Yi-Hsin Pao
-
- Electronic Packaging and Soldering Technologies 14
- 3D IC and TSV technologies 4
- Mechanics of Materials top 5%
- Fatigue and fracture mechanics 6
- Numerical methods in engineering 3
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties 4
- High Temperature Alloys and Creep 2
- General Materials Science top 10%
-
- Aluminum Alloy Microstructure Properties 2
-
- Structural Analysis and Optimization 2
- Co-authors
- John H. LauTsung‐Yu PanR. K. GovilaXiaowu ZhangS. W. Ricky LeeZhenfeng GuoH. ConradSheng Liu
- Journals
- Journal of Electronic Materials (1 paper)Journal of Adhesion Science and Technology (1 paper)Journal of Electronic Packaging (10 papers)
- Partner nations
- United StatesHong KongSingapore
In The Last Decade
Yi-Hsin Pao
17 papers receiving 606 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 594
- Mechanics of Materials 244
- Mechanical Engineering 315
- General Materials Science 13
- Aerospace Engineering 70
Countries citing papers authored by Yi-Hsin Pao
This map shows the geographic impact of Yi-Hsin Pao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Hsin Pao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Hsin Pao more than expected).
Fields of papers citing papers by Yi-Hsin Pao
This network shows the impact of papers produced by Yi-Hsin Pao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Hsin Pao. The network helps show where Yi-Hsin Pao may publish in the future.
Co-authorship network
The 16 scholars most cited alongside Yi-Hsin Pao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 0 | |
| 2 | 2002 | 3 | |
| 3 | 1999 | 34 | |
| 4 | 1997 | 8 | |
| 5 | Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies | 1996 | 373 |
| 6 | 1995 | 19 | |
| 7 | 1995 | 13 | |
| 8 | 1995 | 21 | |
| 9 | 1993 | 37 | |
| 10 | 1992 | 19 | |
| 11 | 1992 | 6 | |
| 12 | 1991 | 85 | |
| 13 | 1991 | 21 | |
| 14 | 1991 | 1 | |
| 15 | 1990 | 4 | |
| 16 | 1990 | 7 | |
| 17 | 1990 | 27 | |
| 18 | 1990 | 1 |
About Yi-Hsin Pao
Yi-Hsin Pao is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Mechanical Engineering, having authored 18 papers that have together received 679 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (14 papers), Fatigue and fracture mechanics (6 papers), 3D IC and TSV technologies (4 papers), Aluminum Alloys Composites Properties (4 papers), Numerical methods in engineering (3 papers), Aluminum Alloy Microstructure Properties (2 papers), Structural Analysis and Optimization (2 papers) and High Temperature Alloys and Creep (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (594 citations), Mechanics of Materials (244 citations) and Mechanical Engineering (315 citations). Yi-Hsin Pao has collaborated with scholars based in United States, Hong Kong and Singapore. Frequent co-authors include John H. Lau, Tsung‐Yu Pan, R. K. Govila, Xiaowu Zhang, S. W. Ricky Lee, Zhenfeng Guo, H. Conrad, Sheng Liu, Jiuyi Zhu and B. E. Artz. Their work appears in journals such as Journal of Electronic Materials, Journal of Adhesion Science and Technology and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.