J.F.J.M. Caers

968 total citations
67 papers, 748 citations indexed

About

J.F.J.M. Caers is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, J.F.J.M. Caers has authored 67 papers receiving a total of 748 indexed citations (citations by other indexed papers that have themselves been cited), including 62 papers in Electrical and Electronic Engineering, 23 papers in Mechanics of Materials and 16 papers in Mechanical Engineering. Recurrent topics in J.F.J.M. Caers's work include Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (45 papers) and Mechanical Behavior of Composites (14 papers). J.F.J.M. Caers is often cited by papers focused on Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (45 papers) and Mechanical Behavior of Composites (14 papers). J.F.J.M. Caers collaborates with scholars based in Netherlands, United States and Finland. J.F.J.M. Caers's co-authors include E.H. Wong, Xiujuan Zhao, S.K.W. Seah, W.D. van Driel, Abhijit Dasgupta, Y. S. Lai, M. Leoni, Cheryl Selvanayagam, R. Rajoo and Chang-Lin Yeh and has published in prestigious journals such as Materials Science and Engineering A, Materials Letters and International Journal of Fatigue.

In The Last Decade

J.F.J.M. Caers

64 papers receiving 715 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J.F.J.M. Caers Netherlands 18 665 291 202 90 53 67 748
Olaf Wittler Germany 13 468 0.7× 151 0.5× 150 0.7× 57 0.6× 17 0.3× 97 598
David Gustafsson Sweden 17 452 0.7× 566 1.9× 431 2.1× 144 1.6× 78 1.5× 57 1.0k
Yi-Hsin Pao United States 10 594 0.9× 315 1.1× 244 1.2× 41 0.5× 70 1.3× 18 679
A. Nishimura Japan 16 540 0.8× 109 0.4× 278 1.4× 47 0.5× 18 0.3× 52 610
Paul G. Harris United Kingdom 11 267 0.4× 157 0.5× 88 0.4× 64 0.7× 124 2.3× 21 444
Masazumi Amagai United States 9 508 0.8× 315 1.1× 147 0.7× 35 0.4× 72 1.4× 29 549
E. Meusel Germany 12 561 0.8× 271 0.9× 112 0.6× 36 0.4× 74 1.4× 26 594
H. Frémont France 12 365 0.5× 129 0.4× 73 0.4× 33 0.4× 42 0.8× 68 424
Changsoo Jang United States 12 273 0.4× 107 0.4× 133 0.7× 32 0.4× 12 0.2× 37 384
Soonwan Chung South Korea 9 262 0.4× 112 0.4× 143 0.7× 26 0.3× 16 0.3× 30 366

Countries citing papers authored by J.F.J.M. Caers

Since Specialization
Citations

This map shows the geographic impact of J.F.J.M. Caers's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.F.J.M. Caers with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.F.J.M. Caers more than expected).

Fields of papers citing papers by J.F.J.M. Caers

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.F.J.M. Caers. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.F.J.M. Caers. The network helps show where J.F.J.M. Caers may publish in the future.

Co-authorship network of co-authors of J.F.J.M. Caers

This figure shows the co-authorship network connecting the top 25 collaborators of J.F.J.M. Caers. A scholar is included among the top collaborators of J.F.J.M. Caers based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.F.J.M. Caers. J.F.J.M. Caers is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhong, Ying, Chunqing Wang, Xiujuan Zhao, & J.F.J.M. Caers. (2015). The influence of high melting point elements on the reliability of solder during thermal shocks. 90. 2162–2167. 1 indexed citations
2.
Zhong, Ying, Wei Liu, Chunqing Wang, Xiujuan Zhao, & J.F.J.M. Caers. (2015). The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling. Materials Science and Engineering A. 652. 264–270. 33 indexed citations
3.
Solares, Santiago D., et al.. (2014). Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects. Journal of Adhesion Science and Technology. 28(12). 1167–1191. 3 indexed citations
4.
Zhao, Xiujuan, et al.. (2012). Potential interconnect technologies for high power LEDs assemblies. 1–8. 6 indexed citations
5.
Zhou, Yi, et al.. (2010). Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs. Microelectronics Reliability. 50(7). 937–947. 8 indexed citations
6.
Solares, Santiago D., et al.. (2009). Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects. 253. 67–73. 1 indexed citations
7.
Wong, E.H., Cheryl Selvanayagam, S.K.W. Seah, et al.. (2008). Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling. Journal of Electronic Materials. 37(6). 829–836. 64 indexed citations
8.
Caers, J.F.J.M., et al.. (2008). HART: A new highly accelerated robustness test for conductive adhesive interconnects. 1695–1699. 2 indexed citations
9.
Seah, S.K.W., E.H. Wong, Cheryl Selvanayagam, et al.. (2008). A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests. 1102–1107. 2 indexed citations
10.
Croes, Kristof, et al.. (2007). Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives. Document Server@UHasselt (UHasselt). 1 indexed citations
11.
Selvanayagam, Cheryl, E.H. Wong, S.K.W. Seah, et al.. (2007). Constitutive Properties of Bulk Solder at `Drop-Impact' Strain Rates. 8. 360–364. 2 indexed citations
12.
Zhao, Xiujuan, J.F.J.M. Caers, J.W.C. de Vries, et al.. (2006). Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps. 174–178. 18 indexed citations
13.
Caers, J.F.J.M., et al.. (2004). Towards a predictive behavior of non-conductive adhesive interconnects in moisture environment. 3. 106–112. 15 indexed citations
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16.
Caers, J.F.J.M., J.W.C. de Vries, Xiujuan Zhao, & E.H. Wong. (2003). Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections. JSTS Journal of Semiconductor Technology and Science. 3(3). 122–131. 12 indexed citations
17.
Zhao, Xiujuan, G. Q. Zhang, J.F.J.M. Caers, & L.J. Ernst. (2003). Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion. Journal of Electronic Packaging. 125(4). 582–588. 2 indexed citations
18.
Yang, Daoguo, G.Q. Zhang, L.J. Ernst, et al.. (2003). Investigation on flip chip solder joint fatigue with cure-dependent underfill properties. IEEE Transactions on Components and Packaging Technologies. 26(2). 388–398. 19 indexed citations
19.
Dasgupta, Abhijit, et al.. (2002). Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects. Journal of Electronic Packaging. 124(3). 184–187. 10 indexed citations
20.
Caers, J.F.J.M., et al.. (1995). Flip-Chip Mounting of an RF IC using Eutectic Solder Bumps. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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