Diganta Das
- Condensed Matter Physics top 5%
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- Reliability and Maintenance Optimization 10
- Technology Assessment and Management 6
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- Manufacturing Process and Optimization 9
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- Transportation Systems and Infrastructure 8
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- Electronic Packaging and Soldering Technologies 20
- Silicon Carbide Semiconductor Technologies 15
- Electrostatic Discharge in Electronics 14
- 3D IC and TSV technologies 7
- Co-authors
- Michael PechtMoon‐Hwan ChangP. V. VardeNishad PatilJun DaiSatyandra K. GuptaDana NauKai Goebel
- Cited by
- Condensed Matter PhysicsSafety, Risk, Reliability and QualityIndustrial and Manufacturing Engineering
- Journals
- IEEE Transactions on Components and Packaging Technologies (10 papers)Microelectronics Reliability (10 papers)IEEE Access (7 papers)
- Partner nations
- United StatesHong KongChina
In The Last Decade
Diganta Das
86 papers receiving 2.0k citations
Hit Papers
Peers
Comparison fields: 5 of 125
- Condensed Matter Physics 310
- Safety, Risk, Reliability and Quality 232
- Industrial and Manufacturing Engineering 253
- Management of Technology and Innovation 134
- Electrical and Electronic Engineering 1.0k
Countries citing papers authored by Diganta Das
This map shows the geographic impact of Diganta Das's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Diganta Das with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Diganta Das more than expected).
Fields of papers citing papers by Diganta Das
This network shows the impact of papers produced by Diganta Das. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Diganta Das. The network helps show where Diganta Das may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Diganta Das, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 29 | |
| 4 | 2023 | 2 | |
| 5 | 2022 | 5 | |
| 6 | 2021 | 19 | |
| 7 | 2018 | 7 | |
| 8 | 2016 | 2 | |
| 9 | 2015 | 29 | |
| 10 | 2015 | 29 | |
| 11 | 2013 | 10 | |
| 12 | Using Failure Modes, Mechanisms, and Effects Analysis in Medical Device Adverse Event Investigations. | 2011 | 9 |
| 13 | Light emitting diodes reliability reviewbreakdown → | 2011 | 608 |
| 14 | 2011 | 3 | |
| 15 | 2010 | 2 | |
| 16 | 2008 | 21 | |
| 17 | 2006 | 18 | |
| 18 | 2002 | 9 | |
| 19 | 2001 | 12 | |
| 20 | Component Technology Insertion into Critical Avionics Applications | 1998 | 1 |
About Diganta Das
Diganta Das is a scholar working on Safety, Risk, Reliability and Quality, Management of Technology and Innovation, Hardware and Architecture, Software and Statistics, Probability and Uncertainty, having authored 89 papers that have together received 2.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (20 papers), Silicon Carbide Semiconductor Technologies (15 papers), Electrostatic Discharge in Electronics (14 papers), Reliability and Maintenance Optimization (10 papers), Manufacturing Process and Optimization (9 papers), Transportation Systems and Infrastructure (8 papers), 3D IC and TSV technologies (7 papers) and Technology Assessment and Management (6 papers). The work is most often cited by research in Condensed Matter Physics (310 citations), Safety, Risk, Reliability and Quality (232 citations), Industrial and Manufacturing Engineering (253 citations), Management of Technology and Innovation (134 citations) and Electrical and Electronic Engineering (1.0k citations). Diganta Das has collaborated with scholars based in United States, Hong Kong and China. Frequent co-authors include Michael Pecht, Moon‐Hwan Chang, P. V. Varde, Nishad Patil, Jun Dai, Satyandra K. Gupta, Dana Nau, Kai Goebel, José Celaya and William C. Regli. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Microelectronics Reliability, IEEE Access, IEEE Transactions on Electronics Packaging Manufacturing and Applied Energy.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.