Siow Ling Ho

777 total citations
15 papers, 628 citations indexed

About

Siow Ling Ho is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Siow Ling Ho has authored 15 papers receiving a total of 628 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Mechanics of Materials, 9 papers in Electrical and Electronic Engineering and 4 papers in Materials Chemistry. Recurrent topics in Siow Ling Ho's work include Mechanical Behavior of Composites (11 papers), Electronic Packaging and Soldering Technologies (9 papers) and High-Velocity Impact and Material Behavior (4 papers). Siow Ling Ho is often cited by papers focused on Mechanical Behavior of Composites (11 papers), Electronic Packaging and Soldering Technologies (9 papers) and High-Velocity Impact and Material Behavior (4 papers). Siow Ling Ho collaborates with scholars based in Singapore and United States. Siow Ling Ho's co-authors include Zhigang Suo, Bo Fan, Gang Bao, Xing Gong, F. F. Lange, Craig Hillman, A.A.O. Tay and Shailendra P. Joshi and has published in prestigious journals such as Journal of the American Ceramic Society, Journal of Applied Mechanics and International Journal of Solids and Structures.

In The Last Decade

Siow Ling Ho

14 papers receiving 605 citations

Peers

Siow Ling Ho
Michal Kotoul Czechia
V. Sabelkin United States
A.M. Kabeel Egypt
Noboru Yamanaka Japan
David R. Hayhurst United Kingdom
Varun P. Rajan United States
Guoqiang Yu China
A. Martín‐Meizoso Spain
Romana Piat Germany
Szymon Nosewicz Poland
Michal Kotoul Czechia
Siow Ling Ho
Citations per year, relative to Siow Ling Ho Siow Ling Ho (= 1×) peers Michal Kotoul

Countries citing papers authored by Siow Ling Ho

Since Specialization
Citations

This map shows the geographic impact of Siow Ling Ho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Siow Ling Ho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Siow Ling Ho more than expected).

Fields of papers citing papers by Siow Ling Ho

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Siow Ling Ho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Siow Ling Ho. The network helps show where Siow Ling Ho may publish in the future.

Co-authorship network of co-authors of Siow Ling Ho

This figure shows the co-authorship network connecting the top 25 collaborators of Siow Ling Ho. A scholar is included among the top collaborators of Siow Ling Ho based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Siow Ling Ho. Siow Ling Ho is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

15 of 15 papers shown
1.
Ho, Siow Ling, Shailendra P. Joshi, & A.A.O. Tay. (2014). Heating rate dependent delamination of metal–polymer interfaces: experiments and modeling. International Journal of Fracture. 187(2). 227–238. 2 indexed citations
2.
Ho, Siow Ling, et al.. (2014). Optimization of the wafer level molding process for high power device module. 747–751. 1 indexed citations
3.
Ho, Siow Ling, Shailendra P. Joshi, & A.A.O. Tay. (2013). Experiments and Three-Dimensional Modeling of Delamination in an Encapsulated Microelectronic Package Under Thermal Loading. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(11). 1859–1867. 9 indexed citations
4.
Ho, Siow Ling & A.A.O. Tay. (2013). 3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages. National University of Singapore. 807–812. 1 indexed citations
5.
Ho, Siow Ling, Shailendra P. Joshi, & A.A.O. Tay. (2012). Cohesive zone modeling of 3D delamination in encapsulated silicon devices. National University of Singapore. 1493–1498. 4 indexed citations
6.
Ho, Siow Ling & A.A.O. Tay. (2011). Moisture diffusion modeling and its impact on fracture mechanics parameters with regard to a PQFP. National University of Singapore. 171. 1/8–8/8. 3 indexed citations
7.
Ho, Siow Ling & A.A.O. Tay. (2011). A numerical analysis of penny-shaped delaminations in an encapsulated silicon module. National University of Singapore. 1115–1121. 2 indexed citations
8.
Ho, Siow Ling, et al.. (2010). Interaction of multiple delaminations and die in a plastic IC package. National University of Singapore. 31. 1–6.
9.
Ho, Siow Ling, et al.. (2010). Effect of the die edge and multiple delaminations on the mechanics of delamination in a PQFP. National University of Singapore. 31. 121–127. 2 indexed citations
10.
Ho, Siow Ling & A.A.O. Tay. (2009). A numerical study of 3D interfacial delamination in PQFP packages. National University of Singapore. 957–963. 1 indexed citations
11.
Ho, Siow Ling & A.A.O. Tay. (2009). Effect of shapes of crack fronts on the mechanics of 3D interfacial delamination in IC packages. National University of Singapore. 1397–1403. 1 indexed citations
12.
Ho, Siow Ling, Craig Hillman, F. F. Lange, & Zhigang Suo. (1995). Surface Cracking in Layers Under Biaxial, Residual Compressive Stress. Journal of the American Ceramic Society. 78(9). 2353–2359. 122 indexed citations
13.
Suo, Zhigang, Siow Ling Ho, & Xing Gong. (1993). Notch Ductile-to-Brittle Transition Due to Localized Inelastic Band. Journal of Engineering Materials and Technology. 115(3). 319–326. 95 indexed citations
14.
Ho, Siow Ling & Zhigang Suo. (1993). Tunneling Cracks in Constrained Layers. Journal of Applied Mechanics. 60(4). 890–894. 146 indexed citations
15.
Bao, Gang, Siow Ling Ho, Zhigang Suo, & Bo Fan. (1992). The role of material orthotropy in fracture specimens for composites. International Journal of Solids and Structures. 29(9). 1105–1116. 239 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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