Calvin King
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Biomedical Engineering
- Materials Chemistry
- Automotive Engineering
- Co-authors
- Muhannad S. BakirJ.D. MeindlDeepak SekarBing DangHiren ThackerP. J. Amal JosephGang HuangAzad Naeemi
- Topics
- 3D IC and TSV technologies (11 papers)Electronic Packaging and Soldering Technologies (5 papers)Heat Transfer and Optimization (2 papers)
- Journals
- Journal of Micromechanics and MicroengineeringIEEE Transactions on Advanced PackagingIETE Technical Review
- Partner nations
- United StatesUnited KingdomSwitzerland
In The Last Decade
Calvin King
12 papers receiving 387 citations
Peers
Comparison fields: 5 of 31
- Electrical and Electronic Engineering 328
- Mechanical Engineering 176
- Biomedical Engineering 75
- Materials Chemistry 41
- Automotive Engineering 37
Countries citing papers authored by Calvin King
This map shows the geographic impact of Calvin King's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Calvin King with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Calvin King more than expected).
Fields of papers citing papers by Calvin King
This network shows the impact of papers produced by Calvin King. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Calvin King. The network helps show where Calvin King may publish in the future.
Co-authorship network of co-authors of Calvin King
This figure shows the co-authorship network connecting the top 25 collaborators of Calvin King. A scholar is included among the top collaborators of Calvin King based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Calvin King. Calvin King is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 39 | |
| 3 | 17 | |
| 4 | 16 | |
| 5 | 101 | |
| 6 | 3 | |
| 7 | 78 | |
| 8 | 95 | |
| 9 | 48 | |
| 10 | 2 | |
| 11 | 1 | |
| 12 | 3 | |
| 13 | The effects on spread spectrum signals of multipath fading in an indoor environment | 0 |
About Calvin King
Calvin King is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering and Computer Networks and Communications, having authored 13 papers that have together received 404 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (5 papers) and Heat Transfer and Optimization (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (328 citations), Mechanical Engineering (176 citations) and Hardware and Architecture (26 citations). Calvin King has collaborated with scholars based in United States, United Kingdom and Switzerland. Frequent co-authors include Muhannad S. Bakir, J.D. Meindl, Deepak Sekar, Bing Dang, Hiren Thacker, P. J. Amal Joseph, Gang Huang, Azad Naeemi, Yue Zhang and Yoon Jo Kim. Their work appears in journals such as Journal of Micromechanics and Microengineering, IEEE Transactions on Advanced Packaging and IETE Technical Review.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.