Craig Hillman

783 total citations
33 papers, 604 citations indexed

About

Craig Hillman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Craig Hillman has authored 33 papers receiving a total of 604 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. Recurrent topics in Craig Hillman's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (11 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). Craig Hillman is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (11 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). Craig Hillman collaborates with scholars based in United States and South Korea. Craig Hillman's co-authors include Fred F. Lange, Zhigang Suo, Matthias Oechsner, Michael Pecht, F. F. Lange, Siow Ling Ho, Steven R. Murray, Patrick McCluskey, Stewart B. Rood and John M. Mahoney and has published in prestigious journals such as Journal of the American Ceramic Society, Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies.

In The Last Decade

Craig Hillman

30 papers receiving 570 citations

Peers

Craig Hillman

EEE

Jae‐Yeon Kim South Korea

Martin Frieß Germany

Thomas Schubert Germany

Junjie Duan China

Christopher R. Baker United States

Hideki Kakisawa Japan

Shirley B. Waters United States

Shi‐Yong Dong China

M. Petraroli United States

Jae‐Yeon Kim South Korea

Craig Hillman

180 ×0.6

264 ×1.2

192 ×1.0

EEE

34 ×0.2

155 ×1.0

Citations per year, relative to Craig Hillman Craig Hillman (= 1×) peers Jae‐Yeon Kim

Countries citing papers authored by Craig Hillman

Since Specialization

Citations

This map shows the geographic impact of Craig Hillman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Craig Hillman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Craig Hillman more than expected).

Fields of papers citing papers by Craig Hillman

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Craig Hillman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Craig Hillman. The network helps show where Craig Hillman may publish in the future.

Co-authorship network of co-authors of Craig Hillman

This figure shows the co-authorship network connecting the top 25 collaborators of Craig Hillman. A scholar is included among the top collaborators of Craig Hillman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Craig Hillman. Craig Hillman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sharon, Gil, et al.. (2019). Reliability Physics Approach for High-Density Ball Grid Arrays in Autonomous Vehicle Applications. SAE International Journal of Advances and Current Practices in Mobility. 1(4). 1640–1647. 3 indexed citations

Condra, Lloyd W., et al.. (2019). SAE ARP6338: Process for Assessment and Mitigation of Aging and Potential Early Wearout of Life-Limited Microcircuits (LLM). SAE International Journal of Advances and Current Practices in Mobility. 1(4). 1653–1660. 1 indexed citations

Hillman, Craig, et al.. (2019). Automated Method Using Finite Element Simulation to Identify Microvia Stacks at Risk of Separation in Complex PCB Designs. 1–4.

Sharon, Gil, et al.. (2019). Improved Correlation Between Accelerated Board Level Reliability (BLR) Testing and Customer BLR Results Using a Hybrid Closed-Form/Finite Element Methodology. 28. 2103–2111.

Hillman, Craig, et al.. (2019). Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs. 1 indexed citations

McCluskey, Patrick, et al.. (2018). Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions. 4 indexed citations

Savolainen, Petri, et al.. (2013). Challenges with manufacturability of package on package (PoP). European Microelectronics and Packaging Conference. 1–4. 1 indexed citations

Hillman, Craig, et al.. (2012). Predicting the Reliability of Zero-Level TSVs. IMAPSource Proceedings. 2012(1). 1–8. 1 indexed citations

Hillman, Craig, et al.. (2010). Second Generation Pb-Free Alloys. 23(1). 18–26. 9 indexed citations

10.

Schenkelberg, Fred, et al.. (2008). How to develop a qualification test plan for RoHS products. 375–380. 1 indexed citations

11.

Murray, Steven R., Craig Hillman, & Michael Pecht. (2004). Environmental Aging and Deadhesion of Polyimide Dielectric Films. Journal of Electronic Packaging. 126(3). 390–397. 19 indexed citations

12.

Hillman, Craig, et al.. (2003). Failures in Base Metal Electrode (BME) Capacitors. 1 indexed citations

13.

Zheng, Yefeng, Craig Hillman, & Patrick McCluskey. (2003). Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu. 1226–1231. 27 indexed citations

14.

Murray, Steven R., Craig Hillman, & Michael Pecht. (2003). Environmental aging and deadhesion of siloxane-polyimide-epoxy adhesive. IEEE Transactions on Components and Packaging Technologies. 26(3). 524–531. 25 indexed citations

15.

Ardebili, Haleh, et al.. (2002). A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements. IEEE Transactions on Components and Packaging Technologies. 25(1). 132–139. 26 indexed citations

16.

Hillman, Craig, et al.. (2000). Assessing the operating reliability of land grid array elastomer sockets. IEEE Transactions on Components and Packaging Technologies. 23(1). 171–176. 15 indexed citations

17.

Pecht, Michael, Craig Hillman, Keith L. Rogers, & D. A. Jennings. (1999). Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers. IEEE Transactions on Electronics Packaging Manufacturing. 22(1). 80–84. 13 indexed citations

18.

Katz, Aaron, et al.. (1998). Getting the quality and reliability terminology straight. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 21(3). 521–523. 2 indexed citations

19.

Hillman, Craig, Zhigang Suo, & Fred F. Lange. (1996). Cracking of Laminates Subjected to Biaxial Tensile Stresses. Journal of the American Ceramic Society. 79(8). 2127–2133. 120 indexed citations

20.

Oechsner, Matthias, Craig Hillman, & Fred F. Lange. (1996). Crack Bifurcation in Laminar Ceramic Composites. Journal of the American Ceramic Society. 79(7). 1834–1838. 98 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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