Zhuo Chen

1.2k total citations
69 papers, 944 citations indexed

About

Zhuo Chen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Zhuo Chen has authored 69 papers receiving a total of 944 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 10 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Zhuo Chen's work include Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (25 papers) and Electrodeposition and Electroless Coatings (6 papers). Zhuo Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (25 papers) and Electrodeposition and Electroless Coatings (6 papers). Zhuo Chen collaborates with scholars based in China, Australia and Hong Kong. Zhuo Chen's co-authors include Zhiqi Wang, Naijun Zhou, Xiaoyuan Wang, Weirong Liu, Yijun Cheng, Jun Peng, Xin Gu, Fu Jiang, Wenhui Zhu and Meijie Chen and has published in prestigious journals such as SHILAP Revista de lepidopterología, ACS Applied Materials & Interfaces and Carbohydrate Polymers.

In The Last Decade

Zhuo Chen

64 papers receiving 910 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Zhuo Chen China 14 307 220 120 111 108 69 944
Shuo Liu China 17 183 0.6× 119 0.5× 64 0.5× 68 0.6× 70 0.6× 93 1.0k
Aun Haider Pakistan 19 493 1.6× 586 2.7× 53 0.4× 204 1.8× 42 0.4× 75 1.6k
Huaming Qian China 22 269 0.9× 509 2.3× 154 1.3× 42 0.4× 159 1.5× 111 1.8k
Yiming Wang China 19 81 0.3× 326 1.5× 100 0.8× 240 2.2× 80 0.7× 104 1.2k
Dongmin Yu China 21 269 0.9× 783 3.6× 102 0.8× 30 0.3× 46 0.4× 65 1.5k
Mohd Amiruddin Abd Rahman Malaysia 18 183 0.6× 237 1.1× 128 1.1× 55 0.5× 116 1.1× 55 1.1k
Yucheng Zhou China 20 511 1.7× 86 0.4× 59 0.5× 184 1.7× 34 0.3× 94 1.4k
Yuping Zhang China 15 232 0.8× 402 1.8× 71 0.6× 389 3.5× 20 0.2× 82 1.1k
Wenting Wang China 24 258 0.8× 650 3.0× 242 2.0× 55 0.5× 277 2.6× 113 1.8k

Countries citing papers authored by Zhuo Chen

Since Specialization
Citations

This map shows the geographic impact of Zhuo Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhuo Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhuo Chen more than expected).

Fields of papers citing papers by Zhuo Chen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zhuo Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhuo Chen. The network helps show where Zhuo Chen may publish in the future.

Co-authorship network of co-authors of Zhuo Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Zhuo Chen. A scholar is included among the top collaborators of Zhuo Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhuo Chen. Zhuo Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Gu, Tianqi, et al.. (2025). Holiday ride-hailing at intercity transfer hubs: Where space squeezes and time stretches. SHILAP Revista de lepidopterología. 4(4). 100239–100239. 1 indexed citations
2.
Gao, Yilun, et al.. (2025). Evaluation of the cooling mechanisms and performance of passive radiative cooling coatings in track-slab applications. Construction and Building Materials. 473. 141057–141057.
3.
Zhang, Xuejin, et al.. (2024). Recent advances in moisture-induced electricity generation based on wood lignocellulose: Preparation, properties, and applications. International Journal of Biological Macromolecules. 279(Pt 2). 135258–135258. 3 indexed citations
4.
Guo, Jintao, et al.. (2024). Influence of heat treatment on the microstructure evolution and corrosion performance of biodegradable Zn-Mg alloys. Materials Today Communications. 40. 109976–109976. 2 indexed citations
5.
Chen, Zhuo, et al.. (2024). Non-contact near-field cavity perturbation method for quantitative dielectric measurement and metallic defect inspection. NDT & E International. 145. 103124–103124. 1 indexed citations
6.
Su, Jingyang, et al.. (2024). Investigation on Indium Thermal Interface Materials Fluxless Bonding Technology via In Situ Formed AgIn₂ Coating. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(2). 421–427. 1 indexed citations
7.
Dai, Lei, Zhuo Chen, Meng Zhu, et al.. (2023). Robust, ultrathin and flexible electromagnetic interference shielding paper designed with all-polysaccharide hydrogel and MXene. Carbohydrate Polymers. 323. 121447–121447. 32 indexed citations
8.
Li, Xueqin, Zhuo Chen, Peng Liu, et al.. (2023). Feasibility assessment of recycling waste aluminum dross as a basic catalyst for biomass pyrolysis to produce hydrogen-rich gas. International Journal of Hydrogen Energy. 48(93). 36361–36376. 13 indexed citations
9.
Chen, Zhuo, et al.. (2023). Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding. Journal of Materials Science Materials in Electronics. 34(8). 2 indexed citations
10.
Chen, Zhuo, et al.. (2022). Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN. Journal of Materials Research and Technology. 18. 1865–1885. 16 indexed citations
11.
Liu, Zhen, et al.. (2022). Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact. Micromachines. 13(2). 281–281. 8 indexed citations
12.
Zhang, Yuyi, et al.. (2022). Room temperature ultrasonic bonding of leader-free solder ball. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 149. 1–5. 1 indexed citations
13.
Liu, Zhen, et al.. (2021). Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(1). 69–79. 4 indexed citations
14.
Chen, Yiming, Yiqiao Wei, Zhuo Chen, et al.. (2021). Electroless Copper Deposition with Pyramidal Micro-cones Morphology for Low-temperature Cu-Cu Bump Interconnections. 1–5. 1 indexed citations
15.
Li, Jiadong, et al.. (2020). Failure analysis of the water-wall tube in KIVCET waste heat boiler. Engineering Failure Analysis. 121. 105155–105155. 7 indexed citations
16.
Zheng, Guangping, Lei Shi, Junhui Li, et al.. (2018). High-performance ultra-low-k fluorine-doped nanoporous organosilica films for inter-layer dielectric. Journal of Materials Science. 54(3). 2379–2391. 23 indexed citations
17.
Chen, Zhuo, Fu Jiang, Yijun Cheng, et al.. (2018). XGBoost Classifier for DDoS Attack Detection and Analysis in SDN-Based Cloud. 251–256. 168 indexed citations
18.
Li, Junhui, Haoliang Zhang, Can Zhou, et al.. (2018). A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging. IEEE Transactions on Industrial Informatics. 15(7). 3808–3820. 10 indexed citations
19.
Li, Jiadong, et al.. (2018). A RQPSO Algorithm for Multiphase Equilibrium Calculation in the KIVCET Process. JOM. 70(12). 2893–2899. 3 indexed citations
20.
Xie, Zhonglei, et al.. (2007). Distribution of aluminum and fluoride in tea plant and soil of tea garden in Central and Southwest China. Chinese Geographical Science. 17(4). 376–382. 29 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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