization of multilevel interconnect networks. International Conference on Computer Aided Design. 560–567. 22 indexed citations

14.

Sekar, Deepak, Azad Naeemi, Reza Sarvari, Jeffrey A. Davis, & J.D. Meindl. (2007). Intsim: a CAD tool for optimization of multilevel interconnect networks. Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design. 560–567. 18 indexed citations

15.

Huang, Gang, et al.. (2007). Compact Physical Models for Power Supply Noise and Chip/Package Co-Design of Gigascale Integration. 1659–1666. 18 indexed citations

16.

Sekar, Deepak & J.D. Meindl. (2007). The Impact of Multi-Core Architectures on Design of Chip-Level Interconnect Networks. 123–125. 2 indexed citations

17.

Sekar, Deepak, et al.. (2007). Electromigration Resistant Power Delivery Systems. IEEE Electron Device Letters. 28(8). 767–769. 1 indexed citations

18.

Huang, Gang, et al.. (2007). Physical Model for Power Supply Noise and Chip/Package Co-Design in Gigascale Systems with the Consideration of Hot Spots. 841–844. 5 indexed citations

19.

Sekar, Deepak, et al.. (2006). Optimal Repeaters for Sub-50nm Interconnect Networks. 199–201. 4 indexed citations

20.

Sekar, Deepak, et al.. (2006). A New Global Interconnect Paradigm: MIM Power-Ground Plane Capacitors. 48–50. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact