T.H. Low

1.0k total citations
18 papers, 796 citations indexed

About

T.H. Low is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, T.H. Low has authored 18 papers receiving a total of 796 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. Recurrent topics in T.H. Low's work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). T.H. Low is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). T.H. Low collaborates with scholars based in Singapore. T.H. Low's co-authors include J.H.L. Pang, B.S. Xiong, Desmond Y. R. Chong, Luhua Xu, K. H. Prakash, Fa Xing, Luhua Xu, William Lee, Anders Yeo and G.H. Lim and has published in prestigious journals such as Thin Solid Films and IEEE Transactions on Components and Packaging Technologies.

In The Last Decade

T.H. Low

18 papers receiving 756 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
T.H. Low Singapore 12 754 436 145 123 59 18 796
Masazumi Amagai United States 9 508 0.7× 315 0.7× 72 0.5× 147 1.2× 24 0.4× 29 549
Yi-Hsin Pao United States 10 594 0.8× 315 0.7× 70 0.5× 244 2.0× 20 0.3× 18 679
W. Engelmaier United States 11 577 0.8× 289 0.7× 56 0.4× 196 1.6× 18 0.3× 20 656
J.F.J.M. Caers Netherlands 18 665 0.9× 291 0.7× 53 0.4× 202 1.6× 42 0.7× 67 748
B.S. Xiong Singapore 13 643 0.9× 387 0.9× 117 0.8× 114 0.9× 26 0.4× 16 661
Munshi Basit United States 11 380 0.5× 268 0.6× 145 1.0× 95 0.8× 15 0.3× 20 475
Chang-Lin Yeh Taiwan 20 996 1.3× 382 0.9× 36 0.2× 305 2.5× 42 0.7× 67 1.1k
Paresh Limaye Belgium 13 480 0.6× 177 0.4× 41 0.3× 64 0.5× 44 0.7× 30 523
Huan Li China 15 188 0.2× 539 1.2× 96 0.7× 91 0.7× 21 0.4× 51 770

Countries citing papers authored by T.H. Low

Since Specialization
Citations

This map shows the geographic impact of T.H. Low's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.H. Low with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.H. Low more than expected).

Fields of papers citing papers by T.H. Low

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T.H. Low. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.H. Low. The network helps show where T.H. Low may publish in the future.

Co-authorship network of co-authors of T.H. Low

This figure shows the co-authorship network connecting the top 25 collaborators of T.H. Low. A scholar is included among the top collaborators of T.H. Low based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T.H. Low. T.H. Low is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

18 of 18 papers shown
1.
Xing, Fa, et al.. (2005). Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies. 2. 916–921. 25 indexed citations
2.
Xu, Luhua, J.H.L. Pang, K. H. Prakash, & T.H. Low. (2005). Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface. IEEE Transactions on Components and Packaging Technologies. 28(3). 408–414. 88 indexed citations
3.
Pang, J.H.L., B.S. Xiong, & T.H. Low. (2004). Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder. 1333–1337. 75 indexed citations
4.
Chong, Desmond Y. R., et al.. (2004). Mechanical characterization in failure strength of silicon dice. 203–210. 45 indexed citations
5.
Pang, J.H.L., K. H. Prakash, & T.H. Low. (2004). Isothermal and thermal cycling aging on IMC growth rate in Pb-free and Pb-based solder interfaces. 10. 109–115. 10 indexed citations
6.
Pang, J.H.L., B.S. Xiong, & T.H. Low. (2004). Low cycle fatigue models for lead-free solders. Thin Solid Films. 462-463. 408–412. 94 indexed citations
7.
Pang, J.H.L., et al.. (2004). Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength. Thin Solid Films. 462-463. 370–375. 170 indexed citations
8.
Xing, Fa, et al.. (2004). Modeling thermo-mechanical reliability of bumpless flip chip package. 421–426. 10 indexed citations
9.
Pang, J.H.L., Anders Yeo, T.H. Low, & Fa Xing. (2004). Lead-free 96.5Sn-3.5Ag flip chip solder joint reliability analysis. 160–164. 10 indexed citations
10.
Pang, J.H.L., T.H. Low, B.S. Xiong, & Fa Xing. (2004). Design for reliability (DFR) methodology for electronic packaging assemblies. 470–478. 26 indexed citations
11.
Low, T.H. & J.H.L. Pang. (2004). Modeling plated copper interconnections in a bumpless flip chip package. 695. 791–796. 11 indexed citations
12.
Pang, J.H.L., Fa Xing, & T.H. Low. (2004). Vibration fatigue analysis for FCOB solder joints. 1055–1061. 13 indexed citations
13.
Chong, Desmond Y. R., et al.. (2004). Mechanical failure strength characterization of silicon dice. 600–605. 10 indexed citations
14.
Pang, J.H.L., et al.. (2004). Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy. 673–679. 59 indexed citations
15.
Xing, Fa, et al.. (2004). Vibration fatigue test and analysis for flip chip solder joints. 12. 107–113. 15 indexed citations
16.
Pang, J.H.L., et al.. (2003). In-situ reliability analysis of solder joint by digital image correlation. 115–119. 1 indexed citations
17.
Pang, J.H.L. & T.H. Low. (2003). Modeling thermal cycling and thermal shock tests for FCOB. 987–992. 5 indexed citations
18.
Pang, J.H.L., Desmond Y. R. Chong, & T.H. Low. (2001). Thermal cycling analysis of flip-chip solder joint reliability. IEEE Transactions on Components and Packaging Technologies. 24(4). 705–712. 129 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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