Sungjun Im
- Hardware and Architecture top 10%
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- 3D IC and TSV technologies 3
- Silicon Carbide Semiconductor Technologies 2
- Advancements in Semiconductor Devices and Circuit Design 2
- Semiconductor materials and devices 2
- Electronic Packaging and Soldering Technologies 2
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- Heat Transfer and Optimization 2
- Heat Transfer and Boiling Studies 2
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- Copper Interconnects and Reliability 3
- Co-authors
- Kaustav BanerjeeKenneth E. GoodsonJae-Mo KooLinan JiangNavin SrivastavaKrishnarjun BanerjeeEvelyn N. WangEun Seok Cho
- Journals
- Journal of Heat Transfer (1 paper)
- Partner nations
- United StatesSouth Korea
In The Last Decade
Sungjun Im
7 papers receiving 356 citations
Peers
Comparison fields: 5 of 24
- Hardware and Architecture 39
- Electrical and Electronic Engineering 288
- Mechanical Engineering 146
- Automotive Engineering 24
- Computer Networks and Communications 36
Countries citing papers authored by Sungjun Im
This map shows the geographic impact of Sungjun Im's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sungjun Im with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sungjun Im more than expected).
Fields of papers citing papers by Sungjun Im
This network shows the impact of papers produced by Sungjun Im. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sungjun Im. The network helps show where Sungjun Im may publish in the future.
Co-authorship network
The 13 scholars most cited alongside Sungjun Im, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 5 | |
| 2 | 2005 | 192 | |
| 3 | Interconnect Modeling and Analysis in the Nanometer Era: Cu and Beyond | 2005 | 12 |
| 4 | 2003 | 4 | |
| 5 | 2003 | 10 | |
| 6 | 2002 | 152 | |
| 7 | 2002 | 5 |
About Sungjun Im
Sungjun Im is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanical Engineering, having authored 7 papers that have together received 380 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (3 papers), 3D IC and TSV technologies (3 papers), Heat Transfer and Optimization (2 papers), Heat Transfer and Boiling Studies (2 papers), Silicon Carbide Semiconductor Technologies (2 papers), Advancements in Semiconductor Devices and Circuit Design (2 papers), Semiconductor materials and devices (2 papers) and Electronic Packaging and Soldering Technologies (2 papers). The work is most often cited by research in Hardware and Architecture (39 citations), Electrical and Electronic Engineering (288 citations) and Mechanical Engineering (146 citations). Sungjun Im has collaborated with scholars based in United States and South Korea. Frequent co-authors include Kaustav Banerjee, Kenneth E. Goodson, Jae-Mo Koo, Linan Jiang, Navin Srivastava, Krishnarjun Banerjee, Evelyn N. Wang, Eun Seok Cho, David S. Campion and Thomas W. Kenny. Their work appears in journals such as Journal of Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.