T.Y. Lin

650 total citations
40 papers, 507 citations indexed

About

T.Y. Lin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, T.Y. Lin has authored 40 papers receiving a total of 507 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 6 papers in Mechanical Engineering. Recurrent topics in T.Y. Lin's work include Electronic Packaging and Soldering Technologies (19 papers), Electrostatic Discharge in Electronics (11 papers) and 3D IC and TSV technologies (11 papers). T.Y. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), Electrostatic Discharge in Electronics (11 papers) and 3D IC and TSV technologies (11 papers). T.Y. Lin collaborates with scholars based in Taiwan, Singapore and United States. T.Y. Lin's co-authors include A.A.O. Tay, Zijie Lu, Satish G. Kandlikar, Dwight Cooke, Michael Daino, Yingchieh Ho, Chauchin Su, Xiaoping Ren, Sheng Liu and Mingxiang Chen and has published in prestigious journals such as Journal of Power Sources, Sensors and IEEE Transactions on Electron Devices.

In The Last Decade

T.Y. Lin

36 papers receiving 473 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T.Y. Lin Taiwan	12	360	167	140	76	67	40	507
Vadim Gektin United States	9	211 0.6×	59 0.4×	230 1.6×	39 0.5×	72 1.1×	28	413
Gerd Schlottig Switzerland	13	378 1.1×	160 1.0×	356 2.5×	99 1.3×	113 1.7×	58	684
Paul G. Harris United Kingdom	11	267 0.7×	88 0.5×	157 1.1×	57 0.8×	64 1.0×	21	444
Yanlei Zhang China	12	252 0.7×	129 0.8×	82 0.6×	45 0.6×	59 0.9×	39	600
Xiaodong Wang China	12	121 0.3×	92 0.6×	297 2.1×	199 2.6×	44 0.7×	62	541
Yong Woo Rho South Korea	10	268 0.7×	115 0.7×	210 1.5×	100 1.3×	73 1.1×	14	519
Fengze Hou China	16	447 1.2×	48 0.3×	257 1.8×	63 0.8×	65 1.0×	52	658
Chung‐Chen Tsao Taiwan	11	200 0.6×	53 0.3×	238 1.7×	160 2.1×	82 1.2×	28	338
Seokmoo Hong South Korea	10	182 0.5×	107 0.6×	171 1.2×	71 0.9×	111 1.7×	68	419

Countries citing papers authored by T.Y. Lin

Since Specialization

Citations

This map shows the geographic impact of T.Y. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.Y. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.Y. Lin more than expected).

Fields of papers citing papers by T.Y. Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T.Y. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.Y. Lin. The network helps show where T.Y. Lin may publish in the future.

Co-authorship network of co-authors of T.Y. Lin

This figure shows the co-authorship network connecting the top 25 collaborators of T.Y. Lin. A scholar is included among the top collaborators of T.Y. Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T.Y. Lin. T.Y. Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Lee, Jian‐Hsing, et al.. (2021). The Failure Mechansim of the E-SOA Boundary of Power Transistor Collapsed at Higher Gate Voltage. 4 indexed citations

Ker, Ming‐Dou, et al.. (2018). Improving Safe-Operating-Area of a 5-V n-Channel Large Array MOSFET in a 0.15-<inline-formula> <tex-math notation="LaTeX">$\mu$ </tex-math> </inline-formula>m BCD Process. IEEE Transactions on Electron Devices. 65(7). 2948–2956. 6 indexed citations

Lin, T.Y., Yingchieh Ho, & Chauchin Su. (2017). High-R Poly Resistance Deviation Improvement From Suppressions of Back-End Mechanical Stresses. IEEE Transactions on Electron Devices. 64(10). 4233–4241. 10 indexed citations

Chen, Hung-Wei, et al.. (2017). ESD protection and driving capability switch control circuits for large array NMOSFET driving devices. 1–2.

Zhang, Hengyun, et al.. (2016). Thermal evaluation of partially molded 2.5D package with pin fin heat sink cooling. 45. 461–467. 3 indexed citations

Lai, Jui‐Lin, et al.. (2010). Design a low-noise operational amplifier with constant-gm. Society of Instrument and Control Engineers of Japan. 322–326. 6 indexed citations

Kandlikar, Satish G., Zijie Lu, T.Y. Lin, Dwight Cooke, & Michael Daino. (2009). Uneven gas diffusion layer intrusion in gas channel arrays of proton exchange membrane fuel cell and its effects on flow distribution. Journal of Power Sources. 194(1). 328–337. 92 indexed citations

Das, Diganta, et al.. (2007). Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process. IEEE Transactions on Electronics Packaging Manufacturing. 30(2). 128–137. 9 indexed citations

Lin, T.Y., et al.. (2007). Heat transfer characteristics of water flow in microtubes. Experimental Thermal and Fluid Science. 32(2). 432–439. 50 indexed citations

10.

Lin, T.Y., et al.. (2006). The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages. IEEE Transactions on Components and Packaging Technologies. 29(3). 522–527. 5 indexed citations

11.

Lin, T.Y., et al.. (2006). HEAT TRANSFER PERFORMANCE OF WATER FLOW IN MICRO TUBES. 2 indexed citations

12.

Lin, T.Y., et al.. (2004). Improving the deflection of wire bonds in stacked chip scale package (CSP). 4 1. 1359–1363. 2 indexed citations

13.

Lin, T.Y., et al.. (2004). The impact of moisture in mold compound preforms on the warpage of PBGA packages. 273–278. 6 indexed citations

14.

Lin, T.Y., et al.. (2003). Failure Analysis of Full Delamination on the Stacked Die Leaded Packages. Journal of Electronic Packaging. 125(3). 392–399. 11 indexed citations

15.

Lin, T.Y.. (2003). Bottlenecks and strategies of green mold compounds. IEEE Transactions on Components and Packaging Technologies. 26(2). 492–494. 6 indexed citations

16.

Tay, A.A.O. & T.Y. Lin. (2003). The impact of moisture diffusion during solder reflow on package reliability. 830–836. 16 indexed citations

17.

Tay, A.A.O. & T.Y. Lin. (2002). Effects of moisture and delamination on cracking of plastic IC packages during solder reflow. 777–782. 28 indexed citations

18.

Lin, T.Y. & A.A.O. Tay. (2002). Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering. 163–169. 8 indexed citations

19.

Tay, A.A.O. & T.Y. Lin. (1999). Influence of temperature, humidity, and defect location on delamination in plastic IC packages. IEEE Transactions on Components and Packaging Technologies. 22(4). 512–518. 51 indexed citations

20.

Lin, T.Y., et al.. (1978). NUMERICAL SOLUTION OF HEAT TRANSFER TO YIELD POWER LAW FLUIDS FLOWING IN THE ENTRANCE REGION. Proceeding of International Heat Transfer Conference 6. 317–322. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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