Martin Corfield

950 total citations
35 papers, 783 citations indexed

About

Martin Corfield is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Martin Corfield has authored 35 papers receiving a total of 783 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 8 papers in Materials Chemistry. Recurrent topics in Martin Corfield's work include Electronic Packaging and Soldering Technologies (12 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Advanced Welding Techniques Analysis (7 papers). Martin Corfield is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Advanced Welding Techniques Analysis (7 papers). Martin Corfield collaborates with scholars based in United Kingdom, Nigeria and China. Martin Corfield's co-authors include C. Mark Johnson, Jianfeng Li, Pearl Agyakwa, Adam T. Clare, Richard Leach, Ian Maskery, Christopher Tuck, Nesma T. Aboulkhair, Ian Ashcroft and Richard Hague and has published in prestigious journals such as Chemical Engineering Journal, IEEE Transactions on Industrial Electronics and IEEE Transactions on Power Electronics.

In The Last Decade

Martin Corfield

34 papers receiving 752 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Martin Corfield United Kingdom 13 467 334 241 78 74 35 783
Todd Henry United States 14 262 0.6× 145 0.4× 116 0.5× 77 1.0× 94 1.3× 83 601
Doo‐Sun Choi South Korea 11 300 0.6× 131 0.4× 183 0.8× 164 2.1× 61 0.8× 58 509
Liangliang Yang China 10 283 0.6× 143 0.4× 175 0.7× 102 1.3× 195 2.6× 21 560
S. Inoue Japan 16 162 0.3× 658 2.0× 135 0.6× 89 1.1× 162 2.2× 59 892
Donald Francis Susan United States 16 514 1.1× 245 0.7× 148 0.6× 33 0.4× 273 3.7× 49 800
Sean Gibbons United States 13 536 1.1× 176 0.5× 160 0.7× 23 0.3× 233 3.1× 21 693
Jing-Chie Lin Taiwan 16 270 0.6× 296 0.9× 97 0.4× 118 1.5× 238 3.2× 38 616
David Bušek Czechia 14 301 0.6× 490 1.5× 41 0.2× 68 0.9× 66 0.9× 82 614
Guolin Wang China 14 520 1.1× 322 1.0× 227 0.9× 48 0.6× 488 6.6× 31 1.1k
Ze Chai China 18 607 1.3× 167 0.5× 90 0.4× 177 2.3× 230 3.1× 46 775

Countries citing papers authored by Martin Corfield

Since Specialization
Citations

This map shows the geographic impact of Martin Corfield's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Martin Corfield with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Martin Corfield more than expected).

Fields of papers citing papers by Martin Corfield

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Martin Corfield. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Martin Corfield. The network helps show where Martin Corfield may publish in the future.

Co-authorship network of co-authors of Martin Corfield

This figure shows the co-authorship network connecting the top 25 collaborators of Martin Corfield. A scholar is included among the top collaborators of Martin Corfield based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Martin Corfield. Martin Corfield is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Xu, Zeyuan, Fengyu Zhang, David Gerada, et al.. (2023). Analytical Calculation and Experimental Validation of Litz Wires Axial Thermal Conductivity. IEEE Transactions on Transportation Electrification. 10(1). 1167–1179. 8 indexed citations
2.
Otaru, Abdulrazak Jinadu, et al.. (2022). Three-dimensional high-resolution image inversion and pore level CFD characterisation of effective thermal conductivity of replicated microcellular structures. International Journal of Thermofluids. 14. 100141–100141. 6 indexed citations
3.
Otaru, Abdulrazak Jinadu, et al.. (2021). Numerical modelling and optimisation of reverberation cutback for packed spheres. Journal of King Saud University - Engineering Sciences. 4 indexed citations
4.
Gorji, Nima E., Prateek Saxena, Martin Corfield, et al.. (2020). A new method for assessing the utility of powder bed fusion (PBF) feedstock through life. Arrow@dit (Dublin Institute of Technology). 2 indexed citations
5.
Mouawad, Bassem, Li Yang, Pearl Agyakwa, Martin Corfield, & C. Mark Johnson. (2020). Packaging degradation studies of High Temperature SiC MOSFET discrete packages. 90–93. 9 indexed citations
6.
Gorji, Nima E., Prateek Saxena, Martin Corfield, et al.. (2020). A new method for assessing the recyclability of powders within Powder Bed Fusion process. Materials Characterization. 161. 110167–110167. 60 indexed citations
7.
Li, Jianfeng, et al.. (2020). Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process. Microelectronics Reliability. 111. 113740–113740. 10 indexed citations
8.
Otaru, Abdulrazak Jinadu, et al.. (2019). Pressure Drop in High-Density Porous Metals via Tomography Datasets. Metals and Materials International. 27(4). 603–609. 4 indexed citations
9.
Agyakwa, Pearl, et al.. (2019). Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules. Journal of Microscopy. 277(3). 140–153. 11 indexed citations
10.
Li, Jianfeng, et al.. (2017). Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(5). 734–744. 6 indexed citations
11.
Zhang, Hui, Jianfeng Li, Martin Corfield, et al.. (2017). Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure. IEEE Journal of Emerging and Selected Topics in Power Electronics. 6(1). 175–187. 6 indexed citations
12.
Agyakwa, Pearl, et al.. (2016). A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability. 59. 126–133. 18 indexed citations
13.
Agyakwa, Pearl, et al.. (2016). Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K. Journal of Electronic Materials. 45(7). 3659–3672. 18 indexed citations
14.
Agyakwa, Pearl, et al.. (2016). Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(5). 814–821. 12 indexed citations
15.
Li, Jianfeng, et al.. (2014). Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects. IEEE Transactions on Power Electronics. 30(5). 2587–2600. 37 indexed citations
16.
17.
Agyakwa, Pearl, et al.. (2013). Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires. Journal of Electronic Materials. 42(3). 537–544. 10 indexed citations
18.
Agyakwa, Pearl, Martin Corfield, Jianfeng Li, et al.. (2010). Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling. IEEE Transactions on Device and Materials Reliability. 10(2). 254–262. 11 indexed citations
19.
Corfield, Martin, I.R. Harris, & A. Williams. (2009). The effects of annealing at 1000°C for 24h on the extrinsic properties of Pr–Fe–B and Nd–Fe–B-type sintered magnets. Journal of Magnetism and Magnetic Materials. 322(1). 36–45. 5 indexed citations
20.
Corfield, Martin, I.R. Harris, & A. Williams. (2007). Study of solid-state reactions in Sm(Co, Fe, Cu, Zr)z 2:17-type alloys by means of in situ electrical resistivity measurements. Journal of Magnetism and Magnetic Materials. 316(1). 59–66.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Todd Henry Breakdown of academic impact, for papers by Doo‐Sun Choi Breakdown of academic impact, for papers by Liangliang Yang Breakdown of academic impact, for papers by S. Inoue Breakdown of academic impact, for papers by Donald Francis Susan Breakdown of academic impact, for papers by Sean Gibbons Breakdown of academic impact, for papers by Jing-Chie Lin Breakdown of academic impact, for papers by David Bušek Breakdown of academic impact, for papers by Guolin Wang Breakdown of academic impact, for papers by Ze Chai
Rankless by CCL
2026