C. Hennesthal

500 total citations
16 papers, 393 citations indexed

About

C. Hennesthal is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, C. Hennesthal has authored 16 papers receiving a total of 393 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 4 papers in Biomedical Engineering. Recurrent topics in C. Hennesthal's work include Copper Interconnects and Reliability (12 papers), Electronic Packaging and Soldering Technologies (11 papers) and Semiconductor materials and devices (8 papers). C. Hennesthal is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Electronic Packaging and Soldering Technologies (11 papers) and Semiconductor materials and devices (8 papers). C. Hennesthal collaborates with scholars based in Germany and United States. C. Hennesthal's co-authors include Claudia Steinem, Oliver Aubel, Siegfried Steltenkamp, Andreas Janshoff, Markus Deserno, Martin Müller, Ehrenfried Zschech, Meike Hauschildt, Paul S. Ho and G. Talut and has published in prestigious journals such as Journal of the American Chemical Society, Applied Physics Letters and Biophysical Journal.

In The Last Decade

C. Hennesthal

16 papers receiving 381 citations

Peers

Countries citing papers authored by C. Hennesthal

Since Specialization

Citations

This map shows the geographic impact of C. Hennesthal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Hennesthal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Hennesthal more than expected).

Fields of papers citing papers by C. Hennesthal

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Hennesthal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Hennesthal. The network helps show where C. Hennesthal may publish in the future.

Co-authorship network of co-authors of C. Hennesthal

This figure shows the co-authorship network connecting the top 25 collaborators of C. Hennesthal. A scholar is included among the top collaborators of C. Hennesthal based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Hennesthal. C. Hennesthal is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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16 of 16 papers shown

#	Work	Indexed citations
1	Measuring the wafer temperature in CVD tools using the wireless SensArray HighTemp-400 wafer 2017 ·(unknown), Dinh‐Toi Chu, (unknown), (unknown), C. Hennesthal, (unknown), (unknown), (unknown)	6
2	Electromigration void nucleation and growth analysis using large-scale early failure statistics 2014 ·AIP conference proceedings ·Meike Hauschildt, M. Gall, C. Hennesthal, G. Talut, Oliver Aubel, (unknown), Ehrenfried Zschech	6
3	Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects 2013 ·Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Meike Hauschildt, C. Hennesthal, G. Talut, Oliver Aubel, M. Gall, (unknown), Ehrenfried Zschech	46
4	Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects 2013 ·Applied Physics Letters ·(unknown), K. J. Ganesh, Lijuan Zhang, Oliver Aubel, C. Hennesthal, Meike Hauschildt, Paulo J. Ferreira, Paul S. Ho	35
5	Analysis of grain structure by precession electron diffraction and effects on electromigration reliability of Cu interconnects 2012 ·Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·(unknown), K. J. Ganesh, (unknown), Oliver Aubel, C. Hennesthal, Ehrenfried Zschech, Paulo J. Ferreira, Paul S. Ho	3
6	Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond 2011 ·Japanese Journal of Applied Physics ·Oliver Aubel, C. Hennesthal, Meike Hauschildt, (unknown), (unknown), Juergen Boemmels, (unknown), Robert Seidel	1
7	Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping 2011 ·Journal of materials research/Pratt's guide to venture capital sources ·Lijuan Zhang, Paul S. Ho, Oliver Aubel, C. Hennesthal, Ehrenfried Zschech	5
8	Backend-of-line reliability improvement options for 28nm node technologies and beyond 2011 ·Oliver Aubel, C. Hennesthal, Meike Hauschildt, (unknown), (unknown), G. Talut, M. Gall, (unknown), Juergen Boemmels, (unknown), Robert Seidel	4
9	Copper–dielectric cap interface with enhanced reliability for 45 nm technology and beyond 2010 ·Microelectronic Engineering ·(unknown), U. Mayer, (unknown), (unknown), Oliver Aubel, C. Hennesthal	4
10	Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation 2010 ·AIP conference proceedings ·(unknown), (unknown), Oliver Aubel, C. Hennesthal, Ehrenfried Zschech, Paul S. Ho, Shinichi Ogawa	14
11	Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node 2010 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·(unknown), (unknown), Jay Im, Paul S. Ho, Oliver Aubel, C. Hennesthal, Ehrenfried Zschech	15
12	Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects 2010 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·(unknown), (unknown), Oliver Aubel, C. Hennesthal, Jay Im, Ehrenfried Zschech, Paul S. Ho	5
13	Process options for improving electromigration performance in 32nm technology and beyond 2009 ·Oliver Aubel, (unknown), (unknown), C. Hennesthal, U. Mayer, Axel Preuße, (unknown), (unknown), Juergen Boemmels, Stephanie Wehner	4
14	Mechanical Properties of Pore-Spanning Lipid Bilayers Probed by Atomic Force Microscopy 2006 ·Biophysical Journal ·Siegfried Steltenkamp, Martin Müller, Markus Deserno, C. Hennesthal, Claudia Steinem, Andreas Janshoff	105
15	Membrane-Suspended Nanocompartments Based on Ordered Pores in Alumina 2002 ·ChemPhysChem ·C. Hennesthal, (unknown), Claudia Steinem	69
16	Pore-Spanning Lipid Bilayers Visualized by Scanning Force Microscopy 2000 ·Journal of the American Chemical Society ·C. Hennesthal, Claudia Steinem	71

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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