Martin Corfield
- Mechanical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Automotive Engineering top 5%
- Biomedical Engineering
- Materials Chemistry
- Co-authors
- C. Mark JohnsonJianfeng LiPearl AgyakwaAdam T. ClareRichard LeachIan MaskeryChristopher TuckNesma T. Aboulkhair
- Topics
- Electronic Packaging and Soldering Technologies (12 papers)Silicon Carbide Semiconductor Technologies (8 papers)Advanced Welding Techniques Analysis (7 papers)
- Journals
- Chemical Engineering JournalIEEE Transactions on Industrial ElectronicsIEEE Transactions on Power Electronics
- Partner nations
- United KingdomNigeriaChina
In The Last Decade
Martin Corfield
34 papers receiving 752 citations
Peers
Comparison fields: 5 of 55
- Mechanical Engineering 467
- Electrical and Electronic Engineering 334
- Automotive Engineering 241
- Biomedical Engineering 78
- Materials Chemistry 74
Countries citing papers authored by Martin Corfield
This map shows the geographic impact of Martin Corfield's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Martin Corfield with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Martin Corfield more than expected).
Fields of papers citing papers by Martin Corfield
This network shows the impact of papers produced by Martin Corfield. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Martin Corfield. The network helps show where Martin Corfield may publish in the future.
Co-authorship network of co-authors of Martin Corfield
This figure shows the co-authorship network connecting the top 25 collaborators of Martin Corfield. A scholar is included among the top collaborators of Martin Corfield based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Martin Corfield. Martin Corfield is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 8 | |
| 2 | 6 | |
| 3 | 4 | |
| 4 | A new method for assessing the utility of powder bed fusion (PBF) feedstock through life | 2 |
| 5 | 9 | |
| 6 | 60 | |
| 7 | 10 | |
| 8 | 4 | |
| 9 | 11 | |
| 10 | 6 | |
| 11 | 6 | |
| 12 | 18 | |
| 13 | 18 | |
| 14 | 12 | |
| 15 | 37 | |
| 16 | 5 | |
| 17 | 10 | |
| 18 | 11 | |
| 19 | 5 | |
| 20 | 0 |
About Martin Corfield
Martin Corfield is a scholar working on Mechanical Engineering, Automotive Engineering and Ceramics and Composites, having authored 35 papers that have together received 783 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Advanced Welding Techniques Analysis (7 papers). The work is most often cited by research in Automotive Engineering (241 citations), Mechanical Engineering (467 citations) and Electrical and Electronic Engineering (334 citations). Martin Corfield has collaborated with scholars based in United Kingdom, Nigeria and China. Frequent co-authors include C. Mark Johnson, Jianfeng Li, Pearl Agyakwa, Adam T. Clare, Richard Leach, Ian Maskery, Christopher Tuck, Nesma T. Aboulkhair, Ian Ashcroft and Richard Hague. Their work appears in journals such as Chemical Engineering Journal, IEEE Transactions on Industrial Electronics and IEEE Transactions on Power Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.