T. Kangasvieri

462 total citations
30 papers, 394 citations indexed

About

T. Kangasvieri is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, T. Kangasvieri has authored 30 papers receiving a total of 394 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. Recurrent topics in T. Kangasvieri's work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (18 papers) and Electrical and Thermal Properties of Materials (11 papers). T. Kangasvieri is often cited by papers focused on 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (18 papers) and Electrical and Thermal Properties of Materials (11 papers). T. Kangasvieri collaborates with scholars based in Finland and Australia. T. Kangasvieri's co-authors include Jouko Vähäkangas, Heli Jantunen, S. Leppävuori, R. Rautioaho, Markku Lahti, Jari Halme, Kari Kautio, A. Uusimäki, J. Hagberg and Jyrki Lappalainen and has published in prestigious journals such as Journal of the European Ceramic Society, Electronics Letters and IEEE Microwave and Wireless Components Letters.

In The Last Decade

T. Kangasvieri

30 papers receiving 354 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
T. Kangasvieri Finland 12 374 82 67 63 26 30 394
E. Auerswald Germany 7 358 1.0× 36 0.4× 49 0.7× 159 2.5× 12 0.5× 22 399
Tamás Hurtony Hungary 13 363 1.0× 39 0.5× 50 0.7× 243 3.9× 10 0.4× 43 411
Chih-Pin Hung Taiwan 11 268 0.7× 22 0.3× 33 0.5× 44 0.7× 6 0.2× 50 291
Ranjit Pandher United States 8 291 0.8× 33 0.4× 54 0.8× 130 2.1× 5 0.2× 25 324
C.J. Hang China 8 280 0.7× 55 0.7× 69 1.0× 223 3.5× 11 0.4× 9 381
Shuibao Liang China 9 213 0.6× 71 0.9× 56 0.8× 132 2.1× 8 0.3× 58 272
Meng‐Ju Chiang Taiwan 13 352 0.9× 66 0.8× 175 2.6× 100 1.6× 31 1.2× 37 467
Mirng-Ji Lii Taiwan 11 194 0.5× 160 2.0× 31 0.5× 130 2.1× 8 0.3× 32 390
Pilin Liu United States 8 332 0.9× 76 0.9× 31 0.5× 169 2.7× 3 0.1× 20 377
Siddharth Ravichandran United States 12 287 0.8× 19 0.2× 65 1.0× 13 0.2× 8 0.3× 24 327

Countries citing papers authored by T. Kangasvieri

Since Specialization
Citations

This map shows the geographic impact of T. Kangasvieri's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Kangasvieri with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Kangasvieri more than expected).

Fields of papers citing papers by T. Kangasvieri

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Kangasvieri. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Kangasvieri. The network helps show where T. Kangasvieri may publish in the future.

Co-authorship network of co-authors of T. Kangasvieri

This figure shows the co-authorship network connecting the top 25 collaborators of T. Kangasvieri. A scholar is included among the top collaborators of T. Kangasvieri based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Kangasvieri. T. Kangasvieri is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hagberg, J., et al.. (2020). Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules. Microelectronics Reliability. 109. 113674–113674. 10 indexed citations
2.
Hagberg, J., et al.. (2019). Power Module Interconnection Reliability in BTS Applications. IEEE Transactions on Device and Materials Reliability. 19(3). 484–493. 4 indexed citations
3.
Kangasvieri, T., et al.. (2012). Lifetime Prediction of Non-Collapsible Solder Joints in LTCC/PWB Assemblies Using a Recalibrated Engelmaier's Model. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(6). 994–1001. 5 indexed citations
4.
Kangasvieri, T., et al.. (2011). Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies. Soldering and Surface Mount Technology. 23(1). 30–39. 4 indexed citations
5.
Kangasvieri, T., et al.. (2011). Enhanced thermal fatigue endurance and lifetime prediction of lead‐free LGA joints in LTCC modules. Soldering and Surface Mount Technology. 23(2). 104–114. 8 indexed citations
6.
Kangasvieri, T., et al.. (2011). Influence of Thermal-Cycling-Induced Failures on the RF Performance of Ceramic Antenna Assemblies. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(9). 1465–1472. 11 indexed citations
7.
Kangasvieri, T., et al.. (2010). Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies. Soldering and Surface Mount Technology. 22(2). 21–29. 8 indexed citations
8.
Kangasvieri, T., et al.. (2009). Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C. Journal of Electronic Materials. 38(6). 843–851. 5 indexed citations
9.
Kangasvieri, T., et al.. (2008). Broadband BGA-Via Transitions for Reliable RF/Microwave LTCC-SiP Module Packaging. IEEE Microwave and Wireless Components Letters. 18(1). 34–36. 25 indexed citations
10.
Kangasvieri, T., et al.. (2008). Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly. Soldering and Surface Mount Technology. 20(3). 11–17. 11 indexed citations
11.
Kangasvieri, T., et al.. (2008). Compact Surface-Mountable LTCC-BGA Antenna Package for X-band Applications. 2 indexed citations
12.
Kangasvieri, T., et al.. (2008). Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies. IEEE Transactions on Electronics Packaging Manufacturing. 31(3). 240–247. 22 indexed citations
13.
Kangasvieri, T., et al.. (2008). Low-Loss and Wideband Package Transitions for Microwave and Millimeter-Wave MCMs. IEEE Transactions on Advanced Packaging. 31(1). 170–181. 11 indexed citations
14.
Kangasvieri, T., et al.. (2007). Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. European Microelectronics and Packaging Conference. 693–698. 6 indexed citations
15.
Kangasvieri, T., et al.. (2007). An Ultra-Wideband BGA-Via Transition for High-Speed Digital and Millimeter-Wave Packaging Applications. IEEE MTT-S International Microwave Symposium digest. 54. 1637–1640. 15 indexed citations
16.
Kangasvieri, T., et al.. (2007). Interfacial reactions between Sn‐based solders and AgPt thick film metallizations on LTCC. Soldering and Surface Mount Technology. 19(3). 15–25. 8 indexed citations
17.
Kangasvieri, T., Jari Halme, Jouko Vähäkangas, & Markku Lahti. (2007). High-performance vertical transition for broadband and millimetre-wave BGA module packaging. Electronics Letters. 43(11). 638–639. 2 indexed citations
18.
Kangasvieri, T., Jari Halme, Jouko Vähäkangas, & Markku Lahti. (2006). Ultra-Wideband Shielded Vertical Via Transitions from DC up to the V-Band. 476–479. 13 indexed citations
19.
Kangasvieri, T., et al.. (2005). High performance vertical interconnections for millimeter-wave multichip modules. 2005 European Microwave Conference. 4 pp.–4 pp.. 5 indexed citations
20.
Jantunen, Heli, T. Kangasvieri, Jouko Vähäkangas, & S. Leppävuori. (2003). Design aspects of microwave components with LTCC technique. Journal of the European Ceramic Society. 23(14). 2541–2548. 104 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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