Yi-Hsin Pao

826 total citations
18 papers, 679 citations indexed

About

Yi-Hsin Pao is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Yi-Hsin Pao has authored 18 papers receiving a total of 679 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 9 papers in Mechanics of Materials and 7 papers in Mechanical Engineering. Recurrent topics in Yi-Hsin Pao's work include Electronic Packaging and Soldering Technologies (14 papers), Fatigue and fracture mechanics (6 papers) and 3D IC and TSV technologies (4 papers). Yi-Hsin Pao is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), Fatigue and fracture mechanics (6 papers) and 3D IC and TSV technologies (4 papers). Yi-Hsin Pao collaborates with scholars based in United States, Hong Kong and Singapore. Yi-Hsin Pao's co-authors include John H. Lau, Tsung‐Yu Pan, R. K. Govila, Xiaowu Zhang, S. W. Ricky Lee, Zhenfeng Guo, H. Conrad, Sheng Liu, Jiuyi Zhu and B. E. Artz and has published in prestigious journals such as Journal of Electronic Materials, Journal of Adhesion Science and Technology and Journal of Electronic Packaging.

In The Last Decade

Yi-Hsin Pao

17 papers receiving 606 citations

Peers

Yi-Hsin Pao

EEE

J.F.J.M. Caers Netherlands

W. Engelmaier United States

Masazumi Amagai United States

T.H. Low Singapore

B.S. Xiong Singapore

Chang-Lin Yeh Taiwan

A. Nishimura Japan

Sueo KAWAI Japan

Scott Irving United States

Munshi Basit United States

J.F.J.M. Caers Netherlands

Yi-Hsin Pao

665 ×1.1

EEE

291 ×0.9

202 ×0.8

53 ×0.8

90 ×2.2

Citations per year, relative to Yi-Hsin Pao Yi-Hsin Pao (= 1×) peers J.F.J.M. Caers

Countries citing papers authored by Yi-Hsin Pao

Since Specialization

Citations

This map shows the geographic impact of Yi-Hsin Pao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Hsin Pao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Hsin Pao more than expected).

Fields of papers citing papers by Yi-Hsin Pao

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yi-Hsin Pao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Hsin Pao. The network helps show where Yi-Hsin Pao may publish in the future.

Co-authorship network of co-authors of Yi-Hsin Pao

This figure shows the co-authorship network connecting the top 25 collaborators of Yi-Hsin Pao. A scholar is included among the top collaborators of Yi-Hsin Pao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yi-Hsin Pao. Yi-Hsin Pao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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18 of 18 papers shown

Lau, John H., et al.. (2005). No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP). 13. 305–315.

Lau, John H., et al.. (2002). Reliability of 0.4 mm pitch, 256-pin plastic quad flat pack no-clean and water-clean solder joints. 19. 39–53. 3 indexed citations

Zhang, Xiaowu, S. W. Ricky Lee, & Yi-Hsin Pao. (1999). A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints. Journal of Electronic Packaging. 122(3). 200–206. 34 indexed citations

Pao, Yi-Hsin, et al.. (1997). Fatigue-creep crack propagation path in solder joints under thermal cycling. Journal of Electronic Materials. 26(9). 1058–1064. 8 indexed citations

Lau, John H. & Yi-Hsin Pao. (1996). Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. Medical Entomology and Zoology. 373 indexed citations

Liu, Sheng, et al.. (1995). Investigation of crack propagation in ceramic/conductive epoxy/glass systems. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 18(3). 627–633. 19 indexed citations

Pao, Yi-Hsin, et al.. (1995). Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints. Journal of Electronic Packaging. 117(2). 94–99. 13 indexed citations

Guo, Zhenfeng, Yi-Hsin Pao, & H. Conrad. (1995). Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints. Journal of Electronic Packaging. 117(2). 100–104. 21 indexed citations

Pao, Yi-Hsin, et al.. (1993). An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints. Journal of Electronic Packaging. 115(1). 1–8. 37 indexed citations

10.

Pao, Yi-Hsin, et al.. (1992). Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling. Journal of Electronic Packaging. 114(2). 135–144. 19 indexed citations

11.

Pao, Yi-Hsin, et al.. (1992). A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS. Journal of Electronic Packaging. 114(4). 470–472. 6 indexed citations

12.

Pao, Yi-Hsin, et al.. (1991). Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading. Journal of Electronic Packaging. 113(2). 164–172. 85 indexed citations

13.

Pao, Yi-Hsin, et al.. (1991). A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling. MRS Proceedings. 226. 21 indexed citations

14.

Engel, Peter A., et al.. (1991). Special Issue on Mechanics of Surface Mount Assemblies. Journal of Electronic Packaging. 113(2). 91–91. 1 indexed citations

15.

Pao, Yi-Hsin, Kenneth N. Morman, & Ray A. Dickie. (1990). On the effect of an interfacial layer on the fracture behavior of interface and subinterface cracks in single-lap shear joints. Journal of Adhesion Science and Technology. 4(1). 503–520. 4 indexed citations

16.

Pao, Yi-Hsin & Tsung‐Yu Pan. (1990). Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems. Journal of Electronic Packaging. 112(2). 154–161. 7 indexed citations

17.

Pan, Tsung‐Yu & Yi-Hsin Pao. (1990). Deformation in Multilayer Stacked Assemblies. Journal of Electronic Packaging. 112(1). 30–34. 27 indexed citations

18.

Pao, Yi-Hsin. (1990). A Fracture Mechanics Approach to Thermal Fatigue Life Prediction of Solder Joints. MRS Proceedings. 203. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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