Ming-Che Hsieh

599 total citations
57 papers, 441 citations indexed

About

Ming-Che Hsieh is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Ming-Che Hsieh has authored 57 papers receiving a total of 441 indexed citations (citations by other indexed papers that have themselves been cited), including 44 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 6 papers in Mechanical Engineering. Recurrent topics in Ming-Che Hsieh's work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (34 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). Ming-Che Hsieh is often cited by papers focused on 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (34 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). Ming-Che Hsieh collaborates with scholars based in Taiwan, China and United States. Ming-Che Hsieh's co-authors include Ching‐Hsing Luo, Kuo‐Ning Chiang, An-Bang Wang, John H. Lau, Jen‐Her Wu, Wei Lee, Ra-Min Tain, Ian C. Hsu, Wei Lee and Chi‐Yuan Chen and has published in prestigious journals such as Lab on a Chip, Journal of the Association for Information Systems and Applied Sciences.

In The Last Decade

Ming-Che Hsieh

54 papers receiving 404 citations

Peers

Countries citing papers authored by Ming-Che Hsieh

Since Specialization

Citations

This map shows the geographic impact of Ming-Che Hsieh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming-Che Hsieh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming-Che Hsieh more than expected).

Fields of papers citing papers by Ming-Che Hsieh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ming-Che Hsieh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming-Che Hsieh. The network helps show where Ming-Che Hsieh may publish in the future.

Co-authorship network of co-authors of Ming-Che Hsieh

This figure shows the co-authorship network connecting the top 25 collaborators of Ming-Che Hsieh. A scholar is included among the top collaborators of Ming-Che Hsieh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ming-Che Hsieh. Ming-Che Hsieh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	GenAI-Assisted Database Deployment for Heterogeneous Indigenous–Native Ethnographic Research Data 2024 ·Applied Sciences ·(unknown), (unknown), Ming-Che Hsieh, Yi-Cheng Chen, (unknown)	1
2	Enhancing healthcare services and brand engagement through social media marketing: Integration of Kotler's 5A framework with IDEA process 2023 ·Information Processing & Management ·(unknown), Jen‐Her Wu, Pei‐Yu Chen, Xiaoyu Xu, Wan‐Ling Hsu, Li‐Min Lin, Ming-Che Hsieh	15
3	Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications 2023 ·Ming-Che Hsieh, Frank Zhang, (unknown), (unknown), (unknown), Yaojian Lin, (unknown), (unknown), (unknown), (unknown)	1
4	7nm Chip-Package Interaction Study on a Fine Pitch Flip Chip Package with Laser Assisted Bonding and Mass Reflow Technology 2019 ·Ian C. Hsu, Chi‐Yuan Chen, (unknown), (unknown), (unknown), Ming-Che Hsieh	3
5	Fine pitch high bandwidth flip chip package-on-package development 2017 ·Ming-Che Hsieh, (unknown), Ian C. Hsu, Chi‐Yuan Chen, (unknown)	7
6	Advanced flip chip package on package technology for mobile applications 2016 ·Ming-Che Hsieh	22
7	Comprehensive Thermo-Mechanical Stress Analyses and Underfill Selection of Large Die Flip Chip Ball Grid Array 2013 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Ming-Che Hsieh, (unknown), (unknown)	7
8	Comprehensive Thermomechanical Analyses and Validations for Various Cu Column Bumps in fcFBGA 2012 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Ming-Che Hsieh, (unknown), (unknown)	5
9	Unveiling the missing transport mechanism inside the valveless micropump 2012 ·Lab on a Chip ·An-Bang Wang, Ming-Che Hsieh	14
10	Reliability assessments and designs for fine pitch flip chip packages with Cu column bumps 2012 ·Ming-Che Hsieh, (unknown), (unknown)	3
11	Thermo-mechanical stress analysis and optimization for 28nm extreme low-k large die fcBGA 2011 ·Ming-Che Hsieh, (unknown), (unknown), Vincent M. Wang, (unknown)	6
12	Parametric study for warpage and stress reduction of variable bump types in fcFBGA 2011 ·Ming-Che Hsieh, (unknown), (unknown), Vincent M. Wang, (unknown)	4
13	Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration 2011 ·Ming-Che Hsieh, (unknown), (unknown), Ra-Min Tain, John H. Lau, (unknown), Ming‐Jer Kao	2
14	Strength evaluation of silicon die for 3D chip stacking packages using ABF as dielectric and barrier layer in through-silicon via 2009 ·Microelectronic Engineering ·(unknown), Ming-Che Hsieh, Kuo‐Ning Chiang	29
15	An Extended MDA Method for User Interface Modeling and Transformation 2007 ·Journal of the Association for Information Systems ·Jen‐Her Wu, (unknown), (unknown), (unknown), Ming-Che Hsieh	16
16	Packaging Effects of Cu/Low-k Interconnect Structure 2007 ·Ming-Che Hsieh	2
17	Thermal Stress Analysis of Cu/Low-k Interconnects in 3D-IC Structures 2006 ·Ming-Che Hsieh, (unknown), (unknown)	4
18	A novel Ni capped high Q copper air gap spiral inductor 2005 ·Materials Science in Semiconductor Processing ·Chern‐Sheng Lin, Y.K. Fang, (unknown), (unknown), (unknown), (unknown), Ming-Che Hsieh	4
19	Unstable Morse code recognition with adaptive variable-ratio threshold prediction for physically disabled persons 2000 ·IEEE Transactions on Rehabilitation Engineering ·Ming-Che Hsieh, Ching‐Hsing Luo, (unknown)	26
20	Morse code typing training of an adolescent with cerebral palsy using microcomputer technology: case study 1999 ·Augmentative and Alternative Communication ·Ming-Che Hsieh, Ching‐Hsing Luo	9

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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