Vadim Gektin

528 total citations
28 papers, 413 citations indexed

About

Vadim Gektin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Vadim Gektin has authored 28 papers receiving a total of 413 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Mechanical Engineering, 18 papers in Electrical and Electronic Engineering and 6 papers in Materials Chemistry. Recurrent topics in Vadim Gektin's work include Heat Transfer and Optimization (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Heat Transfer and Boiling Studies (10 papers). Vadim Gektin is often cited by papers focused on Heat Transfer and Optimization (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Heat Transfer and Boiling Studies (10 papers). Vadim Gektin collaborates with scholars based in United States, United Kingdom and Netherlands. Vadim Gektin's co-authors include Avram Bar‐Cohen, Tim Persoons, Suresh V. Garimella, Justin A. Weibel, Jennifer Ames, Bahgat Sammakia, Srikanth Rangarajan, Yaser Hadad, Gamal Refai-Ahmed and Bharath Ramakrishnan and has published in prestigious journals such as Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Circuits and Devices Magazine.

In The Last Decade

Vadim Gektin

28 papers receiving 388 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Vadim Gektin United States 9 230 211 72 59 39 28 413
Mark Mihalic United States 10 143 0.6× 274 1.3× 106 1.5× 37 0.6× 19 0.5× 13 424
Gerd Schlottig Switzerland 13 356 1.5× 378 1.8× 113 1.6× 160 2.7× 99 2.5× 58 684
Douglas DeVoto United States 14 148 0.6× 405 1.9× 98 1.4× 43 0.7× 29 0.7× 38 533
Tae‐Jong Kim South Korea 12 186 0.8× 208 1.0× 59 0.8× 78 1.3× 30 0.8× 38 430
Rahul Kumar Verma India 11 142 0.6× 70 0.3× 114 1.6× 111 1.9× 21 0.5× 42 276
Insung Hwang South Korea 12 223 1.0× 105 0.5× 73 1.0× 60 1.0× 56 1.4× 38 376
Joshua Major United States 12 120 0.5× 227 1.1× 63 0.9× 27 0.5× 29 0.7× 29 317
U. Kloter Switzerland 10 592 2.6× 205 1.0× 50 0.7× 19 0.3× 90 2.3× 13 722
Wesley Williams United States 13 93 0.4× 322 1.5× 19 0.3× 35 0.6× 58 1.5× 45 433

Countries citing papers authored by Vadim Gektin

Since Specialization
Citations

This map shows the geographic impact of Vadim Gektin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vadim Gektin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vadim Gektin more than expected).

Fields of papers citing papers by Vadim Gektin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Vadim Gektin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vadim Gektin. The network helps show where Vadim Gektin may publish in the future.

Co-authorship network of co-authors of Vadim Gektin

This figure shows the co-authorship network connecting the top 25 collaborators of Vadim Gektin. A scholar is included among the top collaborators of Vadim Gektin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vadim Gektin. Vadim Gektin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Refai-Ahmed, Gamal, et al.. (2023). Forward-Looking Roadmap View to Enable Heterogeneous Integration in the Next 10 Years. 1022–1025. 2 indexed citations
2.
Refai-Ahmed, Gamal, Husam A. Alissa, Bahgat Sammakia, et al.. (2022). Invited Talk: Pathfinding to Maximization of AI/HPC/GPC System Performance. 909–913. 1 indexed citations
3.
Khalili, Sadegh, Srikanth Rangarajan, Vadim Gektin, Husam A. Alissa, & Bahgat Sammakia. (2020). An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads. Journal of Electronic Packaging. 142(4). 3 indexed citations
4.
Refai-Ahmed, Gamal, Hoa Do, Yaser Hadad, et al.. (2020). Establishing Thermal Air-cooled Limit for High Performance Electronics Devices. 347–354. 8 indexed citations
5.
6.
Khalili, Sadegh, Srikanth Rangarajan, Bahgat Sammakia, & Vadim Gektin. (2019). An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load. 2 indexed citations
7.
Huang, Xiaopeng & Vadim Gektin. (2018). Lidded vs. Lidless: A Thermal Study. 1 indexed citations
8.
Ramakrishnan, Bharath, Yaser Hadad, Sami Alkharabsheh, et al.. (2018). Experimental Characterization of Cold Plates used in Cooling Multi Chip Server Modules (MCM). 664–672. 12 indexed citations
9.
Ramakrishnan, Bharath, Sami Alkharabsheh, Yaser Hadad, et al.. (2018). Experimental investigation of direct liquid cooling of a two-die package. 42–49. 10 indexed citations
10.
Garimella, Suresh V., Tim Persoons, Justin A. Weibel, & Vadim Gektin. (2016). Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(8). 1191–1205. 166 indexed citations
11.
12.
Gektin, Vadim. (2005). Thermal Management of Voids and Delamination in TIMs. 641–645. 6 indexed citations
13.
Stern, M. B., et al.. (2005). Evaluation of high performance thermal greases for CPU package cooling applications. 39–43. 4 indexed citations
14.
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16.
Gektin, Vadim & Avram Bar‐Cohen. (2002). Mechanistic figures of merit for die-attach materials. 306–313. 16 indexed citations
17.
Gektin, Vadim, et al.. (2002). Thermo-structural behavior of underfilled flip-chips. 16. 440–447. 3 indexed citations
18.
Gektin, Vadim & Avram Bar‐Cohen. (1998). Narrowing the gap in flip chips. IEEE Circuits and Devices Magazine. 14(3). 29–33. 5 indexed citations
19.
Gektin, Vadim. (1997). Thermo-structural behavior of adhesively bonded microelectronic chips. UMI Dissertation Services eBooks. 4 indexed citations
20.
Gektin, Vadim, Avram Bar‐Cohen, & Jennifer Ames. (1997). Coffin-Manson fatigue model of underfilled flip-chips. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 20(3). 317–326. 77 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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