Daniel I. Amey

413 total citations
24 papers, 300 citations indexed

About

Daniel I. Amey is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and General Health Professions. According to data from OpenAlex, Daniel I. Amey has authored 24 papers receiving a total of 300 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 2 papers in Electronic, Optical and Magnetic Materials and 1 paper in General Health Professions. Recurrent topics in Daniel I. Amey's work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Electrical and Thermal Properties of Materials (7 papers). Daniel I. Amey is often cited by papers focused on 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Electrical and Thermal Properties of Materials (7 papers). Daniel I. Amey collaborates with scholars based in United States. Daniel I. Amey's co-authors include Rhonda Franklin, Can Akgün, S. Horowitz, Rao Tummala, A. Ege Engin, Madhavan Swaminathan, V. Sundaram, J. Sosnowski, K. Srinivasan and Kenneth W. Hang and has published in prestigious journals such as Computer, Journal of materials research/Pratt's guide to venture capital sources and IEEE Transactions on Advanced Packaging.

In The Last Decade

Daniel I. Amey

20 papers receiving 281 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Daniel I. Amey United States 9 176 57 51 42 23 24 300
Wim De Wilde Belgium 10 191 1.1× 147 2.6× 88 1.7× 38 0.9× 48 2.1× 31 337
Shinya Fujiwara Japan 9 104 0.6× 22 0.4× 93 1.8× 87 2.1× 77 3.3× 16 393
Yangchun Cheng China 11 246 1.4× 22 0.4× 102 2.0× 96 2.3× 68 3.0× 42 341
Wenqing Niu China 14 443 2.5× 18 0.3× 48 0.9× 49 1.2× 19 0.8× 43 517
John Chubb United Kingdom 13 232 1.3× 19 0.3× 61 1.2× 113 2.7× 17 0.7× 33 367
Helmut Wolf Germany 9 164 0.9× 225 3.9× 14 0.3× 46 1.1× 22 1.0× 34 349
Vicko Dorić Croatia 9 267 1.5× 46 0.8× 63 1.2× 21 0.5× 63 2.7× 73 368
D. Moreno-Hernández Mexico 11 347 2.0× 53 0.9× 144 2.8× 25 0.6× 97 4.2× 24 537

Countries citing papers authored by Daniel I. Amey

Since Specialization
Citations

This map shows the geographic impact of Daniel I. Amey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel I. Amey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel I. Amey more than expected).

Fields of papers citing papers by Daniel I. Amey

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daniel I. Amey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel I. Amey. The network helps show where Daniel I. Amey may publish in the future.

Co-authorship network of co-authors of Daniel I. Amey

This figure shows the co-authorship network connecting the top 25 collaborators of Daniel I. Amey. A scholar is included among the top collaborators of Daniel I. Amey based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daniel I. Amey. Daniel I. Amey is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Raj, P., et al.. (2008). Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications. 2 indexed citations
2.
Srinivasan, K., et al.. (2008). Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors. IEEE Transactions on Advanced Packaging. 31(2). 234–245. 19 indexed citations
3.
Srinivasan, Krishna, et al.. (2007). I/O Decoupling in High Speed Packages Using Embedded Planar Capacitors. 27. 299–304. 3 indexed citations
4.
Engin, A. Ege, et al.. (2007). Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package. IEEE Transactions on Advanced Packaging. 30(4). 809–822. 25 indexed citations
5.
Akgün, Can, et al.. (2003). Proceedings of SPIE - The International Society for Optical Engineering. 131 indexed citations
6.
Cho, Yong Soo, et al.. (2003). High k LTCC system for high frequency applications. 5231. 195–199. 6 indexed citations
7.
Sosnowski, J., et al.. (2003). A new approach for opto-electronic/MEMS packaging. 1. 259–262. 11 indexed citations
8.
Amey, Daniel I., et al.. (2003). Ceramic technology for integrated packaging for wireless. 63–66. 6 indexed citations
9.
Akgün, Can, et al.. (2003). Application of uniplanar structures for high frequency material characterization. 5288. 621–626. 3 indexed citations
10.
11.
Horowitz, S., et al.. (2002). Workstation MCM technology comparison with five designs. 19. 202–207.
12.
Amey, Daniel I. & S. Horowitz. (2002). Microwave characterization of packaging materials. 158–161. 4 indexed citations
13.
Cheng, Lap‐Tak, et al.. (2002). Electron field emission from Ar+ ion-treated thick-film carbon paste. Journal of materials research/Pratt's guide to venture capital sources. 17(10). 2590–2598. 3 indexed citations
14.
Amey, Daniel I., et al.. (1999). Cost trade-offs of constrained sintering of Low Temperature cofired ceramic. 3830. 28–33. 1 indexed citations
15.
Amey, Daniel I. & S. Horowitz. (1999). Characterization of Low Loss LTCC Materials at 40 GHz. 3906. 89–93. 3 indexed citations
16.
Smith, Michael A., et al.. (1998). Photoimageable Silver cofireable conductor compatible with 951 Green Tape. 3582(4). 393–398. 8 indexed citations
17.
Amey, Daniel I. & S. Horowitz. (1997). Materials Performance At Frequencies Up To 20 Ghz. 331–336. 10 indexed citations
18.
Amey, Daniel I., et al.. (1995). Comparison of a SuperSPARC TM Multichip Module: Diffusion Patterning TM and Fodel® MCM-C vs. MCM-D. 2649. 307.
19.
Amey, Daniel I., et al.. (1980). Circuit-Board Packaging Considerations for Optimum Utilization of Chip Carriers. IEEE Transactions on Components Hybrids and Manufacturing Technology. 3(1). 105–110. 1 indexed citations
20.
Amey, Daniel I., et al.. (1977). Special Feature New Chip Carrier Package Concepts. Computer. 10(12). 58–68. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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