Ting-Yen Chiang

413 total citations
11 papers, 317 citations indexed

About

Ting-Yen Chiang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Ting-Yen Chiang has authored 11 papers receiving a total of 317 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 2 papers in Materials Chemistry. Recurrent topics in Ting-Yen Chiang's work include Copper Interconnects and Reliability (6 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (4 papers). Ting-Yen Chiang is often cited by papers focused on Copper Interconnects and Reliability (6 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (4 papers). Ting-Yen Chiang collaborates with scholars based in United States and Taiwan. Ting-Yen Chiang's co-authors include Krishna C. Saraswat, Kaustav Banerjee, S.J. Souri, Chi On Chui, Bohr‐Ran Huang, Pragya Singh, Ji Chen, Jinn P. Chu, Adhimoorthy Saravanan and Deepa Kathiravan and has published in prestigious journals such as ACS Applied Materials & Interfaces, Surface and Coatings Technology and IEEE Electron Device Letters.

In The Last Decade

Ting-Yen Chiang

11 papers receiving 295 citations

Peers

Countries citing papers authored by Ting-Yen Chiang

Since Specialization

Citations

This map shows the geographic impact of Ting-Yen Chiang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ting-Yen Chiang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ting-Yen Chiang more than expected).

Fields of papers citing papers by Ting-Yen Chiang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ting-Yen Chiang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ting-Yen Chiang. The network helps show where Ting-Yen Chiang may publish in the future.

Co-authorship network of co-authors of Ting-Yen Chiang

This figure shows the co-authorship network connecting the top 25 collaborators of Ting-Yen Chiang. A scholar is included among the top collaborators of Ting-Yen Chiang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ting-Yen Chiang. Ting-Yen Chiang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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11 of 11 papers shown

#	Work	Indexed citations
1	Growth of Graphitic Carbon Nitride-Incorporated ZnO Nanorods on Silicon Pyramidal Substrates for Enhanced Hydrogen Sensing Applications 2022 ·ACS Applied Materials & Interfaces ·Bohr‐Ran Huang, Adhimoorthy Saravanan, Deepa Kathiravan, Ting-Yen Chiang, (unknown)	7
2	ZnO-NWs/metallic glass nanotube hybrid arrays: Fabrication and material characterization 2021 ·Surface and Coatings Technology ·(unknown), Pragya Singh, Bohr‐Ran Huang, Ting-Yen Chiang, (unknown), (unknown), Ji Chen, Jinn P. Chu	17
3	Thoracoscopic management of incarcerated lung herniation after blunt chest trauma: a case report and literature review 2017 ·Journal of Thoracic Disease ·Ting-Yen Chiang, (unknown), Shun‐Mao Yang, Ke-Cheng Chen	1
4	Closed-form analytical thermal model for accurate temperature estimation of multilevel ULSI interconnects 2004 ·Ting-Yen Chiang, Krishna C. Saraswat	9
5	Impact of Joule heating on scaling of deep sub-micron Cu/low-k interconnects 2003 ·Ting-Yen Chiang, (unknown), Krishna C. Saraswat	20
6	Impact of vias on the thermal effect of deep sub-micron Cu/low-k interconnects 2002 ·Ting-Yen Chiang, Krishna C. Saraswat	8
7	Compact modeling and SPICE-based simulation for electrothermal analysis of multilevel ULSI interconnects 2002 ·Ting-Yen Chiang, (unknown), (unknown)	45
8	Effect of via separation and low-k dielectric materials on the thermal characteristics of Cu interconnects 2002 ·Ting-Yen Chiang, Kaustav Banerjee, Krishna C. Saraswat	44
9	Thermal analysis of heterogeneous 3D ICs with various integration scenarios 2002 ·Ting-Yen Chiang, S.J. Souri, Chi On Chui, Krishna C. Saraswat	86
10	Analytical thermal model for multilevel VLSI interconnects incorporating via effect 2002 ·IEEE Electron Device Letters ·Ting-Yen Chiang, Kaustav Banerjee, Krishna C. Saraswat	73
11	A new analytical thermal model for multilevel ULSI interconnects incorporating via effect 2001 ·Ting-Yen Chiang, Kaustav Banerjee, Krishna C. Saraswat	7

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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