Sa’d Hamasha

1.7k total citations
108 papers, 1.4k citations indexed

About

Sa’d Hamasha is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Sa’d Hamasha has authored 108 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 95 papers in Electrical and Electronic Engineering, 61 papers in Mechanical Engineering and 32 papers in Aerospace Engineering. Recurrent topics in Sa’d Hamasha's work include Electronic Packaging and Soldering Technologies (92 papers), Aluminum Alloy Microstructure Properties (32 papers) and Advanced Welding Techniques Analysis (31 papers). Sa’d Hamasha is often cited by papers focused on Electronic Packaging and Soldering Technologies (92 papers), Aluminum Alloy Microstructure Properties (32 papers) and Advanced Welding Techniques Analysis (31 papers). Sa’d Hamasha collaborates with scholars based in United States, Jordan and Algeria. Sa’d Hamasha's co-authors include Peter Børgesen, Pradeep Lall, Awni Qasaimeh, Jeffrey C. Suhling, Ali Alahmer, Mohammad M. Hamasha, Xin Wei, Haneen Ali, Luke Wentlent and Jeff Suhling and has published in prestigious journals such as PLoS ONE, Scientific Reports and Resources Conservation and Recycling.

In The Last Decade

Sa’d Hamasha

100 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sa’d Hamasha United States 22 1.3k 858 385 248 52 108 1.4k
Karel Dušek Czechia 15 592 0.5× 344 0.4× 55 0.1× 96 0.4× 95 1.8× 113 760
Abhishek Das United Kingdom 17 397 0.3× 846 1.0× 123 0.3× 110 0.4× 121 2.3× 47 1.1k
Lahouari Benabou France 16 375 0.3× 369 0.4× 67 0.2× 201 0.8× 126 2.4× 47 698
Sedat Karabay Türkiye 15 162 0.1× 604 0.7× 368 1.0× 120 0.5× 284 5.5× 36 719
Hongqun Tang China 15 139 0.1× 572 0.7× 211 0.5× 102 0.4× 218 4.2× 82 689
James D. Widmer United Kingdom 24 1.5k 1.2× 707 0.8× 45 0.1× 36 0.1× 48 0.9× 53 1.8k
Brian W. Grimsley United States 13 170 0.1× 410 0.5× 113 0.3× 222 0.9× 146 2.8× 44 783
Junjie Ye China 16 158 0.1× 173 0.2× 27 0.1× 191 0.8× 62 1.2× 45 621
Fengming Du China 14 75 0.1× 528 0.6× 202 0.5× 184 0.7× 127 2.4× 63 648

Countries citing papers authored by Sa’d Hamasha

Since Specialization
Citations

This map shows the geographic impact of Sa’d Hamasha's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sa’d Hamasha with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sa’d Hamasha more than expected).

Fields of papers citing papers by Sa’d Hamasha

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sa’d Hamasha. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sa’d Hamasha. The network helps show where Sa’d Hamasha may publish in the future.

Co-authorship network of co-authors of Sa’d Hamasha

This figure shows the co-authorship network connecting the top 25 collaborators of Sa’d Hamasha. A scholar is included among the top collaborators of Sa’d Hamasha based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sa’d Hamasha. Sa’d Hamasha is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Liu, Jia, et al.. (2025). Interpretable data-driven framework for life prediction of homogenous lead-free solder joints in ball grid array packages. Journal of Intelligent Manufacturing. 37(2). 659–677. 4 indexed citations
2.
3.
Hamasha, Mohammad M., et al.. (2025). A comprehensive framework for IoT-driven predictive maintenance: Leveraging AI and edge computing for enhanced equipment reliability. Istrazivanja i projektovanja za privredu. 23(3). 471–486.
4.
Hamasha, Sa’d, et al.. (2024). The impact of paste alloy, paste volume, and surface finish on solder joint. Microelectronics Reliability. 160. 115457–115457. 1 indexed citations
5.
Hamasha, Sa’d, et al.. (2024). Crack Development and Electrical Degradation in Chromium Thin Films Under Tensile Stress on PET Substrates. Coatings. 14(11). 1403–1403. 1 indexed citations
6.
Alahmer, Ali, et al.. (2024). Drop Shock Testing Analysis at Elevated Temperature: Assessing SAC305 Solder Alloy Reliability in BGA Assemblies. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(8). 1384–1393. 3 indexed citations
7.
Chen, Deng, Michael Osterman, Carol A. Handwerker, & Sa’d Hamasha. (2024). Criteria for Solder Alloy Adoption. 37(1). 2–7. 1 indexed citations
8.
9.
Alahmer, Ali, et al.. (2024). The Effect of Bi Content and Strain Rate on Tensile Properties of SnAgCu-Bi Alloys. 1–6. 1 indexed citations
10.
Alahmer, Ali, et al.. (2024). Drop Shock Test of PCB at Elevated Temperature. 1–6. 1 indexed citations
11.
Wang, Menghong, et al.. (2024). The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys. 26(1). 612–620. 1 indexed citations
12.
Hamasha, Sa’d, et al.. (2023). Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints. Scientific Reports. 13(1). 8585–8585. 7 indexed citations
13.
Hamasha, Sa’d, et al.. (2023). The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling. Journal of Electronic Materials. 53(1). 380–393. 17 indexed citations
14.
Hamasha, Sa’d, et al.. (2023). Effect of Bi content and aging on solder joint shear properties considering strain rate. Microelectronics Reliability. 146. 115020–115020. 14 indexed citations
15.
Hamasha, Sa’d, et al.. (2023). Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions. Materials. 16(2). 750–750. 12 indexed citations
16.
Hamasha, Mohammad M., et al.. (2023). Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints. Metals. 13(3). 591–591. 7 indexed citations
17.
Hamasha, Sa’d, et al.. (2023). Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model. Scientific Reports. 13(1). 2493–2493. 14 indexed citations
18.
Hamasha, Mohammad M., Haneen Ali, Sa’d Hamasha, & Abdulaziz Ahmed. (2022). Ultra-fine transformation of data for normality. Heliyon. 8(5). e09370–e09370. 17 indexed citations
19.
Hamasha, Mohammad M., et al.. (2022). Effect of Thermal Aging on the Mechanical Properties of SAC305. Materials. 15(8). 2816–2816. 12 indexed citations
20.
Wei, Xin, Jeff Suhling, Sa’d Hamasha, et al.. (2022). Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling. 1–8. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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