Vadim Gektin
- Mechanical Engineering top 10%
- Electrical and Electronic Engineering
- Materials Chemistry
- Mechanics of Materials
- Biomedical Engineering
- Co-authors
- Avram Bar‐CohenJustin A. WeibelTim PersoonsSuresh V. GarimellaJennifer AmesBahgat SammakiaSrikanth RangarajanYaser Hadad
- Topics
- Heat Transfer and Optimization (14 papers)Electronic Packaging and Soldering Technologies (12 papers)Heat Transfer and Boiling Studies (10 papers)
- Journals
- Journal of Electronic PackagingIEEE Transactions on Components Packaging and Manufacturing TechnologyIEEE Circuits and Devices Magazine
- Partner nations
- United StatesUnited KingdomNetherlands
In The Last Decade
Vadim Gektin
28 papers receiving 388 citations
Peers
Comparison fields: 5 of 40
- Mechanical Engineering 230
- Electrical and Electronic Engineering 211
- Materials Chemistry 72
- Mechanics of Materials 59
- Biomedical Engineering 39
Countries citing papers authored by Vadim Gektin
This map shows the geographic impact of Vadim Gektin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vadim Gektin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vadim Gektin more than expected).
Fields of papers citing papers by Vadim Gektin
This network shows the impact of papers produced by Vadim Gektin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vadim Gektin. The network helps show where Vadim Gektin may publish in the future.
Co-authorship network of co-authors of Vadim Gektin
This figure shows the co-authorship network connecting the top 25 collaborators of Vadim Gektin. A scholar is included among the top collaborators of Vadim Gektin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vadim Gektin. Vadim Gektin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 1 | |
| 3 | 3 | |
| 4 | 4 | |
| 5 | 8 | |
| 6 | 2 | |
| 7 | 3 | |
| 8 | 12 | |
| 9 | 1 | |
| 10 | 10 | |
| 11 | 166 | |
| 12 | 3 | |
| 13 | 4 | |
| 14 | 9 | |
| 15 | 8 | |
| 16 | 3 | |
| 17 | 5 | |
| 18 | 47 | |
| 19 | Thermo-structural behavior of adhesively bonded microelectronic chips | 4 |
| 20 | 77 |
About Vadim Gektin
Vadim Gektin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials, having authored 28 papers that have together received 413 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Heat Transfer and Boiling Studies (10 papers). The work is most often cited by research in Mechanical Engineering (230 citations), Electrical and Electronic Engineering (211 citations) and Mechanics of Materials (59 citations). Vadim Gektin has collaborated with scholars based in United States, United Kingdom and Netherlands. Frequent co-authors include Avram Bar‐Cohen, Justin A. Weibel, Tim Persoons, Suresh V. Garimella, Jennifer Ames, Bahgat Sammakia, Srikanth Rangarajan, Yaser Hadad, David Geiger and Kanad Ghose. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Circuits and Devices Magazine.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.