Martin Corfield

950 total citations
35 papers, 783 citations indexed

About

Martin Corfield is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Martin Corfield has authored 35 papers receiving a total of 783 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 8 papers in Materials Chemistry. Recurrent topics in Martin Corfield's work include Electronic Packaging and Soldering Technologies (12 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Advanced Welding Techniques Analysis (7 papers). Martin Corfield is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Advanced Welding Techniques Analysis (7 papers). Martin Corfield collaborates with scholars based in United Kingdom, Nigeria and China. Martin Corfield's co-authors include C. Mark Johnson, Jianfeng Li, Pearl Agyakwa, Adam T. Clare, Richard Leach, Ian Maskery, Christopher Tuck, Nesma T. Aboulkhair, Ian Ashcroft and Richard Hague and has published in prestigious journals such as Chemical Engineering Journal, IEEE Transactions on Industrial Electronics and IEEE Transactions on Power Electronics.

In The Last Decade

Martin Corfield

34 papers receiving 752 citations

Peers

Countries citing papers authored by Martin Corfield

Since Specialization

Citations

This map shows the geographic impact of Martin Corfield's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Martin Corfield with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Martin Corfield more than expected).

Fields of papers citing papers by Martin Corfield

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Martin Corfield. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Martin Corfield. The network helps show where Martin Corfield may publish in the future.

Co-authorship network of co-authors of Martin Corfield

This figure shows the co-authorship network connecting the top 25 collaborators of Martin Corfield. A scholar is included among the top collaborators of Martin Corfield based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Martin Corfield. Martin Corfield is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Analytical Calculation and Experimental Validation of Litz Wires Axial Thermal Conductivity 2023 ·IEEE Transactions on Transportation Electrification ·(unknown), Zeyuan Xu, Fengyu Zhang, David Gerada, (unknown), Hengliang Zhang, Martin Corfield, Chris Gerada, Chengning Zhang	8
2	Three-dimensional high-resolution image inversion and pore level CFD characterisation of effective thermal conductivity of replicated microcellular structures 2022 ·International Journal of Thermofluids ·Abdulrazak Jinadu Otaru, (unknown), A. S. Kovo, Martin Corfield, (unknown), (unknown), Anatole Kenfack, (unknown)	6
3	Numerical modelling and optimisation of reverberation cutback for packed spheres 2021 ·Journal of King Saud University - Engineering Sciences ·Abdulrazak Jinadu Otaru, (unknown), (unknown), Abubakar Isah, Martin Corfield	4
4	A new method for assessing the utility of powder bed fusion (PBF) feedstock through life 2020 ·Arrow@dit (Dublin Institute of Technology) ·Nima E. Gorji, Prateek Saxena, Martin Corfield, Adam T. Clare, Jean‐Pascal Rueff, J. Bogan, Pierre Giovanni Mani-González, (unknown), G. Hughes, Robert O’Connor, Ramesh Raghavendra, Dermot Brabazon	2
5	Packaging degradation studies of High Temperature SiC MOSFET discrete packages 2020 ·Bassem Mouawad, Li Yang, Pearl Agyakwa, Martin Corfield, C. Mark Johnson	9
6	A new method for assessing the recyclability of powders within Powder Bed Fusion process 2020 ·Materials Characterization ·Nima E. Gorji, Prateek Saxena, Martin Corfield, Adam T. Clare, Jean‐Pascal Rueff, J. Bogan, Pierre Giovanni Mani-González, (unknown), G. Hughes, Robert O’Connor, Ramesh Raghavendra, Dermot Brabazon	60
7	Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process 2020 ·Microelectronics Reliability ·(unknown), Jianfeng Li, Pearl Agyakwa, Martin Corfield, C. Mark Johnson	10
8	Pressure Drop in High-Density Porous Metals via Tomography Datasets 2019 ·Metals and Materials International ·Abdulrazak Jinadu Otaru, (unknown), (unknown), (unknown), (unknown), Martin Corfield	4
9	Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules 2019 ·Journal of Microscopy ·Pearl Agyakwa, (unknown), (unknown), Bassem Mouawad, Li Yang, Martin Corfield, C. Mark Johnson	11
10	Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior 2017 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Jianfeng Li, (unknown), Martin Corfield, C. Mark Johnson	6
11	Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 2017 ·IEEE Journal of Emerging and Selected Topics in Power Electronics ·Hui Zhang, Jianfeng Li, (unknown), Martin Corfield, Xuejian Liu, Yan Liu, Zhengren Huang, C. Mark Johnson	6
12	A thermal cycling reliability study of ultrasonically bonded copper wires 2016 ·Microelectronics Reliability ·(unknown), Pearl Agyakwa, Martin Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson	18
13	Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K 2016 ·Journal of Electronic Materials ·Pearl Agyakwa, Li Yang, (unknown), Paul Evans, Martin Corfield, C. Mark Johnson	18
14	Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator 2016 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·(unknown), Pearl Agyakwa, Martin Corfield, Jianfeng Li, C. Mark Johnson	12
15	Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects 2014 ·IEEE Transactions on Power Electronics ·Jianfeng Li, Alberto Castellazzi, (unknown), Martin Corfield, (unknown), C. Mark Johnson	37
16	Real-time degradation monitoring and lifetime estimation of 3D integrated bond-wire-less double-sided cooled power switch technologies 2013 ·(unknown), Jianfeng Li, Martin Corfield, Alberto Castellazzi, Patrick Wheeler	5
17	Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires 2013 ·Journal of Electronic Materials ·Pearl Agyakwa, (unknown), Martin Corfield, Jianfeng Li, Li Yang, C. Mark Johnson	10
18	Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling 2010 ·IEEE Transactions on Device and Materials Reliability ·Pearl Agyakwa, Martin Corfield, Jianfeng Li, (unknown), Enzo Liotti, S. C. Hogg, C. Mark Johnson	11
19	The effects of annealing at 1000°C for 24h on the extrinsic properties of Pr–Fe–B and Nd–Fe–B-type sintered magnets 2009 ·Journal of Magnetism and Magnetic Materials ·Martin Corfield, I.R. Harris, A. Williams	5
20	Study of solid-state reactions in Sm(Co, Fe, Cu, Zr)z 2:17-type alloys by means of in situ electrical resistivity measurements 2007 ·Journal of Magnetism and Magnetic Materials ·Martin Corfield, I.R. Harris, A. Williams	0

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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