Jeremy Theil

1.1k total citations
48 papers, 944 citations indexed

About

Jeremy Theil is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Jeremy Theil has authored 48 papers receiving a total of 944 indexed citations (citations by other indexed papers that have themselves been cited), including 44 papers in Electrical and Electronic Engineering, 24 papers in Materials Chemistry and 7 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Jeremy Theil's work include Thin-Film Transistor Technologies (20 papers), Silicon Nanostructures and Photoluminescence (16 papers) and 3D IC and TSV technologies (13 papers). Jeremy Theil is often cited by papers focused on Thin-Film Transistor Technologies (20 papers), Silicon Nanostructures and Photoluminescence (16 papers) and 3D IC and TSV technologies (13 papers). Jeremy Theil collaborates with scholars based in United States, Germany and Japan. Jeremy Theil's co-authors include Eiji Kusano, D. V. Tsu, G. Lucovsky, Guilian Gao, Laura Mirkarimi, G. G. Fountain, Bongsub Lee, John G. Brace, G. Lucovsky and Cyprian Uzoh and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

Jeremy Theil

46 papers receiving 867 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jeremy Theil United States 18 778 384 198 134 125 48 944
L.P. Buchwalter United States 18 776 1.0× 191 0.5× 135 0.7× 233 1.7× 184 1.5× 33 1.0k
Shin-Puu Jeng Taiwan 17 649 0.8× 418 1.1× 161 0.8× 54 0.4× 101 0.8× 58 1.0k
Soner Özen Türkiye 18 543 0.7× 628 1.6× 162 0.8× 158 1.2× 99 0.8× 81 968
T. Spila United States 16 821 1.1× 355 0.9× 206 1.0× 134 1.0× 87 0.7× 35 1.1k
M. Radhakrishnan India 19 603 0.8× 377 1.0× 156 0.8× 55 0.4× 72 0.6× 87 1.1k
A. Schneuwly Switzerland 12 281 0.4× 212 0.6× 185 0.9× 73 0.5× 202 1.6× 18 576
André Van Calster Belgium 18 684 0.9× 331 0.9× 156 0.8× 77 0.6× 215 1.7× 140 960
Jaikwang Shin South Korea 18 931 1.2× 511 1.3× 396 2.0× 66 0.5× 142 1.1× 33 1.3k
Takeshi Bessho Japan 19 512 0.7× 256 0.7× 131 0.7× 62 0.5× 181 1.4× 50 825
Youl-Moon Sung South Korea 17 629 0.8× 604 1.6× 114 0.6× 186 1.4× 124 1.0× 97 1.0k

Countries citing papers authored by Jeremy Theil

Since Specialization
Citations

This map shows the geographic impact of Jeremy Theil's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeremy Theil with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeremy Theil more than expected).

Fields of papers citing papers by Jeremy Theil

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jeremy Theil. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeremy Theil. The network helps show where Jeremy Theil may publish in the future.

Co-authorship network of co-authors of Jeremy Theil

This figure shows the co-authorship network connecting the top 25 collaborators of Jeremy Theil. A scholar is included among the top collaborators of Jeremy Theil based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeremy Theil. Jeremy Theil is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Mirkarimi, Laura, Cyprian Uzoh, Dominik Suwito, et al.. (2022). The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 162–167. 27 indexed citations
2.
Gao, Guilian, Cyprian Uzoh, Laura Mirkarimi, et al.. (2020). Die to Wafer Stacking with Low Temperature Hybrid Bonding. 589–594. 33 indexed citations
3.
Gao, Guilian, Jeremy Theil, G. G. Fountain, et al.. (2020). Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration. 1–8. 13 indexed citations
4.
Theil, Jeremy, et al.. (2019). Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect. 1–6. 30 indexed citations
5.
Gao, Guilian, P. Mrozek, Laura Mirkarimi, et al.. (2019). Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study. 1–9. 23 indexed citations
6.
7.
Agarwal, Manu, et al.. (2006). Characterization of a Dipole Surface Drive Actuator With Large Travel and Force. Journal of Microelectromechanical Systems. 15(6). 1726–1734. 6 indexed citations
8.
9.
Kohli, Sandeep, Jeremy Theil, P. Dippo, et al.. (2004). Chemical, optical, vibrational and luminescent properties of hydrogenated silicon-rich oxynitride films. Thin Solid Films. 473(1). 89–97. 13 indexed citations
10.
Kohli, Sandeep, Jeremy Theil, P. Dippo, et al.. (2004). Nanocrystal formation in annealed a-SiO0.17N0.07:H films. Nanotechnology. 15(12). 1831–1836. 23 indexed citations
11.
Kohli, Sandeep, et al.. (2003). Nanocrystal formation in thermally oxidized and annealed a-Si:H films and SiO x N y films (x=0.17; y=0.07). Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5224. 8–8. 1 indexed citations
12.
Antoniadis, Homer, Daniel B. Roitman, Travis N. Blalock, et al.. (2001). XGA resolution full-video microdisplay using light-emitting polymers on a silicon active matrix circuit. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4105. 37–37. 2 indexed citations
13.
Theil, Jeremy, et al.. (2000). Hydrogenated Amorphous Silicon Photodiode Technology for Advanced CMOS Active Pixel Sensor Imagers. MRS Proceedings. 609. 10 indexed citations
14.
Theil, Jeremy. (1999). Fluorinated amorphous carbon films for low permittivity interlevel dielectrics. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 17(6). 2397–2410. 64 indexed citations
15.
Theil, Jeremy, Eiji Kusano, & Angus Rockett. (1997). Vanadium reactive magnetron sputtering in mixed Ar/O2 discharges. Thin Solid Films. 298(1-2). 122–129. 23 indexed citations
16.
17.
Theil, Jeremy. (1995). Gas distribution through injection manifolds in vacuum systems. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 13(2). 442–447. 5 indexed citations
18.
Theil, Jeremy, et al.. (1994). The effects of He plasma interactions with SiH4 in remote plasma enhanced chemical vapor deposition. Journal of Applied Physics. 75(5). 2652–2666. 13 indexed citations
19.
Theil, Jeremy, G. Lucovsky, S. V. Hattangady, G. G. Fountain, & R. J. Markunas. (1991). Studies of SiH2Ci2/H2 Gas Phase Chemistry for Selective Thin Film Growth of Crystalline Silicon, c-Si, Using Remote Plasma Enhanced Chemical Vapor Deposition. MRS Proceedings. 220. 2 indexed citations
20.
Tsu, D. V., et al.. (1990). Preparation and properties of SiO2–SiOx heterostructures formed by uninterrupted processing by remote plasma enhanced chemical vapor deposition. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 8(3). 1430–1436. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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