Douglas DeVoto

773 total citations
38 papers, 533 citations indexed

About

Douglas DeVoto is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Douglas DeVoto has authored 38 papers receiving a total of 533 indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 10 papers in Materials Chemistry. Recurrent topics in Douglas DeVoto's work include Electronic Packaging and Soldering Technologies (19 papers), Silicon Carbide Semiconductor Technologies (14 papers) and 3D IC and TSV technologies (12 papers). Douglas DeVoto is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), Silicon Carbide Semiconductor Technologies (14 papers) and 3D IC and TSV technologies (12 papers). Douglas DeVoto collaborates with scholars based in United States. Douglas DeVoto's co-authors include Faisal Khan, Abu Hanif, Joshua Major, Sreekant Narumanchi, Om Prakash Yadav, Mark Mihalic, Khai D. T. Ngo, Joseph P. Kozak, Patrick McCluskey and Raj Sahu and has published in prestigious journals such as Nano Letters, IEEE Transactions on Power Electronics and International Journal of Heat and Mass Transfer.

In The Last Decade

Douglas DeVoto

35 papers receiving 509 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Douglas DeVoto United States 14 405 148 98 49 45 38 533
Joshua Major United States 12 227 0.6× 120 0.8× 63 0.6× 16 0.3× 50 1.1× 29 317
Ali Ibrahim France 13 379 0.9× 165 1.1× 29 0.3× 136 2.8× 18 0.4× 41 555
Jici Wen China 9 192 0.5× 67 0.5× 65 0.7× 19 0.4× 148 3.3× 24 330
Dong Tao China 12 140 0.3× 227 1.5× 199 2.0× 12 0.2× 82 1.8× 49 446
Majid Samavatian Iran 17 272 0.7× 504 3.4× 213 2.2× 15 0.3× 20 0.4× 32 712
Bang‐Hung Tsao United States 9 177 0.4× 68 0.5× 108 1.1× 55 1.1× 22 0.5× 31 354
Mohamad Abo Ras Germany 10 169 0.4× 116 0.8× 104 1.1× 11 0.2× 12 0.3× 65 313
Katherine Sebeck United States 10 103 0.3× 195 1.3× 109 1.1× 25 0.5× 72 1.6× 31 345
Fengze Hou China 16 447 1.1× 257 1.7× 65 0.7× 11 0.2× 37 0.8× 52 658
Wankai Shi China 9 93 0.2× 186 1.3× 135 1.4× 30 0.6× 80 1.8× 31 357

Countries citing papers authored by Douglas DeVoto

Since Specialization
Citations

This map shows the geographic impact of Douglas DeVoto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Douglas DeVoto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Douglas DeVoto more than expected).

Fields of papers citing papers by Douglas DeVoto

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Douglas DeVoto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Douglas DeVoto. The network helps show where Douglas DeVoto may publish in the future.

Co-authorship network of co-authors of Douglas DeVoto

This figure shows the co-authorship network connecting the top 25 collaborators of Douglas DeVoto. A scholar is included among the top collaborators of Douglas DeVoto based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Douglas DeVoto. Douglas DeVoto is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
DeVoto, Douglas, et al.. (2023). PCB-on-DBC GaN Power Module Design With High-Density Integration and Double-Sided Cooling. IEEE Transactions on Power Electronics. 39(1). 507–516. 17 indexed citations
2.
Major, Joshua, Douglas DeVoto, Karen N. Heinselman, et al.. (2022). Development of a 250°C 15kV Supercascode switch using SiC JFET technology. 227–232.
3.
DiMarino, Christina, et al.. (2021). Reliability Analysis of Large-Area, Low-Pressure-Assisted Silver Sintering for Medium-Voltage Power Modules. IEEE Journal of Emerging and Selected Topics in Power Electronics. 10(5). 5252–5259. 5 indexed citations
4.
Major, Joshua, et al.. (2021). Reliability and Lifetime Prediction Model of Sintered Silver Under High-Temperature Cycling. IEEE Journal of Emerging and Selected Topics in Power Electronics. 10(5). 5181–5191. 14 indexed citations
5.
DiMarino, Christina, et al.. (2021). Evaluation of Low-Pressure-Sintered Multi-Layer Substrates for Medium-Voltage SiC Power Modules. 20–26. 6 indexed citations
6.
Lin, Kevin, et al.. (2019). Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 2 indexed citations
7.
Tripathi, Rajesh, et al.. (2019). Power electronics thermal solutions using thermally conductive polyimide films. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2019(DPC). 616–646. 7 indexed citations
8.
Hanif, Abu, Douglas DeVoto, & Faisal Khan. (2019). Bond Wire Damage Detection and SOH Estimation of a Dual-Pack IGBT Power Module Using Active Power Cycling and Reflectometry. IEEE Transactions on Power Electronics. 35(7). 6761–6772. 22 indexed citations
9.
Kozak, Joseph P., Khai D. T. Ngo, Douglas DeVoto, & Joshua Major. (2018). Impact of Accelerated Stress-Tests on SiC MOSFET Precursor Parameters. 1–5. 19 indexed citations
10.
Kozak, Joseph P., Douglas DeVoto, Joshua Major, & Khai D. T. Ngo. (2018). Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses. 1–6. 12 indexed citations
11.
Bennion, Kevin, et al.. (2018). Experimental characterization and modeling of thermal resistance of electric machine lamination stacks. International Journal of Heat and Mass Transfer. 129. 152–159. 18 indexed citations
12.
DeVoto, Douglas, et al.. (2017). Thermomechanical Modeling of Sintered Silver – A Fracture Mechanics-Based Approach. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2017(DPC). 1–15. 1 indexed citations
13.
DeVoto, Douglas. (2016). Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 1 indexed citations
14.
DeVoto, Douglas, et al.. (2015). Reliability of Emerging Bonded Interface Materials for Large-Area Attachments. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(1). 40–49. 18 indexed citations
15.
DeVoto, Douglas, et al.. (2014). Stress Intensity of Delamination in a Sintered-Silver Interconnection. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(HITEC). 190–197. 9 indexed citations
16.
Feng, Xuhui, et al.. (2014). Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 1296–1307. 7 indexed citations
17.
Narumanchi, Sreekant, et al.. (2013). Performance and Reliability of Interface Materials for Automotive Power Electronics. University of North Texas Digital Library (University of North Texas). 3 indexed citations
18.
Narumanchi, Sreekant, et al.. (2011). Thermal Performance and Reliability of Large-Area Bonded Interfaces in Power Electronics Packages. 837–842. 3 indexed citations
19.
DeVoto, Douglas & Patrick McCluskey. (2009). Reliability Analysis of Wind Turbines. 1041–1045. 8 indexed citations
20.
DeVoto, Douglas & Patrick McCluskey. (2009). Reliable Power Electronics for Wind Turbines. 55–59. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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