D. Restaino

438 total citations
11 papers, 175 citations indexed

About

D. Restaino is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, D. Restaino has authored 11 papers receiving a total of 175 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electronic, Optical and Magnetic Materials, 7 papers in Electrical and Electronic Engineering and 2 papers in Mechanics of Materials. Recurrent topics in D. Restaino's work include Copper Interconnects and Reliability (10 papers), Electronic Packaging and Soldering Technologies (5 papers) and Advanced Surface Polishing Techniques (2 papers). D. Restaino is often cited by papers focused on Copper Interconnects and Reliability (10 papers), Electronic Packaging and Soldering Technologies (5 papers) and Advanced Surface Polishing Techniques (2 papers). D. Restaino collaborates with scholars based in United States and Germany. D. Restaino's co-authors include J. Germán Rubino, Sharon L. Smith, R. Rosenberg, D. Canaperi, Soon‐Cheon Seo, Lynne Gignac, V. Patel, A. Grill, S. James Gates and D. Edelstein and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

D. Restaino

11 papers receiving 163 citations

Peers

D. Restaino
R. Schulz United States
Meike Hauschildt Germany
S. Luce United States
D. Badami United States
M. Shinosky United States
D. Louis France
A.H. Montree Netherlands
M. Gall United States
K. Motoyama United States
L. Prabhu United States
R. Schulz United States
D. Restaino
Citations per year, relative to D. Restaino D. Restaino (= 1×) peers R. Schulz

Countries citing papers authored by D. Restaino

Since Specialization
Citations

This map shows the geographic impact of D. Restaino's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Restaino with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Restaino more than expected).

Fields of papers citing papers by D. Restaino

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Restaino. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Restaino. The network helps show where D. Restaino may publish in the future.

Co-authorship network of co-authors of D. Restaino

This figure shows the co-authorship network connecting the top 25 collaborators of D. Restaino. A scholar is included among the top collaborators of D. Restaino based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Restaino. D. Restaino is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

11 of 11 papers shown
1.
Grill, A., S. James Gates, Christos Dimitrakopoulos, et al.. (2008). Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond. 94. 28–30. 5 indexed citations
2.
Grill, A., D. Edelstein, Michael A. Lane, et al.. (2008). Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps. Journal of Applied Physics. 103(5). 34 indexed citations
3.
Canaperi, D., L. Gignac, S. Kaldor, et al.. (2005). Electromigration Cu mass flow in Cu interconnections. Thin Solid Films. 504(1-2). 274–278. 27 indexed citations
4.
Hu, Chunhua, D. Canaperi, Lynne Gignac, et al.. (2004). Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects. 222–228. 37 indexed citations
5.
Hu, C.‐K., Lynne Gignac, R. Rosenberg, et al.. (2004). Atom motion of Cu and Co in Cu damascene lines with a CoWP cap. Applied Physics Letters. 84(24). 4986–4988. 35 indexed citations
6.
Shaw, T. M., et al.. (2004). Channel cracking in low-k films on patterned multi-layers. 29. 93–95. 5 indexed citations
7.
Xia, Li-Qun, et al.. (1999). High Temperature Subatmospheric Chemical Vapor Deposited Undoped Silicate Glass: A Solution for Next Generation Shallow Trench Isolation. Journal of The Electrochemical Society. 146(3). 1181–1185. 9 indexed citations
8.
Xia, Li-Qun, et al.. (1999). High Aspect Ratio Trench Filling Using Two‐Step Subatmospheric Chemical Vapor Deposited Borophosphosilicate Glass for <0.18 μm Device Application. Journal of The Electrochemical Society. 146(5). 1884–1888. 8 indexed citations
9.
Weber, Serge, et al.. (1998). Temperature dependence of the Al-fill processes for submicron-via structures. Thin Solid Films. 320(1). 63–66. 5 indexed citations
10.
Chiang, S., et al.. (1997). <title>Correlation between aluminum alloy sputtering target metallurgical characteristics, arc initiation, and in-film defect intensity</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3214. 42–47. 5 indexed citations
11.
Restaino, D., et al.. (1994). Recent advances in the application of collimated sputtering. Thin Solid Films. 247(1). 104–111. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by R. Schulz Breakdown of academic impact, for papers by Meike Hauschildt Breakdown of academic impact, for papers by S. Luce Breakdown of academic impact, for papers by D. Badami Breakdown of academic impact, for papers by M. Shinosky Breakdown of academic impact, for papers by D. Louis Breakdown of academic impact, for papers by A.H. Montree Breakdown of academic impact, for papers by M. Gall Breakdown of academic impact, for papers by K. Motoyama Breakdown of academic impact, for papers by L. Prabhu
Rankless by CCL
2026