Adeel Bajwa

539 total citations
26 papers, 415 citations indexed

About

Adeel Bajwa is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Condensed Matter Physics. According to data from OpenAlex, Adeel Bajwa has authored 26 papers receiving a total of 415 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 3 papers in Condensed Matter Physics. Recurrent topics in Adeel Bajwa's work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (16 papers) and Copper Interconnects and Reliability (7 papers). Adeel Bajwa is often cited by papers focused on 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (16 papers) and Copper Interconnects and Reliability (7 papers). Adeel Bajwa collaborates with scholars based in United States, Germany and Norway. Adeel Bajwa's co-authors include Jürgen Wilde, Subramanian S. Iyer, Saptadeep Pal, Takafumi Fukushima, R. Quay, Richard Reiner, Mark S. Goorsky, Puneet Gupta, Tingyu Bai and Juergen Wilde and has published in prestigious journals such as Japanese Journal of Applied Physics, Microelectronics Reliability and Plasma Processes and Polymers.

In The Last Decade

Adeel Bajwa

25 papers receiving 394 citations

Peers

Adeel Bajwa

EEE

ME

BE

EOMM

CNC

Dionysios Manessis Germany

Christine Arndt Germany

Scott Pozder United States

Kai Zoschke Germany

P. Coudrain France

Junmin Jiang China

Sang-Han Lee South Korea

Lenian He China

Deepak Sekar United States

Calvin King United States

Dionysios Manessis Germany

Adeel Bajwa

418 ×1.1

EEE

128 ×1.3

ME

85 ×1.3

BE

67 ×1.6

EOMM

15 ×0.4

CNC

Citations per year, relative to Adeel Bajwa Adeel Bajwa (= 1×) peers Dionysios Manessis

Countries citing papers authored by Adeel Bajwa

Since Specialization

Citations

This map shows the geographic impact of Adeel Bajwa's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Adeel Bajwa with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Adeel Bajwa more than expected).

Fields of papers citing papers by Adeel Bajwa

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Adeel Bajwa. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Adeel Bajwa. The network helps show where Adeel Bajwa may publish in the future.

Co-authorship network of co-authors of Adeel Bajwa

This figure shows the co-authorship network connecting the top 25 collaborators of Adeel Bajwa. A scholar is included among the top collaborators of Adeel Bajwa based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Adeel Bajwa. Adeel Bajwa is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Bajwa, Adeel, et al.. (2025). Copper to Copper TCB – A Key Enabler for Ultra-Fine Pitch Heterogeneous Applications. Journal of Microelectronics and Electronic Packaging. 22(2).

2.

Bajwa, Adeel, et al.. (2022). Fluxless Bonding Via In-Situ Oxide Reduction. 498–502. 3 indexed citations

3.

Bajwa, Adeel, et al.. (2021). Fluxless Bonding of Large Area (≥ 900 mm2) Dies-Opportunities and Challenges. 457–461. 3 indexed citations

4.

Iyer, Subramanian S. & Adeel Bajwa. (2018). Reliability challenges in advance packaging. 4D.5–1. 7 indexed citations

5.

Hanna, Amir N., Takafumi Fukushima, Steven L. Moran, et al.. (2018). Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects. 1505–1511. 17 indexed citations

6.

Bajwa, Adeel, et al.. (2018). Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) Assembly. 1926–1930. 17 indexed citations

7.

Pal, Saptadeep, et al.. (2018). A Case for Packageless Processors. 466–479. 19 indexed citations

8.

Fukushima, Takafumi, et al.. (2018). Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(10). 1738–1746. 32 indexed citations

9.

Bajwa, Adeel, et al.. (2018). Characterization of Fine-Pitch Interconnections (≤ 10 μm) on Silicon Interconnect Fabric for Heterogeneous Integration. IMAPSource Proceedings. 2018(1). 556–560. 1 indexed citations

10.

Bajwa, Adeel, Saptadeep Pal, Tingyu Bai, et al.. (2017). Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding. 1276–1284. 67 indexed citations

11.

Goorsky, Mark S., et al.. (2017). Low temperature metal-metal bonding for heterogeneous integration and performance scaling. 42–42. 1 indexed citations

12.

Fukushima, Takafumi, et al.. (2017). “FlexTrate ^TM” — Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP. 649–654. 13 indexed citations

13.

Goorsky, Mark S., Kari Schjølberg‐Henriksen, Tingyu Bai, et al.. (2017). Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding. Japanese Journal of Applied Physics. 57(2S1). 02BC03–02BC03. 8 indexed citations

14.

Bajwa, Adeel, et al.. (2016). Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects.. IMAPSource Proceedings. 2016(1). 203–208. 3 indexed citations

15.

Bajwa, Adeel & Juergen Wilde. (2016). Reliability of Ag-Sintering and Sn-Ag TLP-Bonding for Mounting of SiC and GaN Devices. FreiDok plus (Universitätsbibliothek Freiburg). 1–6. 4 indexed citations

16.

Bajwa, Adeel & Jürgen Wilde. (2016). Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices. Microelectronics Reliability. 60. 116–125. 32 indexed citations

17.

Bajwa, Adeel, et al.. (2015). Assembly and Packaging Technologies for High-Temperature and High-Power GaN Devices. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(10). 1402–1416. 63 indexed citations

18.

Bajwa, Adeel, et al.. (2015). Die-attachment technologies for high-temperature applications of Si and SiC-based power devices. 2168–2174. 12 indexed citations

19.

Bajwa, Adeel, et al.. (2014). Comparison of new die-attachment technologies for power electronic assemblies. 1707–1713. 15 indexed citations

20.

Bajwa, Adeel, et al.. (2013). Effect of Plasma Treatments and Plasma‐Polymerized Films on the Adhesion of Parylene‐C to Substrates. Plasma Processes and Polymers. 10(12). 1081–1089. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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