M. Brillhart

461 total citations
29 papers, 348 citations indexed

About

M. Brillhart is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Polymers and Plastics. According to data from OpenAlex, M. Brillhart has authored 29 papers receiving a total of 348 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 7 papers in Polymers and Plastics. Recurrent topics in M. Brillhart's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Mechanical Behavior of Composites (8 papers). M. Brillhart is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Mechanical Behavior of Composites (8 papers). M. Brillhart collaborates with scholars based in United States, China and Taiwan. M. Brillhart's co-authors include Paul S. Ho, Xiang Dai, Peggy Cebe, J. Botsis, Yao‐Yi Cheng, Peng Su, Jie Xue, John H. Lau, Malcolm Capel and Jianyi Xue and has published in prestigious journals such as Polymer, Thermochimica Acta and Journal of Polymer Science Part B Polymer Physics.

In The Last Decade

M. Brillhart

28 papers receiving 320 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. Brillhart United States 11 199 124 80 76 40 29 348
Siti Hajar Sheikh Md Fadzullah Malaysia 10 73 0.4× 82 0.7× 125 1.6× 65 0.9× 24 0.6× 37 282
R. Yaldiz Saudi Arabia 11 73 0.4× 198 1.6× 115 1.4× 113 1.5× 57 1.4× 13 348
Jan‐Anders Månson Switzerland 10 63 0.3× 146 1.2× 101 1.3× 195 2.6× 82 2.0× 16 334
Mahmood Anwar Malaysia 9 61 0.3× 57 0.5× 106 1.3× 111 1.5× 93 2.3× 36 302
Andrejs Pupurs Sweden 13 36 0.2× 228 1.8× 86 1.1× 142 1.9× 34 0.8× 37 348
D.J. van Dijk Netherlands 11 91 0.5× 32 0.3× 105 1.3× 177 2.3× 63 1.6× 18 368
Chin-Lung Hsieh Taiwan 8 129 0.6× 84 0.7× 31 0.4× 136 1.8× 21 0.5× 22 341
Nalin Somani India 12 155 0.8× 56 0.5× 37 0.5× 321 4.2× 94 2.4× 27 394
Elisabeth Stammen Germany 8 35 0.2× 132 1.1× 60 0.8× 116 1.5× 53 1.3× 47 316
Nishant Verma India 11 50 0.3× 70 0.6× 89 1.1× 237 3.1× 53 1.3× 19 329

Countries citing papers authored by M. Brillhart

Since Specialization
Citations

This map shows the geographic impact of M. Brillhart's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Brillhart with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Brillhart more than expected).

Fields of papers citing papers by M. Brillhart

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Brillhart. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Brillhart. The network helps show where M. Brillhart may publish in the future.

Co-authorship network of co-authors of M. Brillhart

This figure shows the co-authorship network connecting the top 25 collaborators of M. Brillhart. A scholar is included among the top collaborators of M. Brillhart based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Brillhart. M. Brillhart is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chien, Heng-Chieh, John H. Lau, Fang‐Lin Chao, et al.. (2012). Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications. 1866–1873. 41 indexed citations
2.
Li, Li, Peng Su, Jie Xue, et al.. (2012). Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration. 1040–1046. 29 indexed citations
3.
Lau, John H., Pei-Jer Tzeng, Chau‐Jie Zhan, et al.. (2012). Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP). IMAPSource Proceedings. 2012(1). 1209–1214. 6 indexed citations
4.
5.
Li, Li, et al.. (2005). Design optimization of a high performance FCAMP package for manufacturability and reliability. 2. 1497–1499. 6 indexed citations
6.
7.
Brillhart, M. & Jie Xue. (2004). Next generation packaging technology for high performance ASICs. 9. 18–20. 1 indexed citations
8.
9.
Brillhart, M., et al.. (2003). Reliability assessment of a high CTE CBGA for high availability systems. 611–616. 26 indexed citations
10.
11.
Dai, Xiang, M. Brillhart, & Paul S. Ho. (2002). Polymer interfacial adhesion in microelectronic assemblies. 132–137. 17 indexed citations
12.
Dai, Xiang, M. Brillhart, & Paul S. Ho. (2000). Adhesion measurement for electronic packaging applications using double cantilever beam method. IEEE Transactions on Components and Packaging Technologies. 23(1). 101–116. 50 indexed citations
13.
Dai, Xiang, et al.. (2000). Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging. IEEE Transactions on Components and Packaging Technologies. 23(1). 117–127. 16 indexed citations
14.
Dai, Xiang, M. Brillhart, & Paul S. Ho. (1998). Experimental Investigation on Interfacial Adhesion in Microelectronic Assemblies. MRS Proceedings. 515. 2 indexed citations
15.
Cheng, Yao‐Yi, M. Brillhart, & Peggy Cebe. (1997). Modulated differential scanning calorimetry study of blends of poly(butylene terephthalate) with polycarbonate. Thermochimica Acta. 304-305. 369–378. 8 indexed citations
16.
Brillhart, M., Yao‐Yi Cheng, P. Nagarkar, & Peggy Cebe. (1997). Molecular modelling and structure studies of LARC-CPI semicrystalline polyimide. Polymer. 38(12). 3059–3068. 9 indexed citations
17.
Dai, Xiang, M. Brillhart, & Paul S. Ho. (1997). Investigation of Underfill Adhesion in Plastic Flip-Chip Packages. 115–124. 3 indexed citations
18.
Cheng, Yao‐Yi, M. Brillhart, Peggy Cebe, & Malcolm Capel. (1996). X-ray scattering and thermal analysis study of the effects of molecular weight on phase structure in blends of poly(butylene terephthalate) with polycarbonate. Journal of Polymer Science Part B Polymer Physics. 34(17). 2953–2965. 24 indexed citations
19.
Brillhart, M. & Peggy Cebe. (1995). Thermal expansion of the crystal lattice of novel thermoplastic polyimides. Journal of Polymer Science Part B Polymer Physics. 33(6). 927–936. 23 indexed citations
20.
Brillhart, M. & J. Botsis. (1993). Fatigue Fracture Behavior of PEEK. Journal of Reinforced Plastics and Composites. 12(9). 943–950. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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