Chao‐Chang A. Chen

765 total citations
51 papers, 578 citations indexed

About

Chao‐Chang A. Chen is a scholar working on Biomedical Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Chao‐Chang A. Chen has authored 51 papers receiving a total of 578 indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Biomedical Engineering, 26 papers in Mechanical Engineering and 15 papers in Materials Chemistry. Recurrent topics in Chao‐Chang A. Chen's work include Advanced Surface Polishing Techniques (42 papers), Advanced machining processes and optimization (18 papers) and Diamond and Carbon-based Materials Research (15 papers). Chao‐Chang A. Chen is often cited by papers focused on Advanced Surface Polishing Techniques (42 papers), Advanced machining processes and optimization (18 papers) and Diamond and Carbon-based Materials Research (15 papers). Chao‐Chang A. Chen collaborates with scholars based in Taiwan, Vietnam and United States. Chao‐Chang A. Chen's co-authors include Ajay Gupta, Jing Lu, Yujing Lin, Yongchao Xu, Xipeng Xu, Hsien‐Kuang Liu, Wei-En Fu, Neil A. Duffie, Hao‐Chung Kuo and Chang‐Ching Tu and has published in prestigious journals such as Optics Express, Thin Solid Films and Journal of Materials Processing Technology.

In The Last Decade

Chao‐Chang A. Chen

47 papers receiving 556 citations

Peers

Chao‐Chang A. Chen

EEE

Julong Yuan China

Jiaqing Xie China

Hu Wu Singapore

Zhanwen Sun China

Choung Lii Chao Taiwan

Xuesong Han China

Dewen Zhao China

Yuxiu Hu China

Jingfei Yin China

Jun Cheng China

Julong Yuan China

Chao‐Chang A. Chen

441 ×1.0

447 ×1.5

178 ×0.9

142 ×1.0

EEE

143 ×1.5

Citations per year, relative to Chao‐Chang A. Chen Chao‐Chang A. Chen (= 1×) peers Julong Yuan

Countries citing papers authored by Chao‐Chang A. Chen

Since Specialization

Citations

This map shows the geographic impact of Chao‐Chang A. Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chao‐Chang A. Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chao‐Chang A. Chen more than expected).

Fields of papers citing papers by Chao‐Chang A. Chen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chao‐Chang A. Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chao‐Chang A. Chen. The network helps show where Chao‐Chang A. Chen may publish in the future.

Co-authorship network of co-authors of Chao‐Chang A. Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Chao‐Chang A. Chen. A scholar is included among the top collaborators of Chao‐Chang A. Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chao‐Chang A. Chen. Chao‐Chang A. Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sefene, Eyob Messele, et al.. (2025). Determination of sawing temperature in multi-diamond wire sawing of mono-crystalline silicon carbide. CIRP journal of manufacturing science and technology. 60. 38–55. 2 indexed citations

Sefene, Eyob Messele, et al.. (2024). A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials. Journal of Manufacturing Processes. 131. 1466–1497. 15 indexed citations

Sefene, Eyob Messele, et al.. (2024). Enhancing sustainability and machinability in electrophoretic-assisted diamond wire sawing of monocrystalline silicon wafer. Journal of Manufacturing Processes. 131. 1531–1547. 6 indexed citations

Lee, Ming‐Hsun, et al.. (2023). Contamination reduction for 150 mm SiC substrates by integrating CMP and Post-CMP cleaning. Materials Research Express. 10(10). 105903–105903. 1 indexed citations

Chen, Chao‐Chang A., et al.. (2023). Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure. The International Journal of Advanced Manufacturing Technology. 128(9-10). 4455–4468. 1 indexed citations

Lin, Chunyu, et al.. (2022). Analyzing the effects of pad asperity on chemical mechanical polishing of copper thin film wafer. Japanese Journal of Applied Physics. 61(7). 71005–71005. 7 indexed citations

Chen, Chao‐Chang A., et al.. (2022). Development of modeling to investigate polyurethane pad hardness in chemical mechanical planarization/polishing (CMP) process. Japanese Journal of Applied Physics. 61(SJ). SJ1002–SJ1002. 9 indexed citations

Chen, Chao‐Chang A., et al.. (2021). Material Removal and Wear Behaviour of Copper Thin Film in Ambient Air and Wet Environment by Nanoindenter. ECS Journal of Solid State Science and Technology. 10(5). 54001–54001. 4 indexed citations

Chen, Chao‐Chang A., et al.. (2021). Investigation of Particle Kinetic Energy for EKF-CMP Process. ECS Journal of Solid State Science and Technology. 10(7). 74007–74007.

10.

Chen, Chao‐Chang A., et al.. (2021). Effective Particle Analysis on Wafer in the EKF-CMP System. ECS Journal of Solid State Science and Technology. 10(2). 24004–24004. 2 indexed citations

11.

Chen, Chao‐Chang A., et al.. (2020). Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System. Applied Sciences. 11(1). 179–179. 13 indexed citations

12.

Chen, Chao‐Chang A., et al.. (2020). Advanced chemical–mechanical planarization for 4H-SiC substrate by water-soluble inclusion complexes of fullerene. Japanese Journal of Applied Physics. 59(SL). SLLA01–SLLA01. 7 indexed citations

13.

Chen, Chao‐Chang A., et al.. (2019). Simulation of Cutting Locus and Overlap Cutting by Diamond Dressing in CMP Process. SSRN Electronic Journal. 1 indexed citations

14.

Lin, Yu-Ming, et al.. (2018). Simulation of Granular Temperature of Abrasive Particles in the EKF-CMP System. 127–130. 2 indexed citations

15.

Chen, Chao‐Chang A., et al.. (2016). Optimization of aspheric multifocal contact lens by spline curve. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 10021. 100210L–100210L. 2 indexed citations

16.

Fu, Wei-En, et al.. (2012). Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions. Wear. 278-279. 87–93. 24 indexed citations

17.

Chen, Chao‐Chang A., et al.. (2010). Nanopattern Fabrication by Tip Plowing Technology on 55 nm Grating with Stitching Image Method. Journal of Nanoscience and Nanotechnology. 10(7). 4411–4416. 1 indexed citations

18.

Chen, Chao‐Chang A., et al.. (2007). Toolpath generation for diamond shaping of aspheric lens array. Journal of Materials Processing Technology. 192-193. 194–199. 19 indexed citations

19.

Shiou, Fang‐Jung, et al.. (2005). Automated surface finishing of plastic injection mold steel with spherical grinding and ball burnishing processes. The International Journal of Advanced Manufacturing Technology. 28(1-2). 61–66. 21 indexed citations

20.

Chen, Chao‐Chang A. & Neil A. Duffie. (1996). Development of an automated surface finishing system (ASFS) with in-process surface topography inspection. Journal of Materials Processing Technology. 62(4). 427–430. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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