C. Pelto

1.4k total citations
10 papers, 125 citations indexed

About

C. Pelto is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Mechanics of Materials. According to data from OpenAlex, C. Pelto has authored 10 papers receiving a total of 125 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 2 papers in Condensed Matter Physics and 2 papers in Mechanics of Materials. Recurrent topics in C. Pelto's work include 3D IC and TSV technologies (3 papers), Semiconductor materials and devices (3 papers) and Copper Interconnects and Reliability (2 papers). C. Pelto is often cited by papers focused on 3D IC and TSV technologies (3 papers), Semiconductor materials and devices (3 papers) and Copper Interconnects and Reliability (2 papers). C. Pelto collaborates with scholars based in United States and United Kingdom. C. Pelto's co-authors include R. Stanley Williams, Yong Chen, Y. A. Chang, Guotao Wang, A. Yeoh, S. Balakrishnan, G. Leatherman, Ming Chang, Zhiyong Wang and Jimin Yao and has published in prestigious journals such as Journal of Applied Physics, IEEE Journal of Solid-State Circuits and Solid-State Electronics.

In The Last Decade

C. Pelto

9 papers receiving 116 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. Pelto United States	6	110	36	26	20	13	10	125
S. Henneberger Germany	6	43 0.4×	37 1.0×	43 1.7×	11 0.6×	10 0.8×	20	103
Tzu-Jin Yeh Taiwan	10	309 2.8×	15 0.4×	14 0.5×	4 0.2×	8 0.6×	26	315
Shinichiro Matsunaga Japan	9	288 2.6×	20 0.6×	46 1.8×	20 1.0×	11 0.8×	19	299
Victor Soler Spain	10	262 2.4×	33 0.9×	14 0.5×	4 0.2×	12 0.9×	24	287
L. Prabhu United States	10	242 2.2×	27 0.8×	7 0.3×	21 1.1×	4 0.3×	17	256
Yuanzhong Zhou United States	13	430 3.9×	20 0.6×	19 0.7×	44 2.2×	8 0.6×	50	470
Oliver Blank Austria	8	388 3.5×	20 0.6×	11 0.4×	5 0.3×	6 0.5×	14	396
Phil Rutter United Kingdom	9	426 3.9×	24 0.7×	24 0.9×	2 0.1×	14 1.1×	15	433
Filip Schleicher Belgium	7	124 1.1×	35 1.0×	20 0.8×	3 0.1×	5 0.4×	23	170
Zhangsong Mao China	8	140 1.3×	6 0.2×	16 0.6×	5 0.3×	11 0.8×	10	145

Countries citing papers authored by C. Pelto

Since Specialization

Citations

This map shows the geographic impact of C. Pelto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Pelto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Pelto more than expected).

Fields of papers citing papers by C. Pelto

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Pelto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Pelto. The network helps show where C. Pelto may publish in the future.

Co-authorship network of co-authors of C. Pelto

This figure shows the co-authorship network connecting the top 25 collaborators of C. Pelto. A scholar is included among the top collaborators of C. Pelto based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Pelto. C. Pelto is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

10 of 10 papers shown

1.

Butzen, Nicolas, Harish K. Krishnamurthy, Sheldon Weng, et al.. (2024). A Monolithic 12.7 W/mm², 92% Peak-Efficiency Switched-Capacitor DC-DC Converter Using CSCR-First Topology. IEEE Journal of Solid-State Circuits. 59(12). 4114–4123. 1 indexed citations

2.

Fripp, Michael, et al.. (2022). Novel Expanding Metal Alloy for Non-Elastomeric Sealing and Anchoring. SPE Annual Technical Conference and Exhibition. 1 indexed citations

3.

Elsherbini, Adel, Kimin Jun, Zhiguo Qian, et al.. (2021). Enabling Hybrid Bonding on Intel Process. 2021 IEEE International Electron Devices Meeting (IEDM). 34.3.1–34.3.4. 27 indexed citations

4.

Avci, Uygar E., R. Grover, J. Hicks, et al.. (2020). Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel’s 10+ Process. 1–4. 11 indexed citations

5.

Fischer, K., D. Ingerly, Ik Kyeong Jin, et al.. (2016). Performance enhancement for 14nm high volume manufacturing microprocessor and system on a chip processes. 5–7. 9 indexed citations

6.

Yeoh, A., Ming Chang, C. Pelto, et al.. (2006). Copper Die Bumps (First Level Interconnect) and Low-K Dielectrics in 65nm High Volume Manufacturing. 1611–1615. 49 indexed citations

7.

Pelto, C., Y. A. Chang, Yong Chen, & R. Stanley Williams. (2002). Thermally stable, oxidation resistant capping technology for Ti/Al ohmic contacts to n-GaN. Journal of Applied Physics. 92(8). 4283–4289. 11 indexed citations

8.

Pelto, C., et al.. (2002). Schottky enhancement of contacts to n-(In0.52Al0.48)As using PdAl as a metallization. Journal of Electronic Materials. 31(12). 1330–1336.

9.

Pelto, C., Y. A. Chang, Yong Chen, & R. Stanley Williams. (2001). Issues concerning the preparation of ohmic contacts to n-GaN. Solid-State Electronics. 45(9). 1597–1605. 15 indexed citations

10.

Baker, James C., et al.. (1976). An alternative to process recording.. PubMed. 24(2). 115–8. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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