T.Y. Lin
Impact in
- Mechanics of Materials top 10%
- Mechanical Behavior of Composites
- Material Properties and Processing
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- Electronic Packaging and Soldering Technologies
- Fuel Cells and Related Materials
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 19
- Electrostatic Discharge in Electronics 11
- 3D IC and TSV technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 7
- Semiconductor materials and devices 4
- Silicon Carbide Semiconductor Technologies 3
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- Mechanical Behavior of Composites 9
- Co-authors
- A.A.O. Tay (6 shared papers)Satish G. Kandlikar (1 shared paper)Michael Daino (1 shared paper)Zijie Lu (1 shared paper)Dwight Cooke (1 shared paper)Chauchin Su (5 shared papers)Yingchieh Ho (4 shared papers)Mingxiang Chen (1 shared paper)
- Journals
- Microelectronics Reliability (4 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)IEEE Transactions on Electron Devices (2 papers)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- TaiwanSingaporeUnited States
In The Last Decade
T.Y. Lin
37 papers receiving 478 citations
Peers
Comparison fields: 5 of 49
- Mechanics of Materials 167
- Electrical and Electronic Engineering 364
- Renewable Energy, Sustainability and the Environment 64
- Mechanical Engineering 140
- Automotive Engineering 26
Countries citing papers authored by T.Y. Lin
This map shows the geographic impact of T.Y. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.Y. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.Y. Lin more than expected).
Fields of papers citing papers by T.Y. Lin
This network shows the impact of papers produced by T.Y. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.Y. Lin. The network helps show where T.Y. Lin may publish in the future.
Co-authors
The 25 scholars most cited alongside T.Y. Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 41 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 93 | |
| 2 | 1999 | 51 | |
| 3 | 2007 | 50 | |
| 4 | 2002 | 33 | |
| 5 | 2002 | 28 | |
| 6 | 2006 | 26 | |
| 7 | 2012 | 22 | |
| 8 | 2003 | 21 | |
| 9 | 2003 | 16 | |
| 10 | 2003 | 16 | |
| 11 | 1978 | 13 | |
| 12 | 2002 | 12 | |
| 13 | 2003 | 11 | |
| 14 | 2017 | 11 | |
| 15 | 2007 | 9 | |
| 16 | 2003 | 9 | |
| 17 | 2005 | 9 | |
| 18 | 2008 | 8 | |
| 19 | 2002 | 8 | |
| 20 | 2018 | 7 |
About T.Y. Lin
T.Y. Lin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Automotive Engineering, having authored 41 papers that have together received 511 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), Electrostatic Discharge in Electronics (11 papers), 3D IC and TSV technologies (11 papers), Mechanical Behavior of Composites (9 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Semiconductor materials and devices (4 papers), Heat Transfer and Optimization (3 papers) and Silicon Carbide Semiconductor Technologies (3 papers). The work is most often cited by research in Mechanics of Materials (167 citations), Electrical and Electronic Engineering (364 citations), Renewable Energy, Sustainability and the Environment (64 citations), Mechanical Engineering (140 citations) and Automotive Engineering (26 citations). T.Y. Lin has collaborated with scholars based in Taiwan, Singapore and United States. Frequent co-authors include A.A.O. Tay, Satish G. Kandlikar, Michael Daino, Zijie Lu, Dwight Cooke, Chauchin Su, Yingchieh Ho, Mingxiang Chen, Sheng Liu and Xiaobing Luo. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electron Devices, IEEE Transactions on Electronics Packaging Manufacturing and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.