M. Roellig

769 total citations
89 papers, 592 citations indexed

About

M. Roellig is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, M. Roellig has authored 89 papers receiving a total of 592 indexed citations (citations by other indexed papers that have themselves been cited), including 74 papers in Electrical and Electronic Engineering, 44 papers in Mechanical Engineering and 26 papers in Mechanics of Materials. Recurrent topics in M. Roellig's work include Electronic Packaging and Soldering Technologies (67 papers), 3D IC and TSV technologies (35 papers) and Advanced Welding Techniques Analysis (10 papers). M. Roellig is often cited by papers focused on Electronic Packaging and Soldering Technologies (67 papers), 3D IC and TSV technologies (35 papers) and Advanced Welding Techniques Analysis (10 papers). M. Roellig collaborates with scholars based in Germany, United States and Brazil. M. Roellig's co-authors include Steffen Wiese, Karsten Meier, Klaus‐Jürgen Wolter, K.-J. Wolter, Klaus-Juergen Wolter, Stefan Muench, Andreas Schießl, Norbert Meyendorf, R. Dudek and Malgorzata Kopycinska‐Müller and has published in prestigious journals such as SHILAP Revista de lepidopterología, Ultramicroscopy and Experimental Mechanics.

In The Last Decade

M. Roellig

86 papers receiving 579 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. Roellig Germany 13 483 287 129 77 71 89 592
Darvin Edwards United States 15 781 1.6× 424 1.5× 159 1.2× 77 1.0× 134 1.9× 35 991
Tz-Cheng Chiu Taiwan 13 907 1.9× 435 1.5× 316 2.4× 100 1.3× 98 1.4× 67 1.2k
Pearl Agyakwa United Kingdom 15 970 2.0× 648 2.3× 98 0.8× 121 1.6× 21 0.3× 39 1.1k
Yi-Hsin Pao United States 10 594 1.2× 315 1.1× 244 1.9× 70 0.9× 20 0.3× 18 679
Douglas C. Hopkins United States 23 1.5k 3.0× 280 1.0× 111 0.9× 37 0.5× 48 0.7× 116 1.6k
R. Sidhu United States 16 575 1.2× 662 2.3× 239 1.9× 155 2.0× 46 0.6× 27 937
J.F.J.M. Caers Netherlands 18 665 1.4× 291 1.0× 202 1.6× 53 0.7× 42 0.6× 67 748
Jao-Hwa Kuang Taiwan 17 409 0.8× 285 1.0× 145 1.1× 20 0.3× 95 1.3× 67 774
T.H. Low Singapore 12 754 1.6× 436 1.5× 123 1.0× 145 1.9× 59 0.8× 18 796
Riet Labie Belgium 18 1.1k 2.3× 273 1.0× 65 0.5× 42 0.5× 165 2.3× 58 1.2k

Countries citing papers authored by M. Roellig

Since Specialization
Citations

This map shows the geographic impact of M. Roellig's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Roellig with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Roellig more than expected).

Fields of papers citing papers by M. Roellig

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Roellig. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Roellig. The network helps show where M. Roellig may publish in the future.

Co-authorship network of co-authors of M. Roellig

This figure shows the co-authorship network connecting the top 25 collaborators of M. Roellig. A scholar is included among the top collaborators of M. Roellig based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Roellig. M. Roellig is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Roellig, M., et al.. (2023). FEM Modelling of Ag-Sinter Joints with Respect of Porosity and Sinter Pressure. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–8. 1 indexed citations
2.
Roellig, M., et al.. (2020). FEM-study for Solder Model Comparison on Solder Joints Stress-Strain Effects. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 3 indexed citations
3.
Muench, Stefan, Daniel Balzani, M. Roellig, & Eberhard Spoerl. (2017). Method for the Development of Realistic Boundary Conditions for the Simulation of Non‐Contact Tonometry. PAMM. 17(1). 207–208. 2 indexed citations
4.
Meyendorf, Norbert, Martin Oppermann, Paul S. Krueger, M. Roellig, & K.-J. Wolter. (2016). NDE applications in microelectronic industries. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9806. 98060V–98060V. 1 indexed citations
5.
Roellig, M., et al.. (2014). Reliability assessment of discrete passive components embedded into PCB core. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–7. 7 indexed citations
6.
Meier, Karsten, M. Roellig, Andreas Schießl, & Klaus-Juergen Wolter. (2014). Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–7. 16 indexed citations
7.
Roellig, M., et al.. (2013). Reliability of embedding concepts for discrete passive components in organic circuit boards. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1243–1251. 4 indexed citations
8.
Meier, Karsten, et al.. (2013). Lifetime assessment for bipolar components under vibration and temperature loading. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–7. 7 indexed citations
9.
Roellig, M., et al.. (2011). Detection of buried reference structures by use of atomic force acoustic microscopy. Ultramicroscopy. 111(8). 1405–1416. 39 indexed citations
10.
Rodrigues, Geovani, et al.. (2011). Study of constant rate and constant force low cycle fatigue methods for solder characterization. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1/6–6/6.
11.
Roellig, M., et al.. (2010). Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 13. 1–11. 11 indexed citations
12.
Meier, Karsten, M. Roellig, Steffen Wiese, & K.-J. Wolter. (2010). Characterisation of the mechanical behaviour of SAC solder at high strain rates. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
13.
Roellig, M., et al.. (2009). A novel thermo-mechanical test method of fatigue characterization of real solder joints. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 3 indexed citations
14.
Heuer, Henning, et al.. (2009). Thin film characterization using high frequency eddy current spectroscopy. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 165–168. 4 indexed citations
15.
Meier, Karsten, M. Roellig, Steffen Wiese, & K.-J. Wolter. (2009). Combining experimental and simulation methods for the mechanical characterisation of lead free solder alloys under high strain rate loads. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 48. 1–7. 4 indexed citations
16.
Wiese, Steffen, et al.. (2007). The Size Effect on the Creep Properties of SnAgCu-Solder Alloys. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 548–557. 9 indexed citations
17.
Wiese, Steffen, et al.. (2007). The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties. 1–8. 2 indexed citations
18.
19.
Roellig, M., R. Dudek, Steffen Wiese, et al.. (2005). Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 86–90. 2 indexed citations
20.
Pinel, S., Sudipto Chakraborty, M. Roellig, et al.. (2003). 3D integrated LTCC module using μBGA technology for compact C-band RF front-end module. 3. 1553–1556. 26 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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