T.B. Lim

1.0k total citations
40 papers, 833 citations indexed

About

T.B. Lim is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Surfaces, Coatings and Films. According to data from OpenAlex, T.B. Lim has authored 40 papers receiving a total of 833 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Mechanics of Materials, 18 papers in Electrical and Electronic Engineering and 10 papers in Surfaces, Coatings and Films. Recurrent topics in T.B. Lim's work include Electronic Packaging and Soldering Technologies (18 papers), Surface Modification and Superhydrophobicity (10 papers) and Mechanical Behavior of Composites (8 papers). T.B. Lim is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), Surface Modification and Superhydrophobicity (10 papers) and Mechanical Behavior of Composites (8 papers). T.B. Lim collaborates with scholars based in Singapore, Australia and United States. T.B. Lim's co-authors include E.H. Wong, R. Rajoo, C.Q. Cui, A.A.O. Tay, E. T. Kang, K.C. Chan, K. G. Neoh, Sau Koh, Xuejun Fan and K. L. Tan and has published in prestigious journals such as Chemosphere, Polymer and Advanced Science.

In The Last Decade

T.B. Lim

39 papers receiving 780 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
T.B. Lim Singapore 17 495 360 180 127 123 40 833
Frank L. Palmieri United States 16 198 0.4× 298 0.8× 207 1.1× 262 2.1× 182 1.5× 58 859
Zhenhao Zhao China 9 205 0.4× 200 0.6× 179 1.0× 147 1.2× 61 0.5× 12 719
Hongfu Li China 18 352 0.7× 200 0.6× 303 1.7× 96 0.8× 224 1.8× 116 984
Congda Lu China 15 351 0.7× 116 0.3× 283 1.6× 204 1.6× 60 0.5× 41 886
Jinfang Zhou China 16 311 0.6× 158 0.4× 277 1.5× 205 1.6× 67 0.5× 39 977
Hongyan Wu China 15 189 0.4× 83 0.2× 118 0.7× 147 1.2× 126 1.0× 58 661
Dumitru I. Caruntu United States 14 284 0.6× 111 0.3× 65 0.4× 303 2.4× 51 0.4× 66 739
Yin Yao China 16 99 0.2× 205 0.6× 205 1.1× 241 1.9× 99 0.8× 39 734
Philippe Chaudet France 11 99 0.2× 185 0.5× 365 2.0× 84 0.7× 52 0.4× 29 754
Guojun Ji China 15 84 0.2× 130 0.4× 162 0.9× 99 0.8× 59 0.5× 35 551

Countries citing papers authored by T.B. Lim

Since Specialization
Citations

This map shows the geographic impact of T.B. Lim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.B. Lim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.B. Lim more than expected).

Fields of papers citing papers by T.B. Lim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T.B. Lim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.B. Lim. The network helps show where T.B. Lim may publish in the future.

Co-authorship network of co-authors of T.B. Lim

This figure shows the co-authorship network connecting the top 25 collaborators of T.B. Lim. A scholar is included among the top collaborators of T.B. Lim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T.B. Lim. T.B. Lim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Lim, T.B., Xu Ren, Benito C. Tan, & Jeffrey Philip Obbard. (2006). Persistent organic pollutants in moss as bioindicators of atmospheric pollution in Singapore. Chemosphere. 64(4). 596–602. 19 indexed citations
3.
Wong, E.H., Yiu‐Wing Mai, S.K.W. Seah, Kian Meng Lim, & T.B. Lim. (2006). Analytical Solutions for Interconnect Stress in Board Level Drop Impact. National University of Singapore. 23. 1808–1815. 7 indexed citations
4.
5.
Teo, Yong‐Chua, et al.. (2002). Reliability assessment of transfer molded CSP. 274–278. 1 indexed citations
6.
Cui, C.Q. & T.B. Lim. (2002). Enhancing adhesion between mold compound and substrate in BGA packaging. 544–549. 3 indexed citations
7.
Cui, C.Q., et al.. (2002). Surface treatment of copper for the adhesion improvement to epoxy mold compounds. 1162–1166. 17 indexed citations
8.
Wong, E.H., K.C. Chan, R. Rajoo, & T.B. Lim. (2002). The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging. 576–580. 113 indexed citations
9.
Teo, Yong‐Chua, et al.. (2002). Low cost chip-scale package. 358–362. 2 indexed citations
10.
Kang, E. T., et al.. (2001). Plasma polymerization and deposition of glycidyl methacrylate on Si(100) surface for adhesion improvement with polyimide. Polymers for Advanced Technologies. 12(10). 583–595. 18 indexed citations
11.
Fan, Xuejun, et al.. (2001). Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading. IEEE Transactions on Components and Packaging Technologies. 24(1). 84–91. 67 indexed citations
12.
Kang, E. T., et al.. (2000). Modification of poly(tetrafluoroethylene) and copper foil surfaces by graft polymerization for adhesion improvement. International Journal of Adhesion and Adhesives. 20(6). 467–476. 11 indexed citations
13.
Zhang, Yan, K. L. Tan, Junfeng Zhang, et al.. (2000). Thermal graft copolymerization-induced adhesion improvement of a FR-4®/PETG® laminate. International Journal of Adhesion and Adhesives. 20(2). 165–171. 5 indexed citations
14.
15.
Kang, E. T., et al.. (1998). Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils. Journal of Adhesion Science and Technology. 12(8). 889–900. 18 indexed citations
16.
Wang, Tie, K. G. Neoh, K. L. Tan, et al.. (1996). Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization. Materials Research Bulletin. 31(11). 1361–1373. 5 indexed citations
17.
Tay, A.A.O., K. S. Yeo, Jichuan Wu, & T.B. Lim. (1995). Wirebond Deformation During Molding of IC Packages. Journal of Electronic Packaging. 117(1). 14–19. 21 indexed citations
18.
Tay, A.A.O., et al.. (1993). A criterion for predicting delamination in plastic IC packages. 14. 236–243. 19 indexed citations
19.
Ng, Kim Choon, T.Y. Bong, & T.B. Lim. (1990). A thermodynamic model for the analysis of screw expander performance. Heat Recovery Systems and CHP. 10(2). 119–133. 42 indexed citations
20.
Lim, T.B., et al.. (1989). Analysis of Screw-Expander Performance. Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering. 203(1). 15–20. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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